TWI308052B - - Google Patents
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- TWI308052B TWI308052B TW95123535A TW95123535A TWI308052B TW I308052 B TWI308052 B TW I308052B TW 95123535 A TW95123535 A TW 95123535A TW 95123535 A TW95123535 A TW 95123535A TW I308052 B TWI308052 B TW I308052B
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- 238000004519 manufacturing process Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000033764 rhythmic process Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
1308052 九、發明說明: 【發明所屬之技術領域】 種用 本發明係錢於—料熱模組及其料方法,尤指一 以提供電子元件導熱的導熱模組及其製造方法。曰 【先前技術】 目前業界在電子元件的導、散熱方面,係彻敎管所 ”有向熱傳能力、快速傳熱、高熱傳導 :單及多用;等特性,其可傳遞大量的熱量且不簡= 導適合電子產品的導、散熱需求,且以熱管及 勒、板^成的導熱模組,其結合的良莠將直接影響到 組的熱傳導效能及固持穩雜,故如何增加熱管盘 ^_麵結合與密職觸,已成為業界所研究的 重要課題。 S知導熱触,主要包括—導熱板及魏熱管,盆中 導熱板頂面以鑽頭鑽穿有複數凹槽,各凹槽之斷面弧形係 大:二分之一圓弧,且其係用以供熱管之一端穿接,再對 穿設於導熱板之凹槽内的熱管頂面進行好加卫,以使熱 管之外表面與凹槽内壁貼附接觸。 ’、、、:而t知導熱;J:驗在實際使訂’仍存在有下述的 問題點&於该凹槽頂部兩側係順著圓弧方向所延伸,並 呈一尖角型態,使其對熱f的夾掣力相當的微小,且易因 裝配過程巾的碰觸或運作過程巾的震動,而令熱管與導熱 板產生#A脫與刀離現象,進而導致熱傳導效能不彰及固持 1308052 穩定性差等諸多問題,而亟待加以改善者。 有鑑於上述習知所產生之問題,本案發明人遂以從事 該行業多年之經驗,並本著精益求精之精神,積極研究改 良,遂有本發明『導熱模組及其製造方法』之產生。 【發明内容】 本發明之主要目的,在於提供一種導熱模組及其製造 方法,其係利用各凹槽之擋塊的設置,可確保導熱板與各 熱管之間的固持穩定性及密貼性,進而提昇導熱模組之熱 傳導效能。 為了達成上述之目的,本發明係提供一種導熱模組及 其製造方法,用以將電子元件所產生的熱量導離,包括一 導熱板及複數熱管,其中於該導熱板頂面開設有複數道相 互平行的凹槽,各凹槽分別貫穿導熱板之前、後端面,且 於其下方形成有弧形面,另在凹槽之上方兩側分別向内延 伸有擋塊;該等熱管一端為受熱段另一端為放熱段,該受 熱段係穿設於導熱板之凹槽内,並與凹槽内壁及擋塊内侧 相互貼附接觸。 為了達成上述之目的,本發明係提供一種導熱模組製 造方法,其步驟包括: a) 以成型刀具在導熱板上加工複數道凹槽及形成在各 凹槽頂端的擋塊; b) 將熱管之一端穿入導熱板之凹槽内; c) 以壓具對穿設於導熱板之凹槽内的熱管頂面進行壓 1308052 掣加工,使熱管產生塑性變形並與凹槽及擋塊内緣面貼 接;以及 d)即可完成一導熱模組成品。 【實施方式】 有關本發明之詳細說明及技術内容,配合圖式說明如 下,然而所附圖式僅提供參考與說明用,並非用來對本發 明加以限制者。 請參照第一、二及三圖所示,係分別為本發明之立體 分解圖、組合示意圖及組合剖視圖,本發明係提供一種導 熱模組及其製造方法,該導熱模組主要包括有一導熱板10 及複數熱管20,其中: 該導熱板10係可為鋁、銅等散熱性良好的矩形體,於 其頂面上開設有複數道相互平行的凹槽Π,各凹槽11係分 別貫穿導熱板10之前、後端面,且於其下方形成有弧形面 111,於弧形面111之兩端分別向上延伸有縱向面112 ; 另在凹槽11之上方兩侧分別向内水平延伸有「匸」形擋塊 12,該擋塊12與縱向面112之相接處形成有内圓角13。 該熱管20係可為一「U」形、「L」形或其他各種不 同幾何形狀,其一端為受熱段21另一端為放熱段22,並於 内部,並於其内部裝填有毛細組織及工作流體,藉以利用 氣、液相之熱傳機制來達成快速熱傳效果,該受熱段21係 穿設於導熱板10之凹槽11内,並與凹槽11内壁及擋塊12内 側相互貼附接觸。 1308052 实埶2柄明之導熱模組更包括有一導熱介質30,該 30係可為錫膏等材料,其係佈設㈣㈣之受熱 沾料熱板10之凹觀内壁面之間,藉以增加熱管_ =11之間密貼效果及避免氣孔的存在,而大幅提昇熱傳 導效能。 請,照第四至七圖所示,係分別為本發明之製造流程 圖、熱管穿接於導熱板之組合示意圖、麼具尚未麗入導熱 板之剖視圖及Μ具壓人導熱板之剖視圖,本發明之導熱模 組製造方法,其步驟包括: ,a)首先卩成型刀具在導熱板1{)上加工複數道凹槽Μ 及形成在各凹槽11頂端的播塊12 ;在此步驟中,係可將導 ,、、、板10夾固於銳床之工作台後,再以成型銳刀對導熱板切 之頂面銳切出複數道相互平行的凹前,同時在各凹槽Η 頂端兩侧分別形成有擋塊12(如第一圖所示)。 b)其次’將熱管2〇之一端穿入導熱板1〇之凹槽u内; 在此步驟中,係可先對熱管20進行f曲加卫,岐其呈一 U」开y者再將熱管20之一端對應於導熱板之凹槽Η 穿入。 C)蚋,以壓具5對穿設於導熱板1〇之凹槽丨1内的熱管 20頂面進行壓掣加卫,使熱管2G產生塑性變形並與凹槽11 及擋塊12内緣面貼接;在此步驟中,先預製一壓具5,該 壓具5具有複數對應導熱板1〇之凹槽u位置的凸塊5丨,將 各凸塊51分別對正於熱管2〇上,再向下壓掣壓具5移動, 以令各凸塊51對各熱管20進行成形加工,並使各熱管2〇產 1308052 生相應的塑性變形,而與導熱板10之凹槽11内壁及擋塊12 内側相互贴附接觸。 d)最後’即可完成一導熱模組成品。 此外,本發明之製造步驟更包括一e)步驟,該e)步驟 介於a)步驟與b)步驟之間,且其係在於導熱板10之凹槽11 内塗佈一導熱介質30 ;另外,在c)步驟之後更包括一 f)步 驟,該f)步驟係對導熱板10進行加溫,而使導熱介質30受 熱而溶化。 綜上所述,當知本發明之導熱模組及其製造方法已具 有產業利用性、新穎性與進步性,又本發明之構造亦未曾 見於同類產品及公開使用,完全符合發明專利申請要件, 爰依專利法提出申請。 惟以上所述僅為本發明之較佳可行實施例,並非因此 即拘限本發明之專利範圍,故舉凡運用本發明說明書及圖 式内容所為之等效結構變化,或直接或間接運用於其它相 關之技術領域,均同理皆包含於本發明所涵蓋之範圍内, 合予陳明。 【圖式簡單說明】 第一圖係本發明之立體分解圖。 第二圖係本發明之組合示意圖。 第三圖係本發明之組合剖視圖。 第四圖係本發明之製造流程圖。 第五圖係本發明之熱管穿接於導熱板之組合示意圖。 Ι308Ό52 第六圖係本發明之壓具尚未壓入導熱板之剖視圖。 第七圖係本發明之壓具壓入導熱板之剖視圖。 【主要元件符號說明】 【本發明】 導熱板10 凹槽11 弧形面111 縱向面112 擋塊12 内圓角13 熱管20 受熱段21 放熱段22 導熱介質30 壓具5 凸塊51 步驟流程a〜f 10
Claims (1)
1308052 、申請專利範圍: 1· 一種導熱模組,包括: 凹槽 各凹槽係分別貫穿導熱板之前、後端 導熱板,於其頂面開設有複數道相互平行的 面,且於其下方形成 有孤开7面,另在凹槽之上方兩側分別向内延伸有擋塊.以 及 心複數熱管,該熱管一端為受熱段另一端為放熱段 又熱&係穿設於導熱板之凹槽内,並與凹 ^ 侧相互貼附接觸。 芏Μ塊内 2·如申請專職圍第μ所狀導熱额 熱板係為鋁材料。 該導 3. 如巾請專職圍第2項所述之導滅組, 熱板係為銅材料。 等 4. 如中請專利範圍第1項所述之導熱模組 熱板之擋塊係呈一「c」形體。 …導 样之請專觀圍第1韻狀導難組,其中該凹 槽之弧形面兩端分別向上延伸有縱向面。 申請專利範圍第5項所述之導熱模組,其中該縱 向面與擋塊之相接處形成有内圓角。 7·如申請專利範圍第i項所述之導 官係呈—「II」形管體。 、中减 ^如申請專利範圍第i項所述之導熱模組,其中該教 B係呈―「L」形管體。 9·如申請專利範圍第1項所述之導熱模組,其更包括 1308052 有一導熱介質,其係佈設於熱管之受熱段與導熱板之凹槽 内壁面之間。 1〇. —種導熱模組製造方法,其步驟包括: a) 以成型刀具在導熱板上加工複數道凹槽及形成在各 凹槽頂端的擋塊; b) 將熱官之一端穿入導熱板之凹槽内; c) 以壓具對穿設於導熱板之凹槽内的熱管頂面進行壓 掣加工’使熱管產生塑性變形並與凹槽及擔塊内緣面貼 接;以及 d)即可完成一導熱模組成品。 1丨1.如申請專利範圍第10項所述之導熱模組製造方法, 其令a)步驟,仙成賴刀對導熱板之頂面翁出複數道 相互平行的凹槽及擋塊。 並12·如申請專利範圍第10項所述之導熱模組製造方法, 二中b)步驟’先對熱管進行f曲加工,而使其呈一「U」 再將熱管之一端對應於導熱板之凹槽穿入。 1 士申明專利範圍第1〇項所述之導熱模組製造方法, 對正C)步Γ ’先預製—具有凸塊的愿具,次將各凸塊分別 ^熱官上’再向下麼㈣具移動,以令各凸塊對各熱 吕進行成形加工。 其5如巾請專·㈣1()項所述之導熱馳製造方法, 且—Ο步驟’該6)步驟介於8)步驟與W步驟之間, /、系在於導熱板之凹槽内塗佈一導熱介質。 15’如申請專利範圍第1〇項所述之導熱模組製造方法, 12 1308052 其更包括一 f)步驟,其係在C)步驟之後,該f)步驟係對導 熱板進行加溫,而使導熱介質受熱而溶化。 13
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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TW95123535A TW200803706A (en) | 2006-06-29 | 2006-06-29 | Heat conduction module and fabrication method thereof |
DE200610052753 DE102006052753A1 (de) | 2006-06-29 | 2006-11-08 | Wärmeableitmodul und Verfahren zu dessen Herstellung |
JP2007109422A JP2008010828A (ja) | 2006-06-29 | 2007-04-18 | 導熱モジュールおよびその製造方法 |
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TW95123535A TW200803706A (en) | 2006-06-29 | 2006-06-29 | Heat conduction module and fabrication method thereof |
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TW200803706A TW200803706A (en) | 2008-01-01 |
TWI308052B true TWI308052B (zh) | 2009-03-21 |
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TW95123535A TW200803706A (en) | 2006-06-29 | 2006-06-29 | Heat conduction module and fabrication method thereof |
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DE (1) | DE102006052753A1 (zh) |
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JP2009270750A (ja) * | 2008-05-05 | 2009-11-19 | Golden Sun News Technics Co Ltd | 放熱器に埋め込んだヒートパイプ蒸発部の平坦化法とヒートパイプ付き放熱器 |
DE202008006125U1 (de) * | 2008-05-05 | 2009-11-12 | Ledon Lighting Gmbh | Heatpipe |
TWI462690B (zh) * | 2009-10-23 | 2014-11-21 | Cpumate Inc | 多熱管蒸發部共平面之製造方法及其成品、治具 |
CN102218487B (zh) * | 2011-03-04 | 2016-01-13 | 东莞汉旭五金塑胶科技有限公司 | 导热座供多热管密合排列之组配方法及其结构 |
KR200469061Y1 (ko) | 2011-03-28 | 2013-09-13 | 충-시엔 후앙 | 바닥블록이 없는 히트 싱크 |
JP2015169390A (ja) * | 2014-03-07 | 2015-09-28 | 古河電気工業株式会社 | ヒートパイプの固定構造およびヒートパイプの固定方法 |
JP6943893B2 (ja) * | 2019-01-09 | 2021-10-06 | 古河電気工業株式会社 | ヒートパイプ構造体、ヒートシンク、ヒートパイプ構造体の製造方法及びヒートシンクの製造方法 |
CN112213830A (zh) * | 2019-07-10 | 2021-01-12 | 海思光电子有限公司 | 一种光模块及通信系统 |
CN114061342A (zh) * | 2020-07-31 | 2022-02-18 | 昇业科技股份有限公司 | 多热管并排型散热模块的制法 |
CN113179560B (zh) * | 2021-05-06 | 2022-07-29 | 江苏天宝陶瓷股份有限公司 | 一种用于陶瓷加热器的导热结构 |
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JPS5811388A (ja) * | 1981-07-10 | 1983-01-22 | Fujikura Ltd | ヒ−トパイプ用素管の製造方法 |
JPH03108301U (zh) * | 1990-02-21 | 1991-11-07 | ||
JPH04225790A (ja) * | 1990-12-27 | 1992-08-14 | Furukawa Electric Co Ltd:The | ヒートパイプ式放熱器およびその製造方法 |
JPH05315781A (ja) * | 1992-05-07 | 1993-11-26 | Fujitsu Ltd | 印刷配線板搭載部品の放熱構造 |
JP2940363B2 (ja) * | 1993-10-27 | 1999-08-25 | 株式会社ダイフク | ローラ支持構造 |
JPH0743021U (ja) * | 1993-12-28 | 1995-08-11 | 古河電気工業株式会社 | 電子機器用ヒートパイプ式放熱ユニット |
JPH10122125A (ja) * | 1996-10-15 | 1998-05-12 | Sumitomo Densetsu Corp | 太陽エネルギー利用設備取付け架台 |
KR20010034443A (ko) * | 1998-01-30 | 2001-04-25 | 가나이 쓰토무 | 히트 파이프형 냉각장치 및 그 제조방법, 히트 파이프형냉각장치용 냉각판 |
JP2001135966A (ja) * | 1999-11-10 | 2001-05-18 | Diamond Electric Mfg Co Ltd | ヒートパイプとプレートの接合方法 |
TW591363B (en) * | 2001-10-10 | 2004-06-11 | Aavid Thermalloy Llc | Heat collector with mounting plate |
JP4435524B2 (ja) * | 2003-09-12 | 2010-03-17 | 株式会社 正和 | 冷却板の製造方法 |
JP2007218439A (ja) * | 2006-02-14 | 2007-08-30 | Sumitomo Light Metal Ind Ltd | ヒートパイプの固定方法 |
-
2006
- 2006-06-29 TW TW95123535A patent/TW200803706A/zh not_active IP Right Cessation
- 2006-11-08 DE DE200610052753 patent/DE102006052753A1/de not_active Withdrawn
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2007
- 2007-04-18 JP JP2007109422A patent/JP2008010828A/ja active Pending
Also Published As
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JP2008010828A (ja) | 2008-01-17 |
DE102006052753A1 (de) | 2008-01-03 |
TW200803706A (en) | 2008-01-01 |
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