1303971 九、發明說明： 【發明所屬之技術領域】 本發明之直組式熱傳遞散熱裝置製法，尤 過組件緊結技術以結合製作具開放區，外露 管直接熱接合於電子元件，以形成熱能傳遞 熱裝置製作方法，具有改善組件緊結性、熱 及降低成本。 【先前技彳标】 已知，目前所應用於電子元件之散熱裝置 要求較佳散熱效率之散熱裝置1，都是透過 1與散熱鰭片1 2組成，再透過熱導管1 1 所結合之導熱底座13與電子元件2形成面 合，以快速傳遞電子元件2產生之熱能，經 1 1傳遞至多數散熱鰭片1 2作大面積的熱 言之，熱導管1 1與導熱底座1 3之結合設 度等，都將直接反應與電子元件2間之熱 率，當然在製作及組件成本有較高。 又，如第一 A圖所示，為本國專利公報j 號之「包含有熱導管之散熱裝置的衝壓緊結 型專利案，此專利案所訴求之重點乃是在底 頂面具有至少一凹溝1 5 ，異於凹溝1 5的 多道凹槽1 6 ，熱導管1 7預置於凹溝1 5 指一種透 部份熱導 配置之散 傳遞效率 ，尤其是 熱導管1 延伸一端 積式熱接 由熱導管 發散，換 計與密合 源傳遞效 % M268112 構造」新 座1 4的 軸向成型 中，以及 5 1303971 散熱is之縛片1 8對應插入凹槽1 6 ，同時壓擎 管1 7定位於底座1 4上，藉成型模具衝壓鳍片 兩侧之底座1 4表面，令其受壓產生外擴形變， 片1 8得與底座1 4鉚合，且將熱導管1 7緊結 於鰭片1 8和底座1 4間。 上述之專利案仍需透過底座與電子元件熱結# 言之，仍具有熱導管與底座間之緊結密合度及熱 _ 效率問題。 【發明内容】 本發明之主要目的，在於解決上述傳統缺失， ” 明散熱裝置及其組件間之緊結方法重新設計，搭 Λ 卓的治具架構、施壓技術及組件緊結，以形成免 底座結合’而直接由製成之散熱裝置一開放區外 導熱管與電子元件直接熱結合傳遞熱能發散，對 φ 裝f之組件緊結方法及其製成品，改善組件緊結 熱傳遞效率及降低成本，以提供使用者更低廉但 熱姝率與緊迫結合之實用散熱裝置。 為達上述目的，本發明之直組式熱傳遞散熱 製法’該方法步驟包括：提供多數具上、下結合 第〆散熱鰭片，以及多數具上結合孔與下置槽之 散熱鑛片’利用所設之扣件扣集形成間距排列並 熱導 1 8 使鰭 定位 ‘，換 傳遞 本發 配簡 導熱 露之 散熱 性、 南傳 裝置 孔之 第二 具有 6 1303 971 一内凹開放區之鰭片組，於一熱管結合步驟，將 一熱導管穿置於上述鰭片組之上、下結合孔及下 而部份外露於開放區，接著，於一緊迫結合步驟 用一沖模裝置暨其多數沖壓件配合沖壓技術，對 熱鰭片與熱導管對應之預設緊結位置施以沖壓強 以形成預設繁結位置及熱導管之變形迫緊結合一 完成具開放區由熱導管以直接熱接合電子元件熱 散熱之散熱裝置製成品。 請參閱以下有關本發明一較佳實施例之詳細 及其附圖，將可進一步瞭解本發明之技術内容及 的功效；有關該實施例之附圖。 【實施方式】 茲有關本發明之技術内容及詳細說明，現配 式說明如下： 請參閱第二至七圖所示，係本發明之直組式 遞散熱裝置製法一實施例的製程步驟及其製成品 圖，如圖所示：本發明之直組式熱傳遞散熱裝置絮 其步驟至少包括： 步驟一之鰭片結合步驟： 提供多數第一散熱鰭片3 ，表面鏡射成型至 上、下結合孔3 1、3 2及連通於上結合孔3 1 槽3 3 ，穿槽3 3與上結合孔3 1間設有緊結單 4 ; 至少 置槽 ，利 各散 力， 體； 傳遞 說明 其目 合圖 熱傳 不意 法， 少一 之穿 元3 7 1303971 上述之上、下結合孔3 1、3 2於其一端面更 括設有環突壁3 1 1 、321 ，以增加與熱導管6 緊結面積與緊密性，上結合孔3 1之環突壁3 1 1 設有一缺口 3 1 2與穿槽3 3對應，另，前述之緊 單元3 4是由第一散熱鰭片3表面成型之二個獨立 對應之壓片3 4 1 、3 4 2所構成； 提供多數第二散熱趱片4，表面鏡射成型至少 上結合孔4 1 、下置槽4 2及連通於上結合孔4 1 穿槽4 3 ，穿槽4 3與上結合孔4 1間設有緊結單 4 4; 上述之上結合孔41於其一端面更包括設有環 壁4 1 1 ，以增加與熱導管6之緊結面積與緊密性 環突壁4 1 1更設有一缺口 4 1 2與穿槽4 3對應 下置槽4 2較佳是一半圓形、圓5瓜或弧形凹部，於 一端設有弧突壁4 2 1以增加與熱導管6之接觸 積；另，前述之緊結單元44是由第二散熱鰭片4 面成型之二個獨立、對應之壓片4 4 1 、4 4 2所 成； 將上述多數第一及第二散熱鰭片3 、4利用其 侧端成型之扣件3 0、4 0扣集形成間距排列，並 有一内凹開放區5 0之鰭片組5 ; 包 之 更 結 之 元 突 y f 其 面 表 構 於 具 8 Ι3Ό3971 前述之開放區5 0較佳是利用多數第二散熱鰭片 4結合，而配置於多數第一散熱鰭片3結合之中間位 置，如第七圖所示，當然並不因此對本發明製作方法 形成限制； 步驟二之熱管結合步驟： 將至少一熱導管6穿置於上述鰭片組5之上、下 結合孔31、41 、32及下置槽42 ，換言之，該 導熱管6之一端與第二散熱鰭片4是部份靠置於下置 槽4 2而部份外露於上述之開放區5 0 ，如第三圖所 示； 步驟三之緊迫治具配置： 提供一緊迫治具7，至少包含一上、下二沖壓件 7 1 、7 2 ，如第三圖所示，其中該上沖壓件7 1具 有至少一可通過上述穿槽33、43之壓部71 1 ， 以對應緊結單元4 4及熱導管6沖壓緊結一起，下沖 壓件7 2則具有一模突部7 2 1對應於上述開放區5 0，模突部7 2二侧則分別對應每一下結合孔3 2設 有壓突部722 ，如第三、四圖所示； 步驟四之緊迫結合步驟： 應用壓力施加技術及其機具設備，如高度沖壓技 術，對上述緊迫治具7及其上、下二沖壓件7 1 、7 2施以強力沖壓作用力，由上沖壓件7 1之壓部7 1 1通過上述穿槽3 3、43而緊迫緊結單元44及熱 導管6產生變形緊結一起，同時，下沖壓件7 2亦應 9 1303971 用沖壓作用力，由其壓突部7 2 2對鰭片組5暨每一 第一散熱鰭片3之下結合孔3 2沖壓，與熱導管6同 步產生變形緊結一起，並由其模突部7 2 1對外露於 開放區5 0之熱導管6端面沖壓，以形成一熱接合平 面，如第五、六圖所示，可以直接或進一步配合導熱 膏以直接熱接合於電子元件8; .當然在其他具體實施例結構中，該下沖壓件7 2 亦可不設有模突部7 2 1對外露於開放區5 0之熱導 管6端面沖壓，而是配合在該開放區5 0之熱導管6 > 間塗覆以導熱膏（圖中未繪示），以形成一熱接合面與 電子元件8熱結合配置； 步驟五：將緊迫治具7退出後，完成具有一開放 區5 0 ，外露部份熱導管6之散熱裝置5製成品，換 言之，可直接應用該開放區5 0所外露之熱導管.6 ， 或進一步配合導熱膏（圖中未繪示）而直接熱接合於 電子元件8以高效率傳遞熱能至鰭片組5發散（如第 七、七A圖），以改善與導熱底座之熱緊結性與熱傳遞 > 效率問題，亦可降低組裝及組件成本。 再請參閱第八圖所示，係本發明之直組式熱傳遞 散熱裝置製法的製程步驟之另一製成品實施例示意 圖，如圖所示：根據本發明之直組式熱傳遞散熱裝置 製法，於上述步驟二之熱管結合步驟，可進一步提供 一熱導管6 ，具有突延彎折部6 1適與上述鰭片組5 之開放區5 0對應，換言之，根據上述製程步驟緊結 組成後，突延彎折部6 1正突設於開放區5 0形成一 10 1303971 熱接合面，可與上述實施例相同之直接，或進一步 合導熱膏而熱接合於電子元件8 ，不需如習知再透 導熱底座緊結與熱接合。 上列詳細說明係針對本發明之一可行實施例之 體說明，惟該實施例並非用以限制本發明之專利 圍，凡未脫離本發明技藝精神所為之等效實施或 更，例如：等變化之等效性實施例，均應包含於本 之專利範圍中。 綜上所述，本案不但在方法步驟與緊結型態上確 創新，並能較習用物品增進上述多項功效，應已充 符合新穎性及進步性之法定發明專利要件，爰依法 出申請，懇請 貴局核准本件發明專利申請案，以 創作，至感德便。 【圖式簡單說明】 第一圖為習知散熱裝置之緊結組成製成品示意圖。 第一A圖為另一習知散熱裝置之組合示意圖。 第二圖為本發明一實施例方法步驟一暨緊結前組件 解示意圖。 第三圖為本發明一實施例方法與緊迫治具於緊結施 前之示意圖。 第四圖為本發明一實施例方法之熱導管與鰭片組緊 配 過 具 範 變 案 屬 分 提 勵 分 作 結 11 Ι3Ό3971 前示意圖。 第五圖為本發明一實施例方法與緊迫治具於緊結施作 後之示意圖。 第六圖為本發明一實施例方法之熱導管與鰭片組緊結 後之示意圖。 第七圖為本發明一實施例方法緊結製作後之製成品示 意圖。 第七A圖為本發明一實施例方法緊結製作後之製成品 和熱源貼合示意圖。 第八圖為本發明方法緊結製作後之另一製成品實施例 示意圖。 12 1303971 【主要元件符號說明】 習知主要元件符號說明： 散熱裝置--- 1 電子元件------------2 熱導管------------11 散熱鰭片-------- 12 導熱底座------一一一一一1 3 底座 -------------1 4 凹溝-------------15 凹槽-------------16 熱導管-------------17 籍片 1 8 本發明主要元件符號說明：</ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> < Desc/Clms Page number> The method of manufacturing a thermal device has the advantages of improving component tightness, heat, and cost. [Previous technical standard] It is known that the heat dissipating device 1 which is currently applied to the heat dissipating device of the electronic component requires a heat dissipating efficiency, and is composed of a heat radiating fin 1 and a heat radiating fin 1 The base 13 is combined with the electronic component 2 to quickly transfer the thermal energy generated by the electronic component 2, and is transmitted to the majority of the heat dissipating fins 1 through 1 1 for a large area, and the heat pipe 1 1 is combined with the heat conducting base 13 The setting degree, etc., will directly reflect the heat rate between the electronic component 2 and the manufacturing device and the component cost. Moreover, as shown in FIG. A, it is a stamping and tight type patent case including a heat pipe heat sink of the national patent publication No. J. The focus of the patent application is to have at least one groove on the bottom surface. 1 5 , a plurality of grooves 16 different from the groove 1 5 , the heat pipe 17 is preset in the groove 1 5 refers to a partial transfer efficiency of the partial heat conduction configuration, especially the heat pipe 1 extends one end product The heat connection is diverged by the heat pipe, and the transfer efficiency is changed to the tight source. M268112 is constructed in the axial forming of the new seat 1 4, and the 5 1303971 heat-dissipating piece 18 is inserted into the groove 16 and the pressure tube 1 is simultaneously pressed. 7 is positioned on the base 14 and the surface of the base 14 on both sides of the fin is stamped by a molding die, so that it is compressed and deformed, and the piece 18 is riveted with the base 14 and the heat pipe 17 is fastened to Between the fins 1 8 and the base 14 . The above patent still needs to be thermally coupled through the base and the electronic component, and still has the tightness of the heat pipe and the base and the heat_efficiency problem. SUMMARY OF THE INVENTION The main object of the present invention is to solve the above-mentioned conventional deficiencies, "the re-design of the tight-fitting method between the heat-dissipating device and its components, the fixture structure, the pressing technology and the assembly tightness of the joints to form a joint-free combination. 'And directly from the heat sink made of an open area, the heat pipe directly communicates with the electronic component to transfer heat energy, and the assembly method of the component of the φ package and its finished products improve the heat transfer efficiency of the component and reduce the cost to provide A practical heat sink device that is cheaper but has a combination of heat and pressure. To achieve the above object, the direct heat transfer heat dissipation method of the present invention includes the steps of: providing a plurality of upper and lower combined heat dissipation fins. And most of the heat-dissipating slabs with the upper and lower slots are formed by using the fasteners arranged to form a pitch and heat-conducting 1 8 to position the fins, and transferring the heat dissipation of the heat-dissipating heat-dissipating device, the south transmission device The second hole has a fin set of 6 1303 971 a concave open area, and a heat pipe is placed on the fin in a heat pipe bonding step The upper and lower joint holes and the lower portion are exposed in the open area, and then, in a pressing bonding step, a die assembly and a plurality of stamping parts are combined with the stamping technology, and the preset tightening position corresponding to the heat fin and the heat pipe is applied. The stamping is strong to form a preset tangled position and the deformation of the heat pipe is tightly combined with a heat sink device having an open area by a heat pipe for directly thermally joining the heat dissipation of the electronic component. Please refer to the following preferred embodiment of the present invention. For a detailed description of the examples and the accompanying drawings, the technical contents and the functions of the present invention can be further understood; the drawings of the embodiments are provided. [Embodiment] The technical content and detailed description of the present invention are as follows: Please refer to the second to seventh embodiments, which are the process steps and the finished product diagram of an embodiment of the method for manufacturing the direct heat transfer device of the present invention, as shown in the figure: the direct heat transfer heat dissipation device of the present invention The method includes the following steps: Step 1 of the fin bonding step: providing a plurality of first heat dissipating fins 3, mirroring the surface to the upper and lower bonding holes 3 1 and 3 2 and communicating with the upper bonding holes 3 1 slot 3 3 , between the slot 3 3 and the upper joint hole 3 1 is provided with a tight joint 4; at least the slot is provided, and the force is scattered, and the body is conveyed; the transmission indicates that the heat transfer is not intended, and the wearer is less than one. 3 7 1303971 The upper and lower coupling holes 3 1 , 3 2 further include annular protruding walls 3 1 1 , 321 on one end surface thereof to increase the tightness and tightness with the heat pipe 6 , and the upper bonding hole 3 1 The ring protruding wall 3 1 1 is provided with a notch 3 1 2 corresponding to the through groove 3 3 , and the aforementioned tight unit 34 is two independent corresponding pressing pieces 3 4 1 , 3 formed by the surface of the first heat radiating fin 3 . 4 2 is configured; a plurality of second heat dissipating fins 4 are provided, and at least the upper bonding hole 4 1 , the lower groove 4 2 and the upper bonding hole 4 1 through the slot 4 3 are formed by surface mirroring, and the through slot 4 3 is combined with the upper surface. Between the holes 41, there is a splicing unit 4 4; the upper coupling hole 41 further includes a ring wall 41 1 at one end surface thereof to increase the tight area with the heat pipe 6 and the tight ring wall 4 1 1 A notch 4 1 2 is provided corresponding to the groove 4 3 , and the lower groove 4 2 is preferably a semicircular, round 5 or curved concave portion, and an arcuate wall 42 1 is provided at one end to increase the connection with the heat pipe 6 In addition, the foregoing fastening unit 44 is formed by two independent and corresponding pressing pieces 4 4 1 and 4 4 2 formed by the second heat dissipating fins 4; the plurality of first and second heat dissipating fins 3 are 4, using the fasteners formed at the side ends thereof, the buckles are arranged to form a pitch arrangement, and a fin group 5 having a concave open area 50; the knot of the package is formed by the yf. Ι3Ό3971 The open area 50 is preferably formed by combining a plurality of second heat dissipating fins 4, and is disposed at an intermediate position of a plurality of first heat dissipating fins 3, as shown in FIG. 7, of course, the method of the present invention is not Step 2: heat pipe bonding step: at least one heat pipe 6 is placed on the above fin group 5, the lower bonding holes 31, 41, 32 and the lower groove 42, in other words, one end of the heat pipe 6 The second heat dissipating fin 4 is partially disposed on the lower groove 42 and partially exposed in the open area 50 as shown in the third figure; the third step is the jig configuration: providing a pressing jig 7 , comprising at least one upper and lower stamping parts 7 1 , 7 2 , as shown in the third figure, wherein The stamping member 71 has at least one pressing portion 71 1 which can pass through the through grooves 33 and 43 , and is pressed and pressed together with the pressing unit 44 and the heat pipe 6 , and the lower stamping member 7 2 has a die protrusion 7 2 1 corresponding thereto. In the open area 50, the two sides of the mold protrusion 7 2 are respectively provided with a pressure protrusion 722 corresponding to each lower joint hole 3 2 , as shown in the third and fourth figures; the step of pressing the step 4: applying pressure application technology And the implement equipment thereof, such as the high-stamping technique, applies a strong punching force to the above-mentioned pressing jig 7 and its upper and lower stamping parts 7 1 , 7 2 , and passes the above-mentioned pressing part 7 1 1 of the upper stamping part 7 1 The groove 3 3, 43 is tightly pressed and the heat-tightening unit 44 and the heat pipe 6 are deformed and tightly joined together. At the same time, the lower punching member 7 2 should also be 9 1303971 by the punching force, and the pressure protrusion 7 2 2 is used for the fin group 5 Each of the first heat dissipating fins 3 is punched by the bonding hole 32, and is deformed and tightly combined with the heat pipe 6 and is stamped by the die protrusion 7 2 1 to the end face of the heat pipe 6 exposed to the open area 50. Forming a thermal bonding plane, as shown in the fifth and sixth figures, may directly or further cooperate with the thermal paste Directly thermally bonded to the electronic component 8; Of course, in other embodiments, the lower stamping member 7 2 may not be provided with the die protrusion 7 2 1 to be exposed to the end face of the heat pipe 6 exposed in the open region 50, but Cooperating with the heat pipe 6 > in the open area 50 is coated with a thermal paste (not shown) to form a thermal bonding surface and the electronic component 8 is thermally coupled; Step 5: withdrawing the pressing jig 7 Thereafter, the heat sink 5 having an open area 50 and the exposed portion of the heat pipe 6 is finished, in other words, the heat pipe exposed in the open area 50 can be directly applied. 6 or further combined with a thermal paste (not shown) Directly thermally bonded to the electronic component 8 to transfer thermal energy with high efficiency to the fin group 5 to divergence (such as Figures 7 and 7A) to improve the heat tightness and heat transfer with the thermally conductive base. Reduce assembly and component costs. Referring to FIG. 8 again, it is a schematic view of another manufacturing embodiment of the manufacturing process of the direct heat transfer heat dissipating device of the present invention, as shown in the drawing: a method for manufacturing a direct heat transfer heat dissipating device according to the present invention. Further, in the heat pipe bonding step of the above step 2, a heat pipe 6 may be further provided, and the protruding bending portion 61 is adapted to correspond to the open area 50 of the fin group 5, in other words, after the composition is tightly assembled according to the above process steps, The protruding bending portion 6 1 is formed in the open region 50 to form a 10 1303971 thermal bonding surface, which can be directly bonded to the electronic component 8 directly or in combination with the thermal conductive paste, as in the prior art. The heat-transmissive base is then tightly bonded to the heat. The above detailed description is intended to be illustrative of a possible embodiment of the present invention, and is not intended to limit the scope of the invention. Equivalent embodiments are to be included in the scope of this patent. In summary, this case is not only innovative in method steps and tight-fitting styles, but also can enhance the above-mentioned multiple functions compared with the conventional articles. It should be filled with the statutory invention patents that meet the novelty and progress, and apply for it according to law. The bureau approved the application for the invention patent, in order to create it. [Simple description of the drawings] The first figure is a schematic diagram of the finished components of the conventional heat dissipating device. The first A is a schematic diagram of a combination of another conventional heat sink. The second figure is a schematic diagram of the steps of the first step and the pre-tightening of the method according to an embodiment of the present invention. The third figure is a schematic view of a method and an emergency jig in accordance with an embodiment of the present invention. The fourth figure is a schematic diagram of the heat pipe and the fin set of the method according to an embodiment of the present invention, and the front view of the entangled component of the heat exchanger is divided into 11 Ι3Ό3971. The fifth figure is a schematic view of a method and a pressing jig according to an embodiment of the present invention. The sixth figure is a schematic view of the heat pipe and the fin set of the method according to an embodiment of the present invention. Fig. 7 is a schematic view showing the finished product after the method is compacted according to an embodiment of the present invention. Figure 7A is a schematic view showing the bonding of the finished product and the heat source after the method is compacted according to an embodiment of the present invention. Figure 8 is a schematic illustration of another embodiment of the finished article after the method of the present invention has been compacted. 12 1303971 [Explanation of main component symbols] Conventional main components Symbol Description: Heat sink --- 1 Electronic components ------------ 2 Heat pipes ------------ 11 Heat sink fins --- 12 12 Thermal base ------1111 1 3 Base -------------1 4 Groove---- ---------15 Groove -------------16 Heat pipe -------------17 Film 1 8 Main components of the invention Symbol Description:
第 -— 散 熱 鰭 ^ - 3 第 二 散 熱 鰭 #---- 4 縛 片 組 5 熱 導 管 6 緊 迫 治 具 7 電 子 元 件 8 扣 件 ---3 0、4 0 上 結 合 孔 ---3 1 、4 1 13 Ι3Ό3971 下、结合孑匕一一-----— — — — —32 穿槽一----------33 、43 緊結單元---------34、44 下置槽--------------4 2 開放區一一一_ 一 ~~ 一 一 一一 一 一 一 5 0 突延彎折部------------6 1 上沖壓件------------71 下沖壓件------------7 2 環突壁----311、321、411 ---3 1 2 、4 壓片一 341、34 2、441、442 弧突壁 4 2 壓部 7 模突部 7 2 壓突部 7 2 2 14No. - Heat sink fin ^ - 3 Second heat sink fin #---- 4 Binder set 5 Heat pipe 6 Tight fixture 7 Electronic component 8 Fastener ---3 0, 4 0 Upper coupling hole - 3 1 , 4 1 13 Ι3Ό3971, combined with 孑匕一一----------32 through slot one----------33, 43 tight unit --------- 34,44 under the slot --------------4 2 open area one by one _ one ~ ~ one one one one one one 5 0 sudden bend part ----- -------6 1 Upper stamping parts ------------71 Lower stamping parts ------------7 2 Ring protruding wall----311 , 321, 411 -- - 3 1 2 , 4 tablet 341 , 34 2 , 441 , 442 arcuate wall 4 2 pressing portion 7 die protrusion 7 2 pressure protrusion 7 2 2 14