TWI331205B - - Google Patents

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Publication number
TWI331205B
TWI331205B TW097140670A TW97140670A TWI331205B TW I331205 B TWI331205 B TW I331205B TW 097140670 A TW097140670 A TW 097140670A TW 97140670 A TW97140670 A TW 97140670A TW I331205 B TWI331205 B TW I331205B
Authority
TW
Taiwan
Prior art keywords
heat pipe
combined
item
fixing seat
heat
Prior art date
Application number
TW097140670A
Other languages
English (en)
Other versions
TW201017085A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44830674&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TWI331205(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed filed Critical
Priority to TW097140670A priority Critical patent/TW201017085A/zh
Priority to CN2008101712421A priority patent/CN101730441B/zh
Priority to DE602008001804T priority patent/DE602008001804D1/de
Priority to AT08020034T priority patent/ATE474198T1/de
Priority to EP08020034A priority patent/EP2187158B1/en
Priority to US12/272,045 priority patent/US8136245B2/en
Publication of TW201017085A publication Critical patent/TW201017085A/zh
Application granted granted Critical
Publication of TWI331205B publication Critical patent/TWI331205B/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D39/00—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders
    • B21D39/04—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of tubes with tubes; of tubes with rods
    • B21D39/048—Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by plating; Tube expanders of tubes with tubes; of tubes with rods using presses for radially crimping tubular elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/06—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of metal tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/12—Fastening; Joining by methods involving deformation of the elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49364—Tube joined to flat sheet longitudinally, i.e., tube sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49373—Tube joint and tube plate structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49377—Tube with heat transfer means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)
  • Supports For Pipes And Cables (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Road Paving Structures (AREA)

Description

1331205 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種導熱裝置，尤指一種複數熱管結 合於固定座並形成有一平面之技術。 【先前技術】 由於熱管（heat pipe)有高熱傳能力、重量輕及結構簡 單等特性’並具有不消耗電力及價格低廉等諸多優點，目 前已廣泛地應用於電子元件之導熱，藉由對電子發熱元件 進行熱量的快速導離’以有效的解決現階段之電子發熱元 件的熱聚集現象。
請參閱第一圖，係習知熱管與導熱座（固定座）結合 之示意圖；導熱座l〇a上各個通槽1〇la之間需形成有隔板 l〇2a，以使該些熱管2〇a可間隔地排列設於導熱座1〇a 上’·然，該些隔板102a雖可使各熱管20a分別容設於該等 通槽101a内，卻也使各熱管2〇a之蒸發端2〇ia平貼於發熱 元件時’減少了導熱座10a上可置設的熱管2〇a數量，進 而降低熱管20a之蒸發端謝a與發熱元件的接觸面積影 響熱管20a對發熱元件的導熱效率。 y 為克服上述習知缺點，本發明人構思出一種將熱管並 列而結合於-Μ座的方法與結構，如第二圖所示提供 底面iib具有容納凹槽12b之一固定座i〇b以及至少二埶 管20b，再將該等熱管施置入該容納凹肖既中^後 對容納凹槽12b中之熱管勵進行機械加工，使並 3 1331205 ''面2_ ’藉此，將熱管施並列且齊平地結合於固定 座⑽，可擴大熱管與發熱元件之接觸面積。 然，上述將熱管並列結合於一固定座的結構，於實際 使用上仍存在有未臻完善之處，“該㈣管係以機械加 方法而強迫擠愿人該固定座的容納凹槽内，熱管與固定 f之間無黏著介質加以黏合固定’成品完成後，於運輸過 =或於進行安全賴時，部分迫人於固定座内的熱管易 2動或脫落之虞，使該些並㈣f的平面失去了應有的 度而降低導熱效率’甚至無法使用，此乃發明人所欲 改良之處。 【發明内容】 ::明之一㈣，在於提供一種熱管結合固定座之製 、…〇構，可使熱管緊密地黏著於固定座的容納凹 中。 f法明之另一目的’在於提供一種熱管結合固定座之 ，、結構’係藉由容納凹槽内設有至少—凹處，可讓 :二：ί者介質容置於該處，故不需精密地控制黏著介質 可使多餘的黏著介質不會溢流而污 疋座的表面。 為:達成上述之目#，本發明係提供—種熱管結合固 二之1法，以提供-具有容納凹槽之固定座，容納凹 槽内设有至少一凹處，另提 + 杈供複數熱s，復於熱管與容納 槽之接觸面布設有-黏著介f，騎複數歸迫入容納 4 丄 J：)丄 ZU：) 凹槽中’最後堡掣容响P£J姊由4 ,m ± ㈣槽中相之熱管，使熱管形成- 與固定座表面共平面之平面 十面並使部分之黏著介質容置於 凹處内。 A為了達成上述之目的，本發明另提供一種熱管結合固 二座之結構’包括底面具有容納凹槽之固定座及至少二熱 管’固定座之容納凹挿 門U價甲叹有至少一凹處，並迫入複數並 列的熱管’熱管表面係經壓f而形成—與較座表面共平 面之平面’其中’熱官與容納凹槽的接觸面上係布設有黏 著介質，而部分的黏著介質係容置於該凹處。 【實施方式】 有關本發明之詳細說明及技術内容，配合圖式說明如 下然而所附圖式僅提供參考與說明用，並非用來對本發 明加以限制者。 請依序參照第三圖A、第三圖B至第六圖，係為本發 •明之第一實施例；本發明係提供一種熱管結合固定座之製 法，首先提供具有-容納凹槽12之一固定座1〇，該容納凹 槽12内設有至少一凹處13，該凹處13係可設為條形槽（第 三圖A)或為孔洞（第三圖B);另提供至少二熱管20 (於本 實她例中係為三支熱管20，實際實施時可依所需調整）； -另於該熱管20與該容納凹槽丨2之接觸面上布設一黏著介質 30，該黏著介質3〇可為環氧樹脂、導熱膏或導熱膠等等， 其係塗覆於該熱管20之表面（一支或多支），亦可塗覆於 該谷納凹槽12的表面；接著，將該等熱管2〇迫入該容納凹 5 1331205 槽12中，於本實施例中，係將其中二熱管2〇置入該容納凹 槽12中，再將該至少一熱管20擠壓置入該容納凹槽12中， 、並使部分該黏著介質30容置於該凹處13，實際實施時，亦 可先將該等熱管20並列於該容納凹槽12之開口處，再同時 將該等並列熱管2〇擠壓置入該容納凹槽12中；最後，壓掣 該等並列之熱管20，以使該等熱管20形成一與固定座1〇表 面共平面之平面2〇〇 ，本實施例中係以一治具4〇輾壓該容 _納凹槽12中的熱管2〇，以將並列的該等熱管2〇結合於固定 座10之容納凹槽12。 另參閱第七圖，為本發明熱管結合固定座之結合剖視 $ ;依上述製法所得之成品，言玄固定座狀⑥㈣具有該 容納凹槽12，該容納凹槽12設有複數凹處13，複數熱管如 係並列且擠壓置於該容納凹槽12中，其中，該熱管卻與該 ，納凹槽12之接觸面係附著有該黏著介㈣，而部份的點 著介質30係容置於該凹處13中；於本實施例中係設有三支 籲熱管20’該容納凹槽12中的三支熱管2〇經摩擎後形成一與 固定座ίο表面共平面之平面膽，實際實施時亦 ς 固定座10之底面1〗。 、4 請參閱第八圖，係為本發明第一實施例之製法流程圖 (請同參第三圖Α至第七圖）；其步驟係如下：首先，提 供底面11具有-容納凹槽12之—固定錢，其中該容納凹 设有至少一凹處13(步驟51) ’該凹處財為條形 槽或孔洞，另提供至少二熱管2〇(步驟52);接著 熱管2〇與該容納凹槽12之接觸面布設一黏著介質3〇(步驟〆 6 1331205 53)，該黏著介質3〇可為環氧樹脂、導熱膏或導熱膠等 等，其可塗覆於該熱管20之表面，亦可塗覆於該容納凹槽 12之表面；續將該等熱㈣置人該容納凹㈣中，並使部 分該黏著介質30容置於該凹處13(步驟54)，此時，該等 熱管20即可藉由該黏著介質3〇而緊密地黏著於該容納凹、 12内’部份的黏著介f3G可容置於該凹處13 ;最後，利用 機械加工，如以一輾壓之治具4〇 ’至少-次地壓掣該★亥容 >納凹槽12中並列的熱管20,使該等熱管20形成-與固定座 1〇表面共平面之平面·(步驟55)，其中，將該等妖管2〇 迫入該容納凹槽12之方式，於本實施例中，係將其中二教 管2〇置入該容納凹槽12中，再將該至少-熱管20擠壓置入 該容納凹槽中，亦或者，可先將該等熱管2〇並列於該容 納凹槽12之開口處，再同時將該等並列之熱管20擠麼置入 該容納凹槽12中。 =參閲第九及第十圖，係為本發明之第二實施例；該 :%例與第一實施例大致相同’固定座之底面η旦 ^谷納凹槽，該容納凹槽12中設有至少一凹處13，該凹 處13可為條形槽或為孔洞，其不同之處在於該凹處13内置 固性的黏著介質31，當該凹處13設為條形槽時，可 〇長條狀的點著介質31(如金屬絲、錫條等），而合該 了處13設為孔洞時，則可置入球狀、塊粒狀的黏著介/ 粒、錫粒），復將該等熱管2〇置入該容 =面再，該等並列之熱管2〇以形成一與固定座1〇表面 “千面之平面，最後，加熱以熔化該黏著介質 7 1331205 炼化後之黏著介質31流入該熱管2〇與容納凹槽i2的接觸 $，其中，部分的黏著介質31係容置於該凹處13，待該黏 著"貝31固化後，該等熱管2〇即可藉由該黏著介質^而緊 密地黏著於該容納凹槽12内。。 請參閱第十一圖，係為本發明第二實施例之製法流程 圖（請同參第九至第十圖）；其步驟與第一實施例之製法 $致相同’不同之處在於該凹處13中置入一熱固性的黏著 "質31(步驟63)，當該凹處13設為條形槽時，可置入長 條狀的黏著介質31 (如金屬絲、錫條等），而當該凹處Η 為孔洞時，則可置入球狀、塊粒狀的黏著介質31 (如金 粒錫粒等），接著，將該等熱管2〇迫入該容納凹槽12 」步驟64) ’壓掣該等並列之熱管2()以形成__與固定座 =平面之平面·(步驟65);最後，加熱以溶化 f 31(步驟66)，使炫化後之黏著介質31流入該 容納凹槽12的接觸面，其中，部分的黏著介質Μ g、合置於相處13，待該黏著介質31固化後，該等献管2〇 尸可糟由該黏著介質31而緊密地黏著於該容納凹槽12内。 总盘2日月之熱管結合固定座之製法及其結構，藉由在熱 U納凹槽之接觸面附著有黏著介質，以使執管可 地黏著於固定座的容納凹槽中，維持熱管之平面的平整度 ::::導:效率；此外，部分的黏著介質可容置於容ς 二“凹處’故不需精密地控制黏著介質的供給量，多 、、黏者介質不會溢流而污損熱管或固定座的表面。 以上所述僅為本發明之較佳實施例，非用以限定本發 8 1331205 之專利精神之等效變化 明之專利範圍，其他運用本發明 均應俱屬本發明之專利範圍。 【圖式簡單說明】 第一圖係為習知熱管與導熱座之結合示意圖； 第二圖係熱管結合固定座之立體外觀示意圖； =圖A係為本發明具條形槽之固定座的立體外觀圖； 籲。圖B係為本發明具孔洞之固定座的立體外觀圖； 第四圖係為本發明於一熱管表面布設黏著介質 圖； 疋 第五圖係為本發明塗覆有黏著介質之一 容納凹槽之剖視圖； 在 第六圖係、為本發明壓掣並列的熱管之示意圖； 第七圖係 '為本發明第一實施例熱管結合固定座之剖圖； 第八圖係為本發明第一實施例之製法流程圖； 籲第九圖係j本發明於凹處中置入熱固性黏著介質，並將 熱官擠壓置於該容納凹槽之剖視圖； 第十圖係、為本發明第二實施例熱管結合固定座之剖視 圖；以及 第十一圖係為本發明第二實施例之製法流程圖。 【主要元件符號說明】 10a 導熱座 l〇la 通槽 102a隔板 20a 熱管 1331205 201a 蒸發端 10b 固定座 lib 底面 12b 容納凹槽 20b 執管 200b 平面 30b 治具 10 固定座 11 底面 12 容納凹槽 13 凹處 20 執管 < "、 & 200 平面 30 黏著介質 31 黏著介質 40 治具 51 〜55 步驟 61〜 /66 步驟 10

Claims (1)

  1. 七、申請專利範圍： L二種熱官結合固定座之製译，係包括： a) 供底面具有一容*内prj祕+ f—, 凹槽中係設有至;Lit〜’其中該容納 b) 提供至少二熱管； - 〇於該熱管與該容納凹槽之接觸面布設-黏著介曾. = =管迫入該容納凹槽中，並使部分該黏著介 質谷置於該凹處；以及 e)壓：該，凹槽中並列之熱管，以使該等熱管形成 與固定座表面共平面之平面。 該步2驟了t第1項所述之熱管結合固定座之製法，其中 ° \ 係於該熱管之表面布設該黏著介質。 中二項第1項所述之熱管結合固定座之製法，其 如&C)中係於該容納凹槽之表面布設該黏著介質。 中該步驟項所述之熱管結合固定座之製法，、其 , 係先將其中一熱管置入該容納凹槽中，再 將該至少-熱管擠壓置入該容納凹槽中。 再 中該項第1項所述之熱管結合固定座之製法，其 卢$ m 中係先將該等熱管並列於該容納凹槽之開口 6 ^將該等並列之熱管擠壓置人該容納凹槽中。 ，該凹m項：項所述之熱管結合固定座之結構’其 中該7凹項所述之熱管結合固定座之結構，其 丄 .如吻求項第丨項所述之熱管結合固定座 構其 令上項所述之熱管結合固定座之結構，其 郵考，丨質係為導熱膠。 令：黏t項第1項所述之熱管結合固定座之結構，其 ΜI者；丨質係為熱固性之黏著介質。 勺^如請求項㈣項所収歸結合固定座之結構，更 質 V驟（f)，該步驟（0係為加熱以熔化該黏著介 12,種熱管結合固定座之結構，係包括： 固定座’其底面具有一容納凹槽，該容納 β又有至少一凹處； Τ⑺ 至少二熱管，該等熱管係並列且同置於該容納凹槽 -納凹射並列之熱管表面係㈣掣㈣成 /、固疋座表面共平面之平面；以及 黏著介質，係附著於該熱管與容納凹槽之間，其 中’部分的點著介質係容置於該凹處。 ’、 13.如請求項第12項所述之熱管結合 其中該凹處係為孔洞。 。構， H. >請求項第12項所述之熱f結合固定座之結構， 其中該凹處係為條形槽。 15·㈣求項第12項所述之熱管結合固μ之結構， ”中該黏著介質係為環氧樹脂。 16.如請求項第12項所述之熱管結合固定座之結構， 12 1331205 其中該黏著介質係為導熱膠。 17.如請求項第12項所述之熱管結合固定座之結構， 其中該黏著介質係為熱固性之黏著介質。
    13
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CN2008101712421A CN101730441B (zh) 2008-10-23 2008-10-27 热管结合固定座的制法及其结构
DE602008001804T DE602008001804D1 (de) 2008-10-23 2008-11-17 Verfahren zum Kombinieren von Heizrohren mit einer Befestigungsunterlage und Struktur damit
AT08020034T ATE474198T1 (de) 2008-10-23 2008-11-17 Verfahren zum kombinieren von heizrohren mit einer befestigungsunterlage und struktur damit
EP08020034A EP2187158B1 (en) 2008-10-23 2008-11-17 Method for combining heat pipes with a fixing base and structure of the same
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ATE474198T1 (de) 2010-07-15
CN101730441B (zh) 2011-08-17
US20100122799A1 (en) 2010-05-20
US8136245B2 (en) 2012-03-20
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