五、新型說明： 【新型所屬之技術領域】 種散熱模組，特別是指一種應用無錫焊製程 之散熱模組。 【先前技術】 由於電子產業的發達，為解決高時脈下處理晶 片所產生之高熱，多半須配合適當的散熱器來滿足 散熱的需求，以避免系統晶片因溫度過高導致當機 或繞毁。 而於傳統散熱模組，最經濟的方式係以一銅質 或鋁質之散熱基座上設置複數個散熱鰭片，藉由風 扇強制對流或自然熱對流之方式，將熱能傳導至外 界。然而，若於電子裝置内部之機構空間的限制， 或晶片的散熱設計功率（TDP)過大時，通常需 口 導官（heat pipe)等散熱元件，以快速將熱量由晶片傳 導至散熱鰭片，才能有效避免熱累積於晶片上。 而習用熱導管與散熱鰭片之結合方式，詳見於 中華民國專利公告第4495 14號内，其主要於熱導管 與散熱片連接之接合片上塗佈焊料（如錫膏，含鉛或 無鉛錫膏），放入真空爐内加熱（過錫爐），焊料於加 熱過程中熔化並產生毛細現象，滲入熱導管和散熱 片之接合片’經冷卻後將兩者焊結。雖然上述錫焊 製程可緊密接合熱導管與散熱_片，並有效降低熱 M411603 導管與散熱鳍月接合面之熱阻值，然而， 需配合加熱爐，且製程繁複，製造成本無法進一步 下降。此外，焊料於製程令 援产夕敌-^ 座玍有σ人體及汗染 衣境之廢氣、廢水，且烊料成份令可能包含高濃卢 的鉛及其他重金屬，對於 夂 皿晋承％保之趨勢下， 此種錫焊製程勢必漸趨式微。 鐾於上述錫焊製程之種種缺失，乃有業 採用緊配合的方式，將熱導管與散熱片結合，如第 ^圖及第2圖所示。其中’每一散熱片1〇係… 導官成型一軸孔12,以將埶導管u ,_ , L …、导s 11疋位於治具（圖 未不）上’並以自動化機具成型每—散熱片… 將成型的散熱片穿套於熱導管上方，復藉成型模1 依序逐一衝壓，使每-散熱片10能和熱導管u开; 成套接緊配的狀態》 / 然而，其缺點在於成型後之散熱片10，須 :於熱導管U ’再逐一沖壓緊配’而於多次地對應 穿套及衝壓程序，才能成型完一成品物件。此外-機具衝壓振動或成型散熱片10之公差，均會 導與散熱片丨0之對位精度及迫緊效果，：熱 導官與散熱片之接觸面，將因間隙C1的產生而導致 熱阻值大幅提昇’影響散熱器之整體散埶效率= :用=熱片】。之沖製程序中’須使散熱片浸潤潤 滑用油月曰，以保護沖壓機具及成型模具，以便衝型 及落料’因此’於成型後之散熱片將含有大量的油 4 M411603 潰’當該散熱片10和熱導管11穿套沖壓時 將因毛細現象而滲入接合面，造成熱導管管 而使熱阻上昇。 為改善上述無錫焊製程之缺點，於專利 M270636號及M316611號中提出—種熱導管 鑛片之鉚合緊配結構，其藉由成型模具沖麼 壁產生形變’以將熱導管及鰭片鉚結，藉以 觸面熱阻值及達成快速組裝之效果。然而， 露之鉚合緊配結構，所搭配之熱導管均為— 熱導管’雖可滿足桌上型或伺服器等大型機 較大散熱器組裝空間等設備之需求，然而， 大機構空間以供組裝，對於筆記型電腦及平 腦等輕薄型電子產品而言，由於其可配設位 其機構空間之限制，難以將其應用於上述電 中。 【新型内容】 本創作之主要目的，旨在提供一種散熱 其·可提供筆記型電腦或平板電腦等輕薄型電 使用無錫焊製程之散熱模組，藉以降低製造 並符合環保需求。 為達上述目的，本創作之散熱模組，其 複數個散熱鰭片及至少一熱導管。該等散舞 ’油潰 壁氧化 公報第 與散熱 迫使邊 降低接 其所揭 圓直型 台具有 其需較 板型電 置，因 子產品 模組， 子產品 成本， 係包含 鰭片具 5 M411603 有-鰭片本體、-突出部、至少-熱導管穿設部、 至少-壓片及至少一第二鰭片扣點。該鰭片本體具 有-第-側邊及-第二側邊。該突出部形成於該鰭 片本體之該第-側邊側緣處，該突出部係經該散熱 縛片本體外壓後脊折成塑。該熱導管穿设部形成於 該鰭片本體之側緣處。該歷片係形成於該鰭片本體 之一側。該第二鰭片扣點係形成於該鰭片本體之該 第二側邊。該熱導管係穿設於該熱導官穿設部。 其中，該熱導管穿側部係相對該縛片本體為一 破孔形態，該熱導管係為一扁平形態，該熱導管穿 設部係對應該熱導管。 其中，該突出部更形成一第一鰭片扣點’該第 一鰭片扣點係由該突出部向外突伸。 其中，該鰭片本體更具有至少一第一鰭片扣 點，該第一鰭片扣點係由該鰭片本體之第一側邊向 外突伸。 其中’該壓片之一端係形成一壓制部，當該壓 片壓扣於該熱導管時’該壓制部係壓抵於該熱導管。 其中，該熱導管穿設部係對應該鰭片本體為一 非破孔形態，該熱導管係為一扁平形態，該熱導管 穿設部係對應該熱導管。 其中’該趙片本體及該壓片係圍繞於該熱導管 穿設部。 其中’該鰭片本體更具有至少一第一鰭片扣 6 M411603 點，該第一鰭片扣點係由該鰭片本體之第一側邊向 外突伸。 其中，該壓片更具有一壓迫段，該壓迫段係朝 遠離該突出部之方向凸伸，當壓扣該壓片於該扁平 型熱導管時，該壓迫段係朝該突出部之方向形變， 以迫抵於該扁平型熱導管。 其中，該散熱籍片係由銅金屬、銅合金、铭金 屬或鋁合金所製成。 其中，該熱導管係為銅網式熱導管、溝槽式熱 導管或銅粉燒結式熱導管。 【貫施方式】 為使貴審查委員能清楚了解本創作之内容，謹 以下列說明搭配圖式，敬請參閱。 請參閱第3圖、第4圖及第5圖所示，其係為 本創作散熱模組第一實施例之分解圖、組合圖與壓 片壓接組配示意圖。圖中，該散熱模組2包含複數 個散熱鰭片21及一熱導管22。 各該散熱鰭片21具有一鰭片本體211、二第一 鰭片扣點2 1 2、一突出部2 1 3、一熱導管穿設部2 1 4、 二壓片215及二第二鰭片扣點216。 該鰭片本體211具有一第一側邊2111及一第二 側邊2 1 1 2，該第一側邊2 1 11係相對該第二側邊 2112。 7 M411603 該突出部213係形成於該鰭月本體211之該第 一側邊2 111側緣處。該突出部2 1 3係由沖型該鰭片 本體一並朝外彎折成型。 該熱導管穿設部214係於該鰭片本體211沖型 後一併成型，而形成於該鰭片本體2 11之側緣處。 於本實施例中，該熱導管穿設部2 1 4周緣處之一側 呈開放狀態’而形成一破孔形態，且其形狀係對該 熱導管22。 該等壓片215係於該鰭片本體211沖型後一併 成型，而形成於該鰭片本體2 1 1之第一側邊並分別 位於該等突出部2 1 3之兩側。於本實施例中，該壓 片2 1 5之一端係形成一壓制部2 1 5 1，該壓制部2 1 5 1 係由該壓片2 1 5朝内沿伸，並對應於該突出部2丨3。 該等第二鰭片扣點2 1 6係於該鰭片本體2丨j沖 型後一併成型，並形成於該鰭片本體2丨丨之第二側 邊。 ^該熱導管22為符合筆記型電腦或平板型電腦輕 薄紐小之需求，而為將圓直管以治具壓扁之扁型形 態之熱導管。 々當組接該散熱模組2,可將各該散熱鰭片以之 該等第m點212相互對應，該等第二籍片扣 點/16相互對應，藉由治具（圖未示）的輔助以扣接 該等散熱鰭片21。接著，將該熱導管22穿設於該 熱導管穿設部214 $。最後，將該壓片215之壓制 8 M411603 部2151 “治具壓扣於該熱導管22，使該壓制部 2151緊1^抵於該熱導管22。由於該等散熱韓片及 該熱導管均為預製成型（pre_frabrUated)，故組配八 差非常小’使的完成組配之散熱鰭片及熱導管兩 者之接觸面之餘隙值（gap)非常小，藉以降低接觸教 阻值，進而維持散熱模組之整體散熱效率。V. New description: [New technical field] A kind of heat dissipation module, especially a heat dissipation module using a solderless soldering process. [Prior Art] Due to the development of the electronics industry, in order to solve the high heat generated by processing the wafer under high clock, it is necessary to match the appropriate heat sink to meet the heat dissipation requirements, so as to avoid the system wafer being broken or destroyed due to excessive temperature. . In the conventional heat-dissipating module, the most economical way is to provide a plurality of heat-dissipating fins on a copper or aluminum heat-dissipating base, and the heat energy is transmitted to the outside by forced convection or natural heat convection of the fan. However, if the space of the mechanism inside the electronic device is limited, or the heat dissipation design power (TDP) of the wafer is too large, a heat sink such as a heat pipe is usually required to quickly transfer heat from the wafer to the heat sink fin. In order to effectively prevent heat from accumulating on the wafer. The combination of the conventional heat pipe and the heat sink fin is described in the Republic of China Patent Publication No. 4495, which is mainly applied with solder (such as solder paste, lead or lead-free tin) on the bonding sheet of the heat pipe and the heat sink. The paste is heated in a vacuum furnace (over the tin furnace), the solder melts during heating and produces a capillary phenomenon, and the joint piece penetrating into the heat pipe and the heat sink is cooled and then welded together. Although the above soldering process can closely bond the heat pipe and the heat sink sheet, and effectively reduce the thermal resistance value of the heat M411603 conduit and the heat sink fin joint surface, however, the furnace needs to be matched, and the manufacturing process is complicated, and the manufacturing cost cannot be further reduced. In addition, the solder in the process of the production of the maternity - ^ seat 玍 人体 human body and sweat stained clothing waste gas, waste water, and the ingredients of the ingredients may contain high-enriched lead and other heavy metals, for the dish to promote the % Under the trend, this soldering process is bound to become less and less. In view of the various defects in the above soldering process, there is a way to use a tight fit to combine the heat pipe with the heat sink, as shown in Fig. 2 and Fig. 2. Among them, 'each heat sink 1 ... system... The guide guides a shaft hole 12 to place the 埶 ducts u, _, L ..., s 11 疋 on the fixture (not shown) and heats each machine with an automatic machine. The sheet is formed by inserting the formed heat sink over the heat pipe, and the die forming die 1 is sequentially punched one by one so that each heat sink 10 can be opened with the heat pipe u; the state of the package is tightly matched. However, the disadvantage is that After the forming of the heat sink 10, it is necessary to: press and fit one by one in the heat pipe U', and correspondingly wear the sleeve and the punching procedure to form a finished article. In addition, the tolerance of the stamping vibration of the machine or the forming heat sink 10 will lead to the alignment accuracy and the pressing effect of the heat sink 丨0. The contact surface between the heat guide and the heat sink will cause heat due to the generation of the gap C1. The resistance value is greatly improved 'influencing the overall heat dissipation efficiency of the radiator = : with = hot film】. In the process of punching, the heat sink should be infiltrated with lubricating oil to protect the punching machine and the forming die so as to punch and blank the material. Therefore, the heat sink after molding will contain a large amount of oil 4 M411603 When the heat sink 10 and the heat pipe 11 are punched through the sleeve, they penetrate into the joint surface due to the capillary phenomenon, causing the heat pipe tube to increase the heat resistance. In order to improve the shortcomings of the above-mentioned solderless soldering process, a riveted tight-fit structure of a heat pipe ore piece is proposed in the patents No. M270636 and No. M316611, which is deformed by a molding die to squash the heat pipe and the fin. The knot, by the touch surface thermal resistance value and achieve the effect of rapid assembly. However, the riveted and tightly-fitted structure, the heat pipes that are matched are all - the heat pipe can meet the needs of equipment such as large-sized radiators such as desktops or servers, but large institutional space For assembly, for thin and light electronic products such as notebook computers and flat brains, it is difficult to apply them to the above-mentioned electricity because of the limitation of the mechanical space. [New Content] The main purpose of this creation is to provide a kind of heat dissipation. It can provide thin and light electricity such as notebook computers or tablet computers. The heat dissipation module using Wuxi soldering process can reduce manufacturing and meet environmental protection requirements. For the above purposes, the heat dissipation module of the present invention has a plurality of heat dissipation fins and at least one heat pipe. These scattered dance 'oil collapse wall oxidation bulletin and heat dissipation forced to reduce the round straight table with its need for plate type electric, factor product module, sub-product cost, including fins with 5 M411603 a fin body, a protrusion, at least a heat pipe piercing portion, at least a pressure piece and at least one second fin buckle point. The fin body has a -th side and a second side. The protruding portion is formed at the side edge of the first side of the fin body, and the protruding portion is bent and plasticized by the heat dissipation tab. The heat pipe through portion is formed at a side edge of the fin body. The calendar is formed on one side of the fin body. The second fin buckle is formed on the second side of the fin body. The heat pipe is threaded through the heat guide opening. Wherein, the heat pipe through-side portion is in the form of a hole with respect to the body of the die, and the heat pipe is in a flat form, and the heat pipe piercing portion corresponds to the heat pipe. Wherein, the protruding portion further forms a first fin buckle point. The first fin buckle point protrudes outward from the protruding portion. The fin body further has at least one first fin buckle, and the first fin buckle protrudes outward from the first side of the fin body. Wherein one end of the tablet forms a pressing portion that is pressed against the heat pipe when the tablet is crimped to the heat pipe. Wherein, the heat pipe through portion corresponds to the fin body in a non-destructive manner, and the heat pipe is in a flat form, and the heat pipe through portion corresponds to the heat pipe. Wherein the body of the Zhao piece and the tablet are surrounded by the heat pipe through portion. Wherein the fin body further has at least one first fin buckle 6 M411603 point, and the first fin buckle point protrudes outward from the first side of the fin body. Wherein, the pressing piece further has a pressing section, and the pressing section protrudes away from the protruding portion, and when the pressing piece is pressed against the flat type heat pipe, the pressing section is deformed toward the protruding part. To force the flat heat pipe. Wherein, the heat-dissipating film is made of copper metal, copper alloy, metal or aluminum alloy. The heat pipe is a copper mesh heat pipe, a grooved heat pipe or a copper powder sintered heat pipe. [Comprehensive method] In order to make your reviewer understand the content of this creation, please refer to the following description. Please refer to FIG. 3, FIG. 4 and FIG. 5, which are schematic views of the exploded view, the combined view and the press-fit assembly of the first embodiment of the heat dissipation module of the present invention. In the figure, the heat dissipation module 2 includes a plurality of heat dissipation fins 21 and a heat pipe 22. Each of the heat dissipation fins 21 has a fin body 211, two first fin buckle points 2 1 2, a protrusion portion 2 1 3 , a heat pipe through portion 2 1 4 , a second pressure piece 215 and two second fins. Chip deduction point 216. The fin body 211 has a first side 2111 and a second side 2 1 1 2 opposite to the second side 2112. 7 M411603 The protruding portion 213 is formed at a side edge of the first side 2111 of the fin body 211. The projections 2 1 3 are formed by bending the fin body together and bending outward. The heat pipe through portion 214 is formed by molding the fin body 211 and formed at a side edge of the fin body 2 11 . In the present embodiment, one side of the periphery of the heat pipe piercing portion 2 1 4 is in an open state' to form a broken hole shape, and its shape is directed to the heat pipe 22. The pressing pieces 215 are formed on the first side of the fin body 2 1 1 and are respectively located on opposite sides of the protruding portions 2 1 3 . In this embodiment, one end of the pressing piece 2 15 forms a pressing portion 2 1 5 1 , and the pressing portion 2 1 5 1 extends from the pressing piece 2 15 toward the inner edge, and corresponds to the protruding portion. 2丨3. The second fin buckles 2 16 are integrally formed on the fin body 2 丨j and formed on the second side of the fin body 2丨丨. ^ The heat pipe 22 is a heat pipe which conforms to the needs of a notebook computer or a tablet computer, and is a flat tube in which a round straight tube is flattened by a jig. When the heat dissipation module 2 is connected to the heat dissipation module 2, the heat dissipation fins may correspond to the mth points 212 corresponding to each other, and the second plurality of film fastening points/16 correspond to each other by a jig (not shown) The assistance is to snap the heat sink fins 21. Next, the heat pipe 22 is bored through the heat pipe piercing portion 214 $. Finally, the pressing piece 215 presses the 8 M411603 portion 2151 "the jig is pressed against the heat pipe 22, so that the pressing portion 2151 is pressed against the heat pipe 22. Since the heat sinking film and the heat pipe are both For pre-formed (pre_frabrUated), the octal difference is very small. The gap between the contact fins of the completed heat dissipating fins and the heat pipe is very small, so as to reduce the contact resistance value. Maintain the overall heat dissipation efficiency of the thermal module.
此外’在本實施例中’肖熱導管22並不以圖式 所不之直型扁管為限’亦可隨實際組裝需求或各機 種機構空間的配置而予以彎折沿伸。此外，該散熱 模組2更可搭配一主動式散熱風扇5來使用，以加 速將熱量由處理晶片上排出，如第6圖所示。 凊參照第7圖、第8圖及第9圖所示，其係為 本創作散熱杈組第二實施例之分解圖、組合圖與壓 片Μ接示意圖。圖中，該散熱模組3包含複數個散 熱鰭片31及一熱導管32。Further, in the present embodiment, the Schottky conduit 22 is not limited to the straight flat tube of the drawings, and may be bent and extended along with the actual assembly requirements or the configuration of the various mechanism spaces. In addition, the heat dissipation module 2 can be used in conjunction with an active cooling fan 5 to accelerate heat from the processing wafer, as shown in Fig. 6. Referring to Fig. 7, Fig. 8, and Fig. 9, it is an exploded view, a combination view, and a splicing diagram of the second embodiment of the heat dissipation group. In the figure, the heat dissipation module 3 includes a plurality of heat dissipation fins 31 and a heat pipe 32.
各該散熱韓片31具有一，鰭片本體311、一第一 鰭片扣點312、一突出部313、一熱導管穿設部314、 二壓片315及二第二鰭片扣點316。其中，該壓片 3 1 5具有一壓制部3丨5 1。 在本實施例中，由於該熱管穿設部3 14、該等壓 片315'該等第二鰭片扣點312及該熱導管22之形 狀與結構與第一實施例相同’在此不再贅述。本實 施例與第一實施例之差異之處在於各該散熱鰭片3ι 僅具有一第一鰭片扣點3 12，且該第一鰭片扣點3 Η 9 M411603 係形成於該突出部313» 而於組裝此散熱模組3時，亦與第一實施例相 同，係先藉由對應之第一鰭片扣點312與第二鰭片 扣點316扣接後，接著再將熱導管32穿設於熱管穿 設部3 1 4 ’最後再使用治具壓迫該壓片3 1 5之壓制 部3151於熱導管32上’藉以緊迫接合該等散熱鰭 片31及該熱導管32。 請參照第10圖、第11圖及第i 2圖，其係為本 創作散熱模組第三實施例之分解圖、組合圖與壓片 壓接示意圖。圖中’該散熱模組4包含複數個散熱 鰭片41及一熱導管42。 每一該散熱鰭片41具有一鰭片本體411、二第 一鰭片扣點412、一突出部41 3、一熱導管穿設部 414、一壓片415及二第二鰭片扣點416。 在本實施例_，由於該鰭片本體411、該等第〆 籍片扣點412、該突出部413及該第二鰭片扣點416 之形狀與結構與第—實施例相同，在此不再贅述。 本實施例與第一實施例差異之處在於該散熱鰭 片41僅具一壓片415,該壓片415由該鰭片本體4U 第一側邊中央部位向外延伸之壓片4 1 5，該熱導管 穿設部414相對該鰭片本體411 ’為一周緣處均成 封閉型態之非破孔型態，且由該麼片4 1 5、該突出 部413及該鰭片本體411所圍繞形成。而該壓片415 之兩側係形成於該鰭片本體4丨丨，並朝中央處沿伸 10 M411603 出一壓迫段4151。該壓迫段4151係朝遠離該突出 部413之方向向外凸伸。使該熱導管穿設部414之 孔徑稍大於該熱導管4 2之外徑，以方便組裝。Each of the heat dissipating Korean sheets 31 has a fin body 311, a first fin buckle point 312, a protruding portion 313, a heat pipe through portion 314, two pressing pieces 315, and two second fin buckle points 316. The sheet 3 15 has a pressing portion 3丨5 1 . In this embodiment, the shape and structure of the second fin buckle point 312 and the heat pipe 22 are the same as those of the first embodiment due to the heat pipe piercing portion 314, the pressing pieces 315', and no longer Narration. The difference between this embodiment and the first embodiment is that each of the heat dissipation fins 3 ι has only one first fin buckle point 3 12 , and the first fin buckle point 3 Η 9 M411603 is formed on the protrusion portion 313 . When the heat dissipation module 3 is assembled, as in the first embodiment, the first fin fastening point 312 is first fastened to the second fin fastening point 316, and then the heat pipe 32 is further removed. The heat pipe insertion portion 3 1 4 ' is finally used to press the pressing portion 3151 of the pressure piece 3 1 5 on the heat pipe 32 to tightly engage the heat dissipation fins 31 and the heat pipe 32. Please refer to FIG. 10, FIG. 11 and FIG. 2, which are schematic views of the exploded view, the combined view and the pressed piece of the third embodiment of the heat dissipation module. In the figure, the heat dissipation module 4 includes a plurality of heat dissipation fins 41 and a heat pipe 42. Each of the heat dissipation fins 41 has a fin body 411 , two first fin buckle points 412 , a protruding portion 41 3 , a heat pipe through portion 414 , a pressing piece 415 , and two second fin buckle points 416 . . In this embodiment, since the shape and structure of the fin body 411, the third chip fastening point 412, the protruding portion 413, and the second fin fastening point 416 are the same as those of the first embodiment, Let me repeat. The difference between the embodiment and the first embodiment is that the heat dissipation fin 41 has only a pressing piece 415, and the pressing piece 415 is a pressing piece 4 1 5 extending outward from a central portion of the first side of the fin body 4U. The heat pipe through portion 414 is in a non-destructive manner in a closed state with respect to the fin body 411 ′, and is formed by the piece 4 1 5 , the protruding portion 413 and the fin body 411 . Formed around. The two sides of the pressing piece 415 are formed on the fin body 4丨丨, and a pressing section 4151 is extended toward the center 10 M411603. The pressing section 4151 protrudes outward in a direction away from the protruding portion 413. The heat pipe through portion 414 has a hole diameter slightly larger than the outer diameter of the heat pipe 42 to facilitate assembly.
當組裝該散熱模組4時，其與第一實施例相同， 係將各散熱鰭片41之該等第一鰭片扣點412相互扣 接’該等第二鰭片扣點4 1 6相互扣接後，以將各散 熱韓片41相互扣接，再將該熱導管42穿設於其中。 接著’將該壓迫段4 1 5 1藉由治具之輔助而朝該突出 部之方向壓迫形變使其朝熱導管42之方向位移，而 迫抵於該扁平型熱導管42。 綜上所述，本創作散熱模組，其功效在於該等 散熱鰭片及該熱導管可藉由壓片緊迫壓接，而得以 實現無錫焊製程之組裝方式，得以降低生產成本、 有毒物質之使用。 ’其另一功效在於該散熱鰭片When the heat dissipation module 4 is assembled, it is the same as the first embodiment, and the first fin buckle points 412 of the heat dissipation fins 41 are fastened to each other. The second fin buckle points 4 1 6 are mutually connected. After the fastening, the heat dissipation fins 41 are fastened to each other, and the heat pipe 42 is inserted therein. Then, the pressing section 4 1 5 1 is pressed and deformed in the direction of the protruding portion by the aid of the jig to be displaced in the direction of the heat pipe 42 to be forced against the flat heat pipe 42. In summary, the heat dissipation module of the present invention has the effect that the heat dissipation fins and the heat pipe can be pressed and pressed by the pressing piece to realize the assembly method of the solderless soldering process, thereby reducing the production cost and the toxic substance. use. 'The other effect is the heat sink fin
降低廢氣排放及減少 本創作散熱模组 係預先沖壓成型，而 接觸面之熱阻值，進 本創作散熱模組 熱導管可呈扁平狀， 電腦荨輕薄短小電子 可大幅降低組裝公差，以降低 而提昇散熱模組之總體效率。 ，其再一功效在於其所搭配之 而可應用於筆記型電腦、平板 裝置上。 已，並非用以限定本創作Z創作之較佳實施例 本創作之精神與範圍 /之範圍，’在不脫 應涵蓋於本創作之直 《均等變化與修飾， 割作之專利範圍内。 M411603 綜上所述，本創作之散熱模組，係具有專利之 創作性，及對產業的利用價值；申請人爰依專利法 之規定，向 鈞局提起新型專利之申請。Reducing exhaust emissions and reducing the heat-dissipation module of this creation is pre-stamped, and the thermal resistance of the contact surface can be flat. The heat pipe of the heat dissipation module can be flat, and the computer can reduce the assembly tolerance by reducing the assembly tolerance. Improve the overall efficiency of the thermal module. Another effect is that it can be applied to notebook computers and tablet devices. The spirit and scope of the present invention are not intended to limit the scope of the present invention, and the scope of the present invention is not limited to the scope of the patents of equal variation and modification. M411603 In summary, the thermal module of this creation has the patented creativity and the value of the use of the industry; the applicant filed a new patent application with the bureau in accordance with the provisions of the Patent Law.
12 M411603 【圖式簡單說明】 第1圖，為習知散熱片依序沖壓結合於熱導管之實 施不意圖。 第2圖，為習知散熱片及熱導管之俯視參考圖。 第3圖，為本創作散熱模組第一實施例之分解圖。 第4圖，為本創作散熱模組第一實施例之組合圖。 第5圖，為本創作散熱模組第一實施例之壓片壓接 組配示意圖。 第6圖，為本創作散熱模組之組配於筆記型電腦之 示意圖。 第7圖，為本創作散熱模組之第二實施例之分解圖。 第8圖，為本創作散熱模組之第二實施例之組合圖。 第9圖，為本創作散熱模組之第二實施例之壓片壓 接示意圖。 第1 0圖，為本創作散熱模組之第三實施例之分解 圖。 第11圖，為本創作散熱模組之第三實施例之組合 圖。 第1 2圖，為本創作散熱模組之第三實施例之壓片壓 接示意圖。 【主要元件符號說明】 10 散熱片 11 熱導管 M411603 12 轴 孔 2 散 孰 ”》、 模 組 21 散 孰 ”、、 H 片 2 11 鰭 片 本 體 2111 第 一 侧 邊 2112 第 二 侧 邊 212 第 一 籍 片 扣 點 213 突 出 部 214 熱 導 管 穿 設 部 215 壓 片 2151 壓 制 部 216 第 二 縛 片 扣 點 22 熱 導 管 3 散 熱 模 組 3 1 散 熱 縛 片 3 11 鰭 片 本 體 3 12 第 一 鰭 片 扣 點 3 13 突 出 部 3 14 熱 導 管 穿 ^n. ό又 部 315 壓 片 3151 壓 制 部 3 16 第 二 鰭 片 扣 點 32 埶 導 管 4 散熱 模 組 M41160312 M411603 [Simple description of the drawings] Fig. 1 is a schematic view of the conventional heat sinks being sequentially stamped and bonded to the heat pipes. Figure 2 is a top plan view of a conventional heat sink and heat pipe. FIG. 3 is an exploded view of the first embodiment of the heat dissipation module of the present invention. Fig. 4 is a combination diagram of the first embodiment of the heat dissipation module of the present invention. Fig. 5 is a schematic view showing the assembly of the pressure piece crimping assembly of the first embodiment of the heat dissipation module of the present invention. Figure 6 is a schematic diagram of the assembly of the heat dissipation module of the present invention in a notebook computer. Figure 7 is an exploded view of the second embodiment of the heat dissipation module of the present invention. Figure 8 is a combination diagram of a second embodiment of the heat dissipation module of the present invention. Fig. 9 is a schematic view showing the compression of the tablet according to the second embodiment of the heat dissipation module of the present invention. Fig. 10 is an exploded view of the third embodiment of the heat dissipation module of the present invention. Figure 11 is a combination diagram of a third embodiment of the heat dissipation module of the present invention. Figure 12 is a schematic view of the compression of the tablet according to the third embodiment of the heat dissipation module of the present invention. [Main component symbol description] 10 Heat sink 11 Heat pipe M411603 12 Axle hole 2 Dimming", Module 21 Dimming", H piece 2 11 Fin body 2111 First side 2112 Second side 212 First Chip fastening point 213 Projection portion 214 Heat pipe piercing portion 215 Pressing piece 2151 Pressing portion 216 Second chip fastening point 22 Heat pipe 3 Heat dissipation module 3 1 Heat dissipation plate 3 11 Fin body 3 12 First fin buckle Point 3 13 Projection 3 14 Heat pipe piercing ^n. όPart 315 Pressing piece 3151 Pressing part 3 16 Second fin point 32 埶Conduit 4 Heat dissipation module M411603
41 散熱鰭片 4 11 鰭片本體 412 第一鰭片扣點 413 突出部 414 熱導管穿設部 415 壓片 4151 壓迫段 4 16 第二鰭片扣點 42 熱導管 5 主動式散熱風扇 Cl 間隙41 Heat sink fins 4 11 Fin body 412 First fin buckle point 413 Projection 414 Heat pipe through section 415 Presser 4151 Pressing section 4 16 Second fin buckle point 42 Heat pipe 5 Active cooling fan Cl Clearance
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