TWM315365U - Support mechanism for heat dissipation module - Google Patents

Support mechanism for heat dissipation module Download PDF

Info

Publication number
TWM315365U
TWM315365U TW96201778U TW96201778U TWM315365U TW M315365 U TWM315365 U TW M315365U TW 96201778 U TW96201778 U TW 96201778U TW 96201778 U TW96201778 U TW 96201778U TW M315365 U TWM315365 U TW M315365U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
hole
dissipation module
heat
bracket mechanism
Prior art date
Application number
TW96201778U
Other languages
Chinese (zh)
Inventor
Shr-Ping Luo
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW96201778U priority Critical patent/TWM315365U/en
Publication of TWM315365U publication Critical patent/TWM315365U/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M315365 八、新型說明: 【新型所屬之技術領域】 本創作係有關於-種「散熱模組之支架機構」,尤指—種應用於電 子散熱設備的散熱模組的支架機構。 【先前技術】 • 按’如第1、2圖所示為第一種習知散熱模組的支架機構10, 包含有一框體1卜該框㈣内具有-透孔1U,框體n外則設 有複數支撐部12 ’靠近支撐部12的一端開設透孔121,一導熱片 13較佳細製成’該導熱片13具有—基部131及連接該基部⑶ 之-受接部132 ’該受接部132面積略小於基部131,並且該受接 部132恰好對應裳設於透孔lu内,則該基部i3i鄰接受接部脱 的一面1311靠置該框體η。 上述又接4132相反基部131的第一面(321開設有至少一溝 槽1322’而該基部131相反受接部132的第:面㈣則為一平面 •以貼設於一發熱單元(圖中未示)上,且前述第一面·至第二 .f 1312的厚度相較該框體Η厚,即該_ 13的兩外端面分別 问出忙體11的兩側’另外前述基部131及受接部版與框體Μ 的接觸處塗設有銲劑14,以利用鲜接加工將導熱片13與框體^ 結合。 續參閱第3圖所示,一散熱模組15具有至少一導熱管16及 複數片17 4導熱管16具有一受熱端16ι及一發熱端心該 5 .M315365 籍片Π則套設在_管16上,且該鰭片17對應上述導熱片i3 的受接部132開設一凹口 171,則導熱管16對應凹口 171的受熱 端161部分外露,並對應接合於前述溝槽1322,進而該支架機構 10與該散熱模組15連結。 再者至少一固接元件18其一端具一頭部181,另一端則具一 連結部182 ’ 一彈性元件19套設在固接元件18的外周,該連結部 182較佳為螺紋(如本圖所示;產生鎖附固定)或卡楔(產生卡合 • @定),將固接元件18具有連結部182之-端穿設前述支撐部12 之透孔121,則前述彈性元件19對應置於該頭部181與支撐部12 間,藉由該固接元件18將支架機構1〇與散熱模組15結合在一電 性板體上(無圖示)。 另外如第4、5圖所示為第二種習知散熱模組的支架機構,包 含一導熱片51’該導熱片51的一面為平面以貼設於一發熱單元(無 圖不)上,相反的一面則開設有至少一溝槽511,並在該導熱片 • 51的兩侧分別開設一楔槽512,兩支樓部52,該支樓部52的兩端 • 分別設有一腳部521 ’並在該腳部521上開設透孔522,且該支撐 部52對應前述楔槽512處設有一舌板523,在舌板523及楔槽512 的接觸處塗設銲劑53 (如第5圖),並經由該舌板523對應插合於 楔槽512内,再利用銲接加工將導熱片51與支撐部52結合一體。 惟上述習知揭示的兩種支架機構在實際使用上有其問題存 在,因為所述的框體11及支撐部52為合金材質製成以具有相當 強度支撐散熱模組,而導熱片13、51為銅製,因此在使用銲接加 6 M315365 式令前述兩者結合酸支卿銲須先經電鍍處理,已 、生一電链層’才能令銲劑U、53附著在框體11及支撐部52上, 進而輿 ^…、月13、51銲接固合,故製造流程過於繁瑣,且製成士 成品的時間冗長,造成產量短缺。 、 " 另外該導熱片 較厚,以與框體11 政果。 13、51為令該銲劑14、53附著,故體積必須 及支撐部52有-較大_著面積,維持黏固M315365 VIII. New Description: [New Technology Area] This creation is about the "bracket mechanism of the heat dissipation module", especially the bracket mechanism used for the heat dissipation module of the electronic heat dissipation device. [Prior Art] • As shown in Figures 1 and 2, the bracket mechanism 10 of the first conventional heat dissipation module includes a frame 1 having a through hole 1U in the frame (4) and a frame n outside. A plurality of support portions 12 are disposed near one end of the support portion 12, and a through hole 121 is formed. A heat conductive sheet 13 is preferably thinned. The heat conductive sheet 13 has a base portion 131 and a receiving portion 132 that connects the base portion (3). The connecting portion 132 is slightly smaller than the base portion 131, and the receiving portion 132 is disposed in the through hole lu, and the side portion 1311 of the base portion i3i adjacent to the receiving portion is disposed against the frame n. The first surface of the opposite base portion 131 is connected to the first surface (321 is provided with at least one groove 1322'), and the first surface (4) of the base portion 131 opposite to the receiving portion 132 is a flat surface to be attached to a heat generating unit (in the figure) Not shown, and the thickness of the first surface to the second portion f 1312 is thicker than the frame body, that is, the two outer end faces of the _ 13 respectively ask the two sides of the busy body 11 'the other base portion 131 and The contact portion of the receiving part and the frame 涂 is coated with a flux 14 to combine the heat conductive sheet 13 with the frame body by the fresh joining process. Continuing to refer to FIG. 3, a heat dissipation module 15 has at least one heat pipe. 16 and a plurality of sheets 17 4 the heat pipe 16 has a heat receiving end 16 ι and a heat generating end. The M 315 365 piece is sleeved on the tube 16 , and the fin 17 corresponds to the receiving portion 132 of the heat conducting piece i3 . When the recess 171 is opened, the heat conducting tube 16 is partially exposed to the heat receiving end 161 of the recess 171, and is correspondingly coupled to the groove 1322, and the bracket mechanism 10 is coupled to the heat dissipation module 15. Further, at least one fixing component 18 has a head 181 at one end and a joint portion 182 ′ at the other end. An elastic element 19 is sleeved on the fixed element. The outer periphery of the 18, the connecting portion 182 is preferably threaded (as shown in the figure; the lock is fixed) or the wedge (the snap is formed), and the fixing member 18 has the end of the connecting portion 182. The through hole 121 of the support portion 12 is disposed between the head portion 181 and the support portion 12, and the bracket member 1 is coupled to the heat dissipation module 15 by an electrical component. In addition, as shown in Figures 4 and 5, the bracket mechanism of the second conventional heat dissipating module includes a heat conducting sheet 51'. One side of the heat conducting sheet 51 is flat to be attached to a heat generating portion. The unit (not shown) has at least one groove 511 on the opposite side, and a wedge groove 512, two branch portions 52, and two of the branch portions 52 are respectively opened on both sides of the heat conducting sheet 51. The end portion is provided with a leg portion 521 ', and a through hole 522 is defined in the leg portion 521, and the support portion 52 is provided with a tongue plate 523 corresponding to the wedge groove 512, and is coated at the contact portion of the tongue plate 523 and the wedge groove 512. A flux 53 (as shown in FIG. 5) is provided, and is inserted into the wedge groove 512 via the tongue plate 523, and the heat conductive sheet is processed by welding. 51 is integrated with the support portion 52. However, the two bracket mechanisms disclosed above have problems in practical use because the frame body 11 and the support portion 52 are made of an alloy material to support the heat dissipation mold with considerable strength. Group, and the thermal conductive sheets 13, 51 are made of copper, so the use of welding plus 6 M315365 type so that the two combined with acid branch welding must first be electroplated, has an electric chain layer 'to make the flux U, 53 attached The frame body 11 and the support portion 52 are welded and fixed to each other, and the months 13, 51 are welded, so that the manufacturing process is too cumbersome, and the time for making the finished product is long, resulting in a shortage of production. , " In addition, the thermal pad is thicker, with the body of the frame 11. 13, 51 is to make the flux 14, 53 adhere, so the volume must be and the support portion 52 has a larger - area to maintain the adhesion

under

,Ί^銅金屬的資源日益減少,而需求量日益増多的情況 ,若能減少導熱片的體積則意味著減少銅材的使用量,故前述 之結構會造成材料成本的增加。 …緣是’據赴述㈣品贿生的各躲點,本案之創作人 =蝎其心智,以從事該行業多年之經驗,潛心研究加以創新改良, 、、、於成功研發完成本件「散麵組之支架 致增進之創作。 」業實為-具功The resources of copper metal are decreasing, and the demand is increasing. If the volume of the thermal conductive sheet is reduced, it means that the amount of copper used is reduced. Therefore, the above structure causes an increase in material cost. ...The reason is that according to the various points of the bribes, the creators of this case = 蝎 心 心 ,, who have been engaged in the innovation and improvement of the industry for many years of experience in the industry, The support of the group leads to the creation of the promotion.

【新型内容】 爰此,為有效解紅述之問題,糊作之主要目的乃係在提 二-種不須銲接即能令一導熱片直接固結的支架機構,以減少製 造步驟及導熱片的厚度方向的體積。 為達上述之目的,本創作係提供—種散軸組之支架機構, =框體’其-面具-安置孔’另—面設至少—凸部,該凸部連 月'漢框體並對應構置於前述安置孔的兩側,至少一接合部設於 7 M315365 該凸部對應該安置孔的-側面上;一導熱片,靠置於對應該安置 孔之凸部上,且該導熱片對應前述接合部處設有至少一貫口與該 接合部穿合,並固結在該安置孔中;及複數支撐部,其一端分別 與上述框體連接,另一端則向外凸伸。 本創作之上述目的及其結構與魏上哺性,將依據所附圖 式之較佳實施例予以說明。 【實施方式】 本創作係提供-種「賴她之支織構」,_係為本創作 之-較佳實麵,請參閱第6、7圖示該支賴構⑼包含有一 框體2卜-導熱25及複數支撐部22,雜體21之—面具一安 置孔21卜另一面之兩侧各設有一凸部23,並在兩凸部烈間形成 -凹口 24,該凸部23連接前述框體2卜並對應置於前述安置孔 211的兩側’且該凹口 24對應該安置孔211處則連通該安置孔 211 ’至少一接合部231設於該凸部23對應該安置孔211的一侧 面上。 該導熱卩25 ’係靠置於對應該安置孔211之凸部23上,且該 導熱片25對應前述接合部231處設有與接合部23ι數量相同之貫 251依本創作所採之一較佳實施例,該接合部與貫口如 之結合係可採取緊配合方式固結而成;而在另—較佳實施例中本 創作亦可將雜合部231之長度設置略較該貫口 251的深度長, 故當該接合部231穿合於該貫口 251後得約略突出_端,再以例 8 M315365 如:壓力機等機構施加力量在導熱片25及接合部231上,則該接 合部231略突出-端則受力往貫口 251内壓縮,迫使接合部231 的徑向體積擴張以緊配合的結合在貫口 251…而原先略突出之 -端則外擴抵止該導熱片25之-面,進而令該導熱片25結合在 該安置孔211中,而該導熱片25相對安置孔211❸一面係為一平 面,用以平貼在一發熱單元上(圖未示); 該複數支撐部22,其-端分別與上述框體21連接,另一端則 向外凸伸且設有一結合孔221。 續參閱第8、9圖,係為本創作之再—較佳實施例,其整體結 構與功能及實制態大絲前—實__,纽料贅述相同 結構侧及其符絲示,其不同祕為核機構之導刻四對應 前述安置孔211與凹π 24連通處設有凸伸之—受接部脱,該受 接部252凸伸之-表面開設有至少一溝槽测該溝槽挪係被 用來對應便於接合熱管之吸熱端。 峒上述支架機構之框體與支撐部可用壓禱製造而一體成型, 而該導熱片係經由緊配合或鉚合方式與該框體結合成—體,俾改 善習知該支賴構f紐過電鍍步驟,並且該導刻因為益須電 鍍’故輯少厚度方向的體積以比習知更薄,進而節省製造成本。 μ綜上所述’本創作所提供之一種「散熱模組之支架機構」,破 付合准予翻之要件,爰依法提出專利申請,祈請4予專利, 實為感禱。 淮以上所述者’鶴本創作讀佳可行之實施例而已,舉凡 9 M315365 皆應包 利用本創作上述之方法、形狀、構造、裝置所為之變化, 含於本案之權利範圍内。 【圖式簡單說明】 第1圖為習知第—種核機構之立體分解示意圖; 第2圖為上述第1圖之組合示意圖; 第3圖為第—種支架機構與—散熱模組結合之侧視示意圖 第4圖為第二種支架機構之立體分解示意圖; 第5圖為上述第4圖之組合示意圖; 第6圖為本創作第—實施例之支架結構之立體分解示意圖 第7圖為上述第7圖之組合示意圖; 弟8圖為本創作支架結構另一實施例立體分解示意圖; 第9圖為上述第8圖之組合示意圖; 【主要元件符號說明】 W支架機構 11框體 111透孔 12支撐部 121透孔 13導熱片 131基部 10 M315365 1311 —面 1312第二面 132受接部 1321第一面 1322溝槽 14銲劑 15散熱模組 16導熱管 161受熱端 162發熱端 17鰭片 171 凹口 18固接元件 181頭部 182連結部 19彈性元件 20支架機構 21框體 211安置孔 22支撐部 221結合孔 23凸部 M315365 231接合部 24凹口 25導熱片 251 貫口 252受接部 2521溝槽 51導熱片 511溝槽 512楔槽 52支撐部 521腳部 522透孔 523舌板 53銲劑[New content] Therefore, in order to effectively solve the problem of red-spotting, the main purpose of the paste is to provide a bracket mechanism that can directly fix a heat-conducting sheet without welding, thereby reducing the manufacturing steps and the thickness of the heat-conducting sheet. The volume of the direction. In order to achieve the above purpose, the creation department provides a bracket mechanism for the scattered axis group, and the frame body 'the mask-placement hole' is provided with at least a convex portion, and the convex portion is connected with the moon's frame and corresponds to Arranging on the two sides of the positioning hole, at least one joint portion is disposed on a side surface of the hole corresponding to the hole of the M M35 365; a heat conducting piece is placed on the convex portion corresponding to the hole, and the heat conducting piece is disposed Corresponding to the joint portion, at least a predetermined port is engaged with the joint portion and is fixed in the fixing hole; and a plurality of support portions are respectively connected to the frame body at one end and protrude outwardly at the other end. The above object of the present invention, its structure and its nature, will be described in terms of preferred embodiments of the drawings. [Embodiment] This creative department provides a kind of "respecting the texture of her", _ is the best of the creation - please refer to the 6th and 7th drawings. The structure (9) contains a frame 2 - a heat conducting portion 25 and a plurality of supporting portions 22, a mask 21, a mounting hole 21, and a convex portion 23 on each side of the other surface, and a notch 24 is formed between the two convex portions, the convex portion 23 is connected The frame 2 is disposed on the two sides of the mounting hole 211 and the recess 24 is corresponding to the mounting hole 211. The at least one engaging portion 231 is disposed on the convex portion 23. One side of the 211. The heat-conducting crucible 25' is placed on the convex portion 23 corresponding to the hole 211, and the heat-conducting sheet 25 is provided with the same number of joints 231 as the joint portion 231. In a preferred embodiment, the joint of the joint and the joint may be consolidated by a tight fit; in another preferred embodiment, the length of the hybrid 231 may be slightly smaller than the joint. The depth of the 251 is long, so that when the joint portion 231 is engaged with the through hole 251, the protrusion _ end is slightly protruded, and then the force is applied to the heat conductive sheet 25 and the joint portion 231 by a mechanism such as a press, M315365, etc. The joint portion 231 is slightly protruded - the end is compressed by the force into the mouth 251, forcing the radial volume of the joint portion 231 to expand to fit tightly at the mouth 251... and the originally slightly protruding end is externally expanded to resist the heat conduction The surface of the sheet 25 is further integrated into the mounting hole 211, and the heat conducting sheet 25 is disposed on a flat surface opposite to the mounting hole 211 for flattening on a heat generating unit (not shown); The plurality of support portions 22 have their ends connected to the frame 21 and the other end The outer protrusion is provided with a coupling hole 221 . Continuing to refer to Figures 8 and 9, which are the re-perfect embodiments of the present invention, the overall structure and function of the actual state of the wire before the real - __, the new material side of the same structure side and its indications, The different secrets are the guides of the nuclear mechanism. The joints 211 and the recesses π 24 are provided with a protruding portion, and the receiving portion 252 is protruded. The surface is provided with at least one groove to measure the groove. It is used to correspond to the end of the heat pipe that facilitates the joining of the heat pipe. The frame body and the support portion of the bracket mechanism can be integrally formed by puncture, and the heat conductive sheet is combined with the frame body by tight fitting or riveting to improve the conventional structure. The electroplating step, and the engraving is thinner than the conventional one because of the need for electroplating, thereby saving manufacturing costs. μ In summary, the "seat mechanism of the heat-dissipating module" provided by the creation of the work, the payment of the permission to turn over the requirements, the patent application in accordance with the law, pray for 4 patents, is actually a prayer. The above-mentioned examples of the above-mentioned people's creations are well-recognized, and the changes in the methods, shapes, structures and devices of the above-mentioned creations are included in the scope of the case. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic exploded perspective view of a conventional nuclear-type mechanism; Figure 2 is a schematic view of the combination of the above-mentioned first Figure; Figure 3 is a combination of a first-type stent mechanism and a heat-dissipating module 4 is a perspective exploded view of the second bracket mechanism; FIG. 5 is a schematic view of the combination of the above FIG. 4; FIG. 6 is a perspective exploded view of the bracket structure of the first embodiment of the present invention. FIG. 7 is a schematic exploded perspective view of another embodiment of the creation of the stent structure; FIG. 9 is a schematic diagram of the combination of the above-mentioned eighth diagram; [Major component symbol description] W bracket mechanism 11 frame body 111 is transparent Hole 12 support portion 121 through hole 13 heat conductive sheet 131 base portion 10 M315365 1311 - surface 1312 second surface 132 receiving portion 1321 first surface 1322 groove 14 flux 15 heat dissipation module 16 heat pipe 161 heat receiving end 162 heat generating end 17 fin 171 notch 18 fixing member 181 head portion 182 joint portion 19 elastic member 20 bracket mechanism 21 frame body 211 seating hole 22 support portion 221 joint hole 23 convex portion M315365 231 joint portion 24 recess 25 heat conductive sheet 251 joint 252 Ministry 2521 groove 51 thermal pad 511 groove 512 wedge groove 52 support 521 foot 522 through hole 523 tongue plate 53 flux

Claims (1)

M315365 九、申請專利範圍: 1. 一種散熱模組之支架機構,係應用與一散熱模組結合,該支架機 構包含: -框體,其-面具-安置孔,另—面設至少—凸部,該凸部連接 前述框體並對應置於前述安置孔的兩侧,至少一接合部設於該凸 部對應該安置孔的一侧面上; 一導熱片’靠置於對應該安置孔之凸部上,且該導熱片對應前述 » 接合部處設有至少-貫口與該接合部穿合,並結合在該安置孔 中;及 複數支卿,其-端分別與上述框體連接,另—刺向外凸伸。 2·如請求項1所述之散熱模組之支架機構,其中,該凸部間構成一 凹口’該凹口對應該安置孔處係連通該安置孔。 3.如請求項1所述之散熱模組之支架機構,其中,該支樓部靠近向 外凸伸的一端處設有一結合孔。 4·如請求項2所述之散熱模組之支架機構,其中,該導熱片相反該 凹口之一面為平面。 5·如請求項1所述之散熱模組之支架機構,其中,該導熱片對應該 凹口與女置孔連通處設有一凸伸的受接部,該受接部凸伸之一表 面設有至少—溝槽。 13M315365 Nine, the scope of application for patents: 1. A bracket mechanism for a heat dissipation module, which is combined with a heat dissipation module, the bracket mechanism comprises: - a frame body, a mask - a mounting hole, and a surface - at least a convex portion The convex portion is connected to the frame body and correspondingly disposed on two sides of the positioning hole, and at least one joint portion is disposed on a side surface of the convex portion corresponding to the hole; a heat conducting piece is placed on the convex corresponding to the hole a portion, and the heat conducting sheet is provided with at least a through-port corresponding to the joint portion, and is engaged with the joint portion, and is coupled to the mounting hole; and a plurality of branches are respectively connected to the frame body, and the other ends are respectively connected to the frame body. - The thorn protrudes outward. 2. The bracket mechanism of the heat dissipation module according to claim 1, wherein the protrusion forms a notch. The notch corresponds to the mounting hole. 3. The bracket mechanism of the heat dissipation module according to claim 1, wherein the branch portion is provided with a coupling hole near the outwardly projecting end. 4. The bracket mechanism of the heat dissipation module according to claim 2, wherein the heat conducting sheet is opposite to a surface of the recess. The bracket mechanism of the heat dissipation module of claim 1, wherein the heat conducting piece is provided with a protruding receiving portion corresponding to the intersection of the notch and the female hole, and one surface of the protruding portion of the receiving portion is provided At least - the groove. 13
TW96201778U 2007-01-30 2007-01-30 Support mechanism for heat dissipation module TWM315365U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96201778U TWM315365U (en) 2007-01-30 2007-01-30 Support mechanism for heat dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96201778U TWM315365U (en) 2007-01-30 2007-01-30 Support mechanism for heat dissipation module

Publications (1)

Publication Number Publication Date
TWM315365U true TWM315365U (en) 2007-07-11

Family

ID=39454837

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96201778U TWM315365U (en) 2007-01-30 2007-01-30 Support mechanism for heat dissipation module

Country Status (1)

Country Link
TW (1) TWM315365U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857260A (en) * 2012-11-30 2014-06-11 富瑞精密组件(昆山)有限公司 Substrate and cooling device with the substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857260A (en) * 2012-11-30 2014-06-11 富瑞精密组件(昆山)有限公司 Substrate and cooling device with the substrate
TWI492035B (en) * 2012-11-30 2015-07-11 Foxconn Tech Co Ltd Base and heat dissipating module having the same
US9449894B2 (en) 2012-11-30 2016-09-20 Furui Precise Component (Kunshan) Co., Ltd. Base with heat absorber and heat dissipating module having the base
CN103857260B (en) * 2012-11-30 2016-12-28 富瑞精密组件(昆山)有限公司 Pedestal and there is the heat abstractor of this pedestal

Similar Documents

Publication Publication Date Title
TWI360738B (en)
JPH07289439A (en) Kitchen container and its manufacture
TWI604782B (en) Heat pipe side-by-side heat sink and its production method
TW311984B (en)
TWM315365U (en) Support mechanism for heat dissipation module
US20080047139A1 (en) Method For Combining Axially Heated Heat Pipes And Heat-Conducting Base
TW200848991A (en) Processing method of graphite heat conductive sheet
CN201018738Y (en) Bracket mechanism of heat radiation module
TWI303971B (en)
TWI270339B (en) Heat conduits and method for forming heat-dissipating fins by squeeze-shaping
JP3132272U (en) Frame structure of heat dissipation module
TWI345045B (en)
TWM544191U (en) Heat pipes side by side heat dissipation device
TWM481391U (en) Heat dissipation module assembly structure
JPH08316383A (en) Heat conductive composite material and production thereof
CN210272334U (en) High-reliability heat dissipation device
TWI537540B (en) Heat dissipation module combined structure and manufacturing method thereof
TWI334524B (en)
TW200813389A (en) Joined structure of the heat pipe and heat dissipation base and the joining method thereof
JP2001077253A5 (en)
TWI313156B (en)
JP3141344U (en) Junction structure of radiator of electronic equipment
KR200290707Y1 (en) Heat Sink
TW201105224A (en) Method and structure of thermo conductor having coplanar evaporator sections and heat sink with the thermo conductor
TW478987B (en) CPU radiator and the manufacturing method

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees