CN101730441B - 热管结合固定座的制法及其结构 - Google Patents

热管结合固定座的制法及其结构 Download PDF

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CN101730441B
CN101730441B CN2008101712421A CN200810171242A CN101730441B CN 101730441 B CN101730441 B CN 101730441B CN 2008101712421 A CN2008101712421 A CN 2008101712421A CN 200810171242 A CN200810171242 A CN 200810171242A CN 101730441 B CN101730441 B CN 101730441B
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heat pipes
pockets
fixed seat
medium
seat according
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CN101730441A (zh
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林国仁
林贞祥
王怀明
郑志鸿
许建财
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ZHENTONG ENERGY TECHNOLOGY Co Ltd
CpuMate Inc
Golden Sun News Techniques Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
    • B21D39/04—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of tubes with tubes; of tubes with rods
    • B21D39/048—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of tubes with tubes; of tubes with rods using presses for radially crimping tubular elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/06—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of metal tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49364—Tube joined to flat sheet longitudinally, i.e., tube sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49373—Tube joint and tube plate structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means

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  • Mechanical Engineering (AREA)
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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
  • Supports For Pipes And Cables (AREA)
  • Road Paving Structures (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明为一种热管结合固定座的制法及其结构，首先提供一具有容纳凹槽的固定座，容纳凹槽内设有至少一凹处，另提供多个热管，又于热管与容纳凹槽的接触面布设有一黏着介质，再将多个热管迫入容纳凹槽中，最后压掣容纳凹槽中并列的热管，使热管形成一与固定座表面共平面的平面，并使部分的黏着介质容置于凹处内。采用本发明的方法使热管与固定座结合后，热管可紧密地黏着于固定座的容纳凹槽中，维持热管的平面的平整度以保持其导热效率；此外，部分的黏着介质可容置于容纳凹槽中的凹处，故不需精密地控制黏着介质的供给量，多余的黏着介质不会溢流而污损热管或固定座的表面。

Description

热管结合固定座的制法及其结构
技术领域
本发明关于一种导热装置，尤指一种多个热管结合于固定座并形成有一平面的技术。
背景技术
由于热管(heat pipe)有高热传能力、重量轻及结构简单等特性，并具有不消耗电力及价格低廉等诸多优点，目前已广泛地应用于电子元件的导热，借助对电子发热元件进行热量的快速导离，以有效的解决现阶段的电子发热元件的热聚集现象。
请参阅图1，为现有热管与导热座(固定座)结合的示意图；导热座10a上各个通槽101a之间需形成有隔板102a，以使该些热管20a可间隔地排列设于导热座10a上；但是，该些隔板102a虽可使各热管20a分别容设于该些通槽101a内，却也使各热管20a的蒸发端201a平贴于发热元件时，减少了导热座10a上可置设的热管20a数量，进而降低热管20a的蒸发端201a与发热元件的接触面积，影响热管20a对发热元件的导热效率。
为克服上述现有技术的缺点，本发明人构思出一种将热管并列而结合于一固定座的方法与结构，如图2所示，提供底面11b具有容纳凹槽12b的一固定座10b以及至少二热管20b，再将该些热管20b置入该容纳凹槽12b中，最后对容纳凹槽12b中的热管20b进行机械加工，使其成型有一平面200b；这样，将热管20b并列且齐平地结合于固定座10b，可扩大热管与发热元件的接触面积。
但是，上述将热管并列结合于一固定座的结构，于实际使用上仍存在有未臻完善之处，由于该些热管以机械加工方法而强迫挤压入该固定座的容纳凹槽内，热管与固定座之间无黏着介质加以黏合固定，成品完成后，在运输过程中或在进行安全测试时，部分迫入于固定座内的热管易有松动或脱落的可能，使该些并列热管的平面失去了应有的平整度而降低导热效率，甚至无法使用，这实有必要进行改良。
发明内容
本发明的一目的，在于提供一种热管结合固定座的制法及其结构，可使热管紧密地黏着于固定座的容纳凹槽中。
本发明的另一目的，在于提供一种热管结合固定座的制法及其结构，借助容纳凹槽内设有至少一凹处，可让部分的黏着介质容置于该处，故不需精密地控制黏着介质的供给量，可使多余的黏着介质不会溢流而污损热管或固定座的表面。
为了实现上述的目的，本发明提供一种热管结合固定座的制法，首先提供一具有容纳凹槽的固定座，容纳凹槽内设有至少一凹处，另提供多个热管，又于热管与容纳凹槽的接触面布设有一黏着介质，再将多个热管迫入容纳凹槽中，最后压掣容纳凹槽中并列的热管，使热管形成一与固定座表面共平面的平面，并使部分的黏着介质容置于凹处内。
为了实现上述的目的，本发明另提供一种热管结合固定座的结构，包括底面具有容纳凹槽的固定座及至少二热管，固定座的容纳凹槽中设有至少一凹处，并迫入多个并列的热管，热管表面经压掣而形成一与固定座表面共平面的平面；其中，热管与容纳凹槽的接触面上布设有黏着介质，而部分的黏着介质容置于该凹处。
本发明的有益效果在于：本发明借助在热管与容纳凹槽的接触面附着有黏着介质，以使热管可紧密地黏着于固定座的容纳凹槽中，维持热管的平面的平整度以保持其导热效率；此外，部分的黏着介质可容置于容纳凹槽中的凹处，故不需精密地控制黏着介质的供给量，多余的黏着介质不会溢流而污损热管或固定座的表面。
附图说明
图1为现有技术热管与导热座的结合示意图；
图2为热管结合固定座的立体外观示意图；
图3A为本发明具有条形槽的固定座的立体外观图；
图3B为本发明具有孔洞的固定座的立体外观图；
图4为本发明于一热管表面布设黏着介质的剖视图；
图5为本发明涂覆有黏着介质的一热管挤压置于该容纳凹槽的剖视图；
图6为本发明压掣并列的热管的示意图；
图7为本发明第一实施例热管结合固定座的剖视图；
图8为本发明第一实施例的制法流程图；
图9为本发明于凹处中置入热固性黏着介质，并将热管挤压置于该容纳凹槽的剖视图；
图10为本发明第二实施例热管结合固定座的剖视图；
图11为本发明第二实施例的制法流程图。
其中，附图标记
10a　　导热座　　　　　　　　　101a　　　通槽
102a   隔板                    20a       热管
201a   蒸发端
10b    固定座                  11b       底面
12b    容纳凹槽                20b       热管
200b   平面
10     固定座                  11        底面
12     容纳凹槽                13        凹处
20     热管                    200       平面
30     黏着介质                31        黏着介质
40     装置
51～55 步骤                    61～66　  步骤
具体实施方式
有关本发明的详细说明及技术内容，配合附图说明如下，然而所附附图仅提供参考与说明用，并非用来对本发明加以限制。
请依序参照图3A、图3B至图6，为本发明的第一实施例；本发明提供一种热管结合固定座的制法，首先提供具有一容纳凹槽12的一固定座10，该容纳凹槽12内设有至少一凹处13，该凹处13可设为条形槽(图3A)或为孔洞(图3B)；另提供至少二热管20(在本实施例中为三支热管20，实际实施时可依所需调整)；另于该热管20与该容纳凹槽12的接触面上布设一黏着介质30，该黏着介质30可为环氧树脂、导热膏或导热胶等等，其涂覆于该热管20的表面(一支或多支)，也可涂覆于该容纳凹槽12的表面；接着，将该些热管20迫入该容纳凹槽12中，于本实施例中，将其中二热管20置入该容纳凹槽12中，再将该至少一热管20挤压置入该容纳凹槽12中，并使部分该黏着介质30容置于该凹处13，实际实施时，也可先将该些热管20并列于该容纳凹槽12的开口处，再同时将该些并列热管20挤压置入该容纳凹槽12中；最后，压掣该些并列的热管20，以使该些热管20形成一与固定座10表面共平面的平面200，本实施例中以一装置40辗压该容纳凹槽12中的热管20，以将并列的该些热管20结合于固定座10的容纳凹槽12。
另参阅图7，为本发明热管结合固定座的结合剖视图；依上述制法所得的成品，该固定座10的底面11具有该容纳凹槽12，该容纳凹槽12设有多个凹处13，多个热管20并列且挤压置于该容纳凹槽12中，其中，该热管20与该容纳凹槽12的接触面附着有该黏着介质30，而部份的黏着介质30容置于该凹处13中；于本实施例中设有三支热管20，该容纳凹槽12中的三支热管20经压掣后形成一与固定座10表面共平面的平面200，实际实施时也可高于该固定座10的底面11。
请参阅图8，为本发明第一实施例的制法流程图(请同参图3A至图7)；其步骤如下：首先，提供底面11具有一容纳凹槽12的一固定座10，其中该容纳凹槽12中设有至少一凹处13(步骤51)，该凹处13可为条形槽或孔洞；另提供至少二热管20(步骤52)；接着，于该热管20与该容纳凹槽12的接触面布设一黏着介质30(步骤53)，该黏着介质30可为环氧树脂、导热膏或导热胶等等，其可涂覆于该热管20的表面，也可涂覆于该容纳凹槽12的表面；续将该些热管20置入该容纳凹槽12中，并使部分该黏着介质30容置于该凹处13(步骤54)，此时，该些热管20即可借助该黏着介质30而紧密地黏着于该容纳凹槽12内，部份的黏着介质30可容置于该凹处13；最后，利用机械加工，如以一辗压的装置40，至少一次地压掣该该容纳凹槽12中并列的热管20，使该些热管20形成一与固定座10表面共平面的平面200(步骤55)，其中，将该些热管20迫入该容纳凹槽12的方式，于本实施例中，将其中二热管20置入该容纳凹槽12中，再将该至少一热管20挤压置入该容纳凹槽12中，也或者，可先将该些热管20并列于该容纳凹槽12的开口处，再同时将该些并列的热管20挤压置入该容纳凹槽12中。
请参阅图9及图10，为本发明的第二实施例；该第二实施例与第一实施例大致相同，固定座10的底面11具有容纳凹槽12，该容纳凹槽12中设有至少一凹处13，该凹处13可为条形槽或为孔洞，其不同之处在于该凹处13内置入一热固性的黏着介质31，当该凹处13设为条形槽时，可置入长条状的黏着介质31(如金属丝、锡条等)，而当该凹处13设为孔洞时，则可置入球状、块粒状的黏着介质31(如金属粒、锡粒)，又将该些热管20置入该容纳凹槽12中，再压掣该些并列的热管20以形成一与固定座10表面共平面的平面200，最后，加热以熔化该黏着介质31，使熔化后的黏着介质31流入该热管20与容纳凹槽12的接触面，其中，部分的黏着介质31容置于该凹处13，待该黏着介质31固化后，该些热管20即可借助该黏着介质31而紧密地黏着于该容纳凹槽12内。
请参阅图11，为本发明第二实施例的制法流程图(请同参图9至图10)；其步骤与第一实施例的制法大致相同，不同之处在于该凹处13中置入一热固性的黏着介质31(步骤63)，当该凹处13设为条形槽时，可置入长条状的黏着介质31(如金属丝、锡条等)，而当该凹处13设为孔洞时，则可置入球状、块粒状的黏着介质31(如金属粒、锡粒等)；接着，将该些热管20迫入该容纳凹槽12中(步骤64)；压掣该些并列的热管20以形成一与固定座10表面共平面的平面200(步骤65)；最后，加热以熔化该黏着介质31(步骤66)，使熔化后的黏着介质31流入该热管20与容纳凹槽12的接触面，其中，部分的黏着介质31容置于该凹处13，待该黏着介质31固化后，该些热管20即可借助该黏着介质31而紧密地黏着于该容纳凹槽12内。
本发明的热管结合固定座的制法及其结构，借助在热管与容纳凹槽的接触面附着有黏着介质，以使热管可紧密地黏着于固定座的容纳凹槽中，维持热管的平面的平整度以保持其导热效率；此外，部分的黏着介质可容置于容纳凹槽中的凹处，故不需精密地控制黏着介质的供给量，多余的黏着介质不会溢流而污损热管或固定座的表面。
以上所述仅为本发明的较佳实施例，非用以限定本发明的专利范围，其它运用本发明的专利精神的等效变化，均应俱属本发明的专利范围。

Claims (17)

1.一种热管结合固定座的制法，其特征在于，包括如下步骤：
(a)提供底面具有一个容纳凹槽的一固定座，其中该容纳凹槽的底部设有至少一凹处，且该容纳凹槽的二侧缘分别成型有一弧形挡部；
(b)提供并列的至少二热管；
(c)于该热管与该容纳凹槽的接触面布设一黏着介质；
(d)将该些热管迫入该容纳凹槽中，并使部分该黏着介质容置于该凹处；以及
(e)压掣该容纳凹槽中并列的热管，以使该些热管形成一与固定座表面共平面的平面。
2.根据权利要求1所述的热管结合固定座的制法，其特征在于，该步骤(c)中于该热管的表面布设该黏着介质。
3.根据权利要求1所述的热管结合固定座的制法，其特征在于，该步骤(c)中于该容纳凹槽的表面布设该黏着介质。
4.根据权利要求1所述的热管结合固定座的制法，其特征在于，该步骤(d)中先将其中一热管置入该容纳凹槽中，再将该至少一热管挤压置入该容纳凹槽中。
5.根据权利要求1所述的热管结合固定座的制法，其特征在于，该步骤(d)中先将该些热管并列于该容纳凹槽的开口处，再同时将该些并列的热管挤压置入该容纳凹槽中。
6.根据权利要求1所述的热管结合固定座的制法，其特征在于，该凹处为孔洞。
7.根据权利要求1所述的热管结合固定座的制法，其特征在于，该凹处为条形槽。
8.根据权利要求1所述的热管结合固定座的制法，其特征在于，该黏着介质为环氧树脂。
9.根据权利要求1所述的热管结合固定座的制法，其特征在于，该黏着介质为导热胶。
10.根据权利要求1所述的热管结合固定座的制法，其特征在于，该黏着介质为热固性的黏着介质。
11.根据权利要求10所述的热管结合固定座的制法，其特征在于，更包括一步骤(f)，该步骤(f)为加热以熔化该黏着介质。
12.一种热管结合固定座的结构，其特征在于，包括：
一固定座，其底面具有一个容纳凹槽，该容纳凹槽的底部设有至少一凹处，且该容纳凹槽的二侧缘分别成型有一弧形挡部；
至少二热管，该些热管并列且同置于该容纳凹槽中，其中，该容纳凹槽中并列的热管表面经压掣而形成一与固定座表面共平面的平面；以及
一黏着介质，附着于该热管与容纳凹槽之间，其中，部分的黏着介质容置于该凹处。
13.根据权利要求12所述的热管结合固定座的结构，其特征在于，该凹处为孔洞。
14.根据权利要求12所述的热管结合固定座的结构，其特征在于，该凹处为条形槽。
15.根据权利要求12所述的热管结合固定座的结构，其特征在于，该黏着介质为环氧树脂。
16.根据权利要求12所述的热管结合固定座的结构，其特征在于，该黏着介质为导热胶。
17.根据权利要求12所述的热管结合固定座的结构，其特征在于，该黏着介质为热固性的黏着介质。
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