200848991 七、指定代表圖： (一） 本案指定代表圖為：第（五）圖。 (二) 本代表圖之元件符號簡單說明： 石墨導熱30 石墨導熱板材35 公模40 母模42 底板46 第一厚度D1 模具結構39 頂模41 内托料板44 彈性部件48 第二厚度D2 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式 九、發明說明： 4 200848991 【發明所屬之技術領域】 本發明係關於一種石墨導熱片的加工方法，尤指利用 以導散晶片等電子元件所產生熱之石墨導熱片的加工方 法0 【先前技術】 石墨導熱片常利用於筆記型電腦等電子裝置中，貼附 於π熱之處理器、晶片組…等電子元件，以導散電子元件 所產生的熱。 石墨導熱片主要成份為石墨與填充物（fiUer)所組 成。石墨能導熱，填充物使整個石墨導熱片質軟易加工。 有時候，爲配合貼附晶片等電子元件，會自石墨導熱片之 上、下表面以模具壓折石墨導熱片，使石墨導熱片上、下 凹、凸成型，以能配合電子元件之外型。 請參閱圖一，圖一係習知技術壓折後石墨導熱片2之 示意圖。習知技術將石墨導熱片2壓折後，彎折處4受拉 伸^乍用，使此部份之石墨密度會明顯低於平板處6之石 墨雄度’因此’石墨導熱片2之彎折處4的熱傳導速率就 會降低，換句話說，此彎折處4會形成整個石墨導熱片2 傳熱之阻礙。 立此外’凊參閱圖二圖二係習知技術散熱組件1〇之示 思圖。圖二係美國專利公開號第US2〇〇3/〇il63l2Al號專 所示圖式係於石墨導熱片2上表面嵌插上複數個^ 牛14，習知技術構成一理想之散熱組件1〇，然而，散熱 14在往很難穩固的嵌插於軟質的石墨導熱片2中，遇到外 5 200848991 力很容易就脫落而被破壞。 因此，本發明的主要目的在於 加工方法，贼善上述問題。咐、種石墨導熱片的 【發明内容】 的加工方法， 本發明之目的在提供一種石墨導熱片 大幅提高導熱效率’並且，能補強以解決二7二赃 變小而導熱效率變差的問題。 、气处石墨岔度 導熱插於石墨 ，.一上令熟片的加工方法，兮石黑3 熱片並具有-特定輪廓外型，該加μ法勉含下ϋ 百先，配合補應之—組公、母模包献壓切一石， 切該石墨導熱板材成為該特定輪斜仏 石墨ν熱片，其中該石墨導熱片具有一第一厚度。 接著’該組公、母模繼續壓擠裁切後之石墨導， 利用設置於触公、母姻之·，控觀触公了母相 將該石墨導熱片自該第—厚度顯至預定之第二厚度 ===導熱片之石墨密度提高’也提高了石墨導熱片 的導熱效率。 進步，於裁切出具該特定輪廓外型之石墨導熱片之 後，5亥加工方法進一^步逛包含下列步驟·· 係，以該組公、母模自該石墨導熱片之上、下表面麗 折該石墨導熱片，使該石科熱片上、下凹、凸成型。 200848991 後續，將壓折後之石墨導熱片自該第一厚度壓擠至預 定之第二厚度，會使該石墨導熱片彎折處之石墨密度近似 於該石墨導熱片於該第二厚度之平板處之石墨密度二 此外，於裁切出具該特定輪廓外型之石墨導熱片之 後，該加工方法還可以進一步包含下列步驟··… 部 首先，於該石墨導熱片之上表面產生至少一第一凹陷 ^接著，將一散熱件之底端嵌入該第一凹陷部中，其中 该散熱件之底端之側面係橫向具有至少一第二凹陷部。 一後續，將該石墨導熱片自該第一厚度壓擠至預定之第 j度’係會使該第—凹陷部側面部份之石墨導熱片陷入 u亥第一凹1¾部中，使該散熱件穩固連接於該石墨導熱片。 因此，藉由本發明利用以導散晶片等電子元件所產生 熱之石墨導熱片的加工方法，利用公、母模間之頂模十 ==至預定較薄之厚度’能大幅提高石墨; ^ ^ t v<、、、放革。亚且，利用此壓擠之方法，能補強以 ^考折，石墨密度變小而導熱效率變差的問題。此外， 熱片=騎之方法，使散熱件能更穩關嵌插於石墨導 本發明之優點與精神可以11由以τ的發明詳述及 【實施方式】 °月苓閱圖二，圖三係本發明石墨導熱片30加工方法之 200848991 關於一種石墨導熱片30的加工方法，所 31，士 片3〇如圖四一般具有—特定輪廊外型 _包失^務^單獨僅為石墨層34而不需任何 f 止》 疋部的_ 32以銅搭或背朦來取 杰，：c里=石墨層34係由石墨與填充物(f 11 ler)所組 、、以傳熱之功能，填充物使其質軟而易加工。 此加工方法係配合圖五之模具結構39，來進行所述加 方法之步驟。模具結構39包含_公模Μ以及一母模 A模4〇側邊设有頂模41，母模42内部底面設有内托 ^反44’母模42和内托料板44皆可設置在一個作為支撐 f底板46上，進一步，内托料板44與底板46之間尚可以 。又置如彈黃之彈性部件48(也可不設置），而石墨導熱板材 35係放置於公模40以及母模42之間。 配合圖四、圖五以參考圖三，該加工方法係包含下列 步驟： 步驟S02 :首先，配合相對應之該組公、母模4〇、42 包夾並壓切石墨導熱板材35，以裁切石墨導熱板材35成 為特定輪廓外型31之石墨導熱片30，其中石墨導熱片30 具有一第一厚度D1。 步驟S06 :接著，該組公、母模40、42繼續壓播裁切 後之石墨導熱片30(如圖五係進一步以公模40與内托料板 44覆擠裁切後之石墨導熱片30)，利用設置於該組公、母 模40、42間之頂模41，控制使該組公、母模40、42將石 墨導熱片30自第一厚度D1壓擠至預定之第二厚度D2,其 200848991 厚度D2小於第一厚度D1，所以壓擠後之石墨導埶 =〇中石墨密度較高，因此，麵後之石墨導熱片 熱效果較佳。 請參閱圖六以及圖七，圖六係本發明使石墨導熱片3〇 i媒1凹、凸成型之流程圖’圖七係本發明配合圖六模具 4 39之示意圖。石墨導熱片3〇為配合如晶片等電子元 件之外型’須有凹、凸成型的部分55(由圖二中 外 觀），如習知所述，凹、凸成型的部分55所產生之彎/折處: 52會使石墨密度較獅，本發_六所實狀步驟係用以 克服此問題。 依圖，、係於前述步驟S02裁切出具特定輪廓外型31 之石墨導熱>；3G之後，該加工方法進—步包含下列步驟： 步驟S04 :以該組公、母模4〇、42自石墨導熱片3〇 之上、下表面壓折石墨導熱片3〇，使石墨導熱片產生 上、下凹、凸成型的部分55。 士後續進行前述步驟S06,將壓折後之石墨導熱片3〇繼 續擠壓，使石墨導熱片30自第一厚度D1壓擠至預定之第 二厚度D2。如此，不僅提高石墨密度而加快導熱效率，更 使石墨導熱片30平板處54之部份石墨擠壓至彎折處52， 使石墨導熱片3〇彎折處52之石墨密度近似於石墨導熱 片30於第二厚度D2之平板處54之石墨密度，而免除習知 技術彎折處熱傳導障礙的問題。 、圖六之加工方法係配合圖七之模具結構39，來進行所 迷加工方法之步驟。如圖七所示，母模42内側底部所設置 200848991 之内托底板46，係配合與公模4〇底部凹、凸成型。接著， 利用公模40與内托底板46以自石墨導熱片3〇之上、下表 面壓折石墨導熱片30，使石墨導熱片3〇形成上、下凹、、 凸成型的部分55。 此外，請參閱圖八以及圖九，圖八係本發明使散熱件 70嵌插於石墨導熱片30上之流程圖，圖九係圖八所形成 石墨導刻30之示意圖。依圖九所示，係於石墨導熱片 ，上複數個第-凹陷部62中嵌插複數個散熱件7{)，每個 ，熱件70之底端嵌人第—凹陷部62中之底端之側面係橫 =具有至少-第二凹陷部64 ’第二凹陷部64的形狀可如 圖九A、圖九B、以及圖九C所示一般。 參閱圖八，於前述步驟S〇2裁切出具特定 =墨導制30之後，該加4法還可以進—步包含下列 步驟S03 :首先，於石墨導熱片3〇之上表面產生至少 一個第一凹陷部62。 步驟S05 :接著，將散熱件7〇之底端叙入第一凹陷部 _ ’其中散熱件7G之底端之側關橫向具有至少一個 第一凹陷部64。 石$ t進订别述步驟SG6，透過前述之模具結構39， 3〇:ϋ1〇上方對石墨導熱片30施壓’將石墨導熱 戶因^厚1壓擠至預定之第二厚度D2，除了石墨 ί片tn外’也會使第一凹陷部62側面部份之石墨 …、片3〇受屡擠而陷入第二凹陷部64中，以使石墨導献 200848991 3〇牢牢連接散熱件7〇。因此，除了提高導熱效 使散熱件70穩固連接於石墨導熱片30。 ’更 如别述之，其材質可為金屬材質 熱件70也為石墨材質，請參閱圖十'才質。若散 質散熱件70製作之、、θ ’、發明石墨材 底端麥入裳 j述步驟SG5散熱件之 f啊62㈣，版撕-步包含下 散熱模㈣二^ 控制使該組公母40、42間之頂模41， 擠至預定之第四厚戶，立中2將散熱件70自該第三厚度麼 部62之寬度。&八中该弟四厚度係不超過第一凹陷 是凹洞時，散轉7〇之冰卜錢為板狀。當第一凹陷 可為產業界賴稱之上述的散熱件7〇 70 ^h3Li 中之前，7(^底端嵌入第一凹陷部62 固的嵌入第-凹_ 62$先塗佈黏著劑，以便於更穩 除此之外，前述將 前述各項圖式所示將石黑熱片30顯之技術’除了如 熱片30整體擠壓而提高石墨 200848991 密度之外，也可以擠壓部份之石 之石墨導熱片30自該第—厚度二t Q 擠部份 二厚度D2，其他部份之石墨料薄之第 厚度D1。 片30保持於較厚之第一 較薄之第二厚度的石墨導熱片 高，具有較高的熱導效率，較厚之 ^:讀較 3〇因為石墨密度較低，具有較差的熱 不同的應用領域中，同樣也在本發__二^他 二;片由=利用以導散晶片等電子元件所產生 …、之石墨¥熱片30的加工方法，利用 =模41，控制壓擠石墨導熱片30至預定較^之产，間 ==墨=而大幅提高導熱效率。並且==擠 變:的門=Γ，52石墨密度變小而導熱效率 文差的問通。此外，也·此壓擠之方法 能更穩固的钱插於石墨導熱片30表面。 …、 Μ、ίΓχ上健频纽例之_，騎雜更加清楚 之特徵與精神’而並非以上述所揭露的較佳ί 發明之射純_。相反地，其目的是 广二盍各種改瓶具相等性的安排於本發明所主 之專利範圍的範傳内。 口月 【圖式簡單說明】 圖一係習知技術壓折後石墨導熱片之示意圖 圖一係習知技術1散熱組件之示意圖； 12 200848991 圖三係本發明石墨導熱片加工方法之流程圖； 圖四係本發明石墨導熱片之示意圖； 圖五係本發明圖三所需模具結構之橫向剖面示意圖； 圖六係本發明使石墨導熱片上、下凹、凸成型之流程 圖， 圖七係本發明配合圖六模具結構之示意圖； 圖八係本發明使散熱件嵌插於石墨導熱片上之流程 圖； 圖九係圖八所形成石墨導熱片之示意圖； 圖九A、B、C係圖九之另外三種實施例之示意圖；以 及 圖十係本發明石墨材質散熱件製作之流成圖。 【主要元件符號說明】 散熱組件10 石墨導熱片2、30 特定輪廓外型31 鋁箔32 石墨層34 石墨導熱板材35 模具結構39 公模40 頂模41 母模42 内托料板44 底板46 彈性部件48 第一厚度D1 第二厚度D2 13 200848991 彎折處4、52 凹、凸成型之部分55 第二凹陷部64 平板處6、54 第一凹陷部62 散熱件14、70 14200848991 VII. Designated representative map: (1) The representative representative of the case is: (5). (2) Brief description of the symbol of the representative figure: Graphite heat conduction 30 Graphite heat conduction plate 35 Male mold 40 Female mold 42 Base plate 46 First thickness D1 Mold structure 39 Top mold 41 Inner material plate 44 Elastic member 48 Second thickness D2 Eight If there is a chemical formula in this case, please disclose the chemical formula which can best show the characteristics of the invention. IX. Inventive description: 4 200848991 [Technical Field] The present invention relates to a method for processing a graphite thermal conductive sheet, in particular to use to disperse a wafer or the like. Method for processing hot graphite thermal sheet produced by electronic components 0 [Prior Art] Graphite thermal conductive sheets are often used in electronic devices such as notebook computers, and are attached to electronic components such as π heat processors, chip sets, etc. The heat generated by electronic components. The main component of the graphite thermal sheet is composed of graphite and a filler (fiUer). Graphite can conduct heat, and the filler makes the whole graphite heat conductive sheet soft and easy to process. Sometimes, in order to match the electronic components such as wafers, the graphite thermal conductive sheets are folded from the upper and lower surfaces of the graphite thermal conductive sheet by a mold, so that the graphite thermal conductive sheets are formed on the upper, lower, and convex shapes to match the appearance of the electronic components. Please refer to FIG. 1. FIG. 1 is a schematic view of a graphite thermal conductive sheet 2 after a conventional technique. After the graphite heat transfer sheet 2 is folded, the bending portion 4 is subjected to stretching, so that the graphite density of this portion is significantly lower than the graphite male degree of the flat portion 6 so that the graphite thermal conductive sheet 2 is bent. The heat transfer rate of the fold 4 is lowered. In other words, the bend 4 forms an obstacle to the heat transfer of the entire graphite heat conducting sheet 2. In addition, please refer to Figure 2 and Figure 2 for a diagram of the conventional heat dissipation components. Figure 2 is a schematic diagram of the US Patent Publication No. US2〇〇3/〇il63l2Al. The pattern is embedded on the upper surface of the graphite thermal sheet 2, and a plurality of cathodes 14 are embedded in the surface. The conventional technology constitutes an ideal heat dissipating component. However, the heat dissipating 14 is difficult to be firmly inserted into the soft graphite thermal sheet 2, and the force is easily detached and destroyed. Therefore, the main object of the present invention is to solve the above problems. SUMMARY OF THE INVENTION The object of the present invention is to provide a graphite thermally conductive sheet which greatly improves the heat transfer efficiency' and which can be reinforced to solve the problem that the heat transfer efficiency is deteriorated and the heat transfer efficiency is deteriorated. At the gas, the graphite heat is inserted into the graphite, and the processing method of the cooked slice is as follows. The diamond black 3 hot film has a specific contour shape, and the μ method contains the lower jaw. The group of male and female molds are pressed to cut a stone, and the graphite heat conductive sheet is cut into the specific round oblique graphite ν hot sheet, wherein the graphite thermal conductive sheet has a first thickness. Then, the group of male and female molds continue to press the cut graphite guide, and the set of the contact and the mother's marriage are used to control the male parent phase to display the graphite thermal conductive sheet from the first thickness to the predetermined thickness. The second thickness ===the graphite density increase of the thermal conductive sheet' also improves the thermal conductivity of the graphite thermal conductive sheet. Progressively, after cutting out the graphite heat conductive sheet of the specific contour shape, the 5 Hai processing method further comprises the following steps: the group and the female mold are applied to the upper and lower surfaces of the graphite thermal conductive sheet. The graphite heat conductive sheet is folded to make the stone heat sheet upper, lower, and convex. 200848991 Subsequently, pressing the crimped graphite thermal sheet from the first thickness to a predetermined second thickness causes the graphite density of the graphite thermal conductive sheet to be approximated by the graphite thermal conductive sheet at the second thickness In addition, after cutting the graphite thermal conductive sheet having the specific contour shape, the processing method may further comprise the following steps: first, at least one first surface is generated on the upper surface of the graphite thermal conductive sheet The recess is then embedded in the first recessed portion, wherein the bottom end of the heat sink has laterally at least one second recess. Subsequently, pressing the graphite thermal conductive sheet from the first thickness to a predetermined jth degree causes the graphite thermal conductive sheet of the side portion of the first depressed portion to be trapped in the first concave portion 126, so that the heat dissipation The piece is firmly connected to the graphite thermal sheet. Therefore, by using the method for processing a graphite heat conductive sheet for dissipating heat generated by an electronic component such as a wafer, the top mold 10== to a predetermined thin thickness between the male and female molds can greatly improve the graphite; ^^ t v <,,, put the leather. Yahe, by using this method of pressing, it is possible to reinforce the problem that the graphite density becomes small and the heat conduction efficiency is deteriorated. In addition, the hot film = riding method, so that the heat sink can be more stably inserted into the graphite guide. The advantages and spirit of the invention can be 11 by the invention of τ and [embodiment] ° month reading Figure 2, Figure 3 The method for processing the graphite thermal conductive sheet 30 of the present invention is 200848991. Regarding the processing method of a graphite thermal conductive sheet 30, 31, the thin film 3 一般 generally has a specific shape of the porch _ package loss ^ separate graphite layer only 34 without any need to stop 疋 32 铜 32 with copper or back to take the Jie,: c = graphite layer 34 is composed of graphite and filler (f 11 ler), to heat transfer function The filler makes it soft and easy to process. This processing method is carried out in conjunction with the mold structure 39 of Fig. 5 to carry out the steps of the adding method. The mold structure 39 includes a male mold and a female mold A. The top side is provided with a top mold 41. The inner bottom surface of the female mold 42 is provided with an inner support, a counter 44' female mold 42 and an inner tray 44. One is supported as the bottom plate 46, and further, between the inner tray 44 and the bottom plate 46 is acceptable. Further, an elastic member 48 such as a spring is placed (not provided), and a graphite heat conductive sheet 35 is placed between the male mold 40 and the female mold 42. Referring to FIG. 4 and FIG. 5 with reference to FIG. 3, the processing method includes the following steps: Step S02: First, the corresponding male and female molds 4〇, 42 are clamped and the graphite heat conductive plate 35 is pressed and cut. The cut graphite heat conductive sheet 35 becomes the graphite heat conductive sheet 30 of the specific outline shape 31, wherein the graphite heat conductive sheet 30 has a first thickness D1. Step S06: Next, the group of male and female molds 40 and 42 continue to press and press the cut graphite thermal conductive sheet 30 (as shown in FIG. 5, the graphite thermal conductive sheet is further covered by the male mold 40 and the inner tray 44. 30), using the top mold 41 disposed between the set of male and female molds 40, 42 to control the group of male and female molds 40, 42 to press the graphite thermal conductive sheet 30 from the first thickness D1 to a predetermined second thickness D2, its 200848991 thickness D2 is smaller than the first thickness D1, so the graphite after the extrusion has a higher density of graphite, so the thermal conductivity of the graphite thermal sheet after the surface is better. Referring to FIG. 6 and FIG. 7 , FIG. 6 is a flow chart of the present invention for making a concave and convex shape of a graphite thermal conductive sheet. FIG. 7 is a schematic diagram of the present invention in conjunction with FIG. The graphite thermal conductive sheet 3 is a portion 55 (appearing in FIG. 2) which is required to have a concave and convex shape in addition to an electronic component such as a wafer. As is conventionally known, the concave portion formed by the concave and convex portion 55 is formed. / Folding: 52 will make the graphite density more than the lion, this is a _ six real steps to overcome this problem. According to the figure, after cutting the graphite heat conduction with a specific contour shape 31 in the foregoing step S02, the processing method further comprises the following steps: Step S04: using the group of male and female molds 4, 42 The graphite heat conductive sheet is folded from the graphite heat conductive sheet 3 、 and the lower surface to make the graphite heat conductive sheet generate the upper, lower concave and convex shaped portion 55. Subsequently, the above step S06 is carried out, and the pressed graphite thermally conductive sheet 3 is continuously extruded to press the graphite thermally conductive sheet 30 from the first thickness D1 to a predetermined second thickness D2. In this way, not only the graphite density is increased, but also the thermal conductivity is accelerated, and part of the graphite at the flat plate 54 of the graphite thermal conductive sheet 30 is extruded to the bent portion 52, so that the graphite density of the graphite thermal conductive sheet 3 〇 bend 52 is similar to that of the graphite thermal conductive sheet. The graphite density at the plate 54 of the second thickness D2 is a relief from the problem of thermal conduction barriers at the bend of the prior art. The processing method of Fig. 6 is combined with the mold structure 39 of Fig. 7 to carry out the steps of the processing method. As shown in Fig. 7, the inner bottom plate 46 of the inner casing 42 is provided with a bottom plate 46 of 200848991, which is fitted with a concave and convex shape at the bottom of the male mold. Next, the graphite heat transfer sheet 30 is pressed from the graphite heat transfer sheet 3 、 and the lower surface by the male mold 40 and the inner bottom plate 46, so that the graphite heat transfer sheet 3 is formed into a concave, convex, and convex portion 55. In addition, referring to FIG. 8 and FIG. 9, FIG. 8 is a flow chart of the present invention for embedding the heat dissipating member 70 on the graphite thermal conductive sheet 30, and FIG. 9 is a schematic view showing the graphite engraving 30 formed by FIG. As shown in FIG. 9, the graphite heat conducting sheet is embedded with a plurality of heat dissipating members 7{) in the plurality of first recessed portions 62. Each of the bottom ends of the heat members 70 is embedded in the bottom of the first recessed portion 62. The side of the end is transversely = has at least - the second recessed portion 64. The shape of the second recessed portion 64 can be generally as shown in Figures 9A, 9B, and 9C. Referring to FIG. 8, after the specific step = ink guiding 30 is cut out in the foregoing step S2, the adding method 4 can further include the following step S03: First, at least one surface is generated on the surface of the graphite thermal conductive sheet 3 A recess 62. Step S05: Next, the bottom end of the heat dissipating member 7 is referred to the first recess portion _ ' wherein the bottom end of the heat dissipating member 7G has at least one first recess portion 64 in the lateral direction. The stone $t advances the step SG6, and presses the graphite heat conductive sheet 30 through the above-mentioned mold structure 39, 3〇:ϋ1〇, and presses the graphite heat-conducting household to the predetermined second thickness D2 by the thickness 1 The graphite sheet tn 'will also cause the graphite ..., the sheet 3 of the side portion of the first recess portion 62 to be squeezed into the second recess portion 64 so that the graphite guide 200848991 3〇 firmly connects the heat sink 7 Hey. Therefore, in addition to improving the heat transfer effect, the heat sink 70 is firmly connected to the graphite heat conductive sheet 30. ‘More as stated, the material can be made of metal. The hot part 70 is also made of graphite. Please refer to Figure 10 for the quality. If the mass heat sink 70 is made, θ ', the bottom of the invention graphite material, the SG5 heat sink, the f (62), the tear-step includes the lower heat mold (four) two ^ control to make the group of male and female 40 The 42 top molds 41 are extruded to a predetermined fourth thick household, and the center 2 heats the heat sink 70 from the width of the third thickness portion 62. &8; The middle thickness of the eight brothers is not more than the first depression is a concave hole, the ice is scattered 7 〇 is a plate shape. Before the first recess can be used in the above-mentioned heat dissipating member 7〇70 ^h3Li of the industry, 7 (the bottom end is embedded in the first recessed portion 62 and the embedded recessed-concave _ 62$ is first coated with an adhesive so that In addition to the above, the foregoing technique of displaying the stone black hot sheet 30 as shown in the foregoing figures may be performed in addition to the overall extrusion of the hot sheet 30 to increase the density of the graphite 200848991, and may also be extruded. The graphite graphite thermal conductive sheet 30 is extruded from the first thickness to the second thickness Q2, and the other portion of the graphite material is thin, the first thickness D1. The sheet 30 is held in the thicker first thinner second thickness graphite. High thermal conductivity sheet, high thermal conductivity, thicker ^: read more than 3 〇 because the graphite density is lower, the application of poor heat is different, also in the hair __二^他二; By using the method of processing the graphite ¥ hot sheet 30 generated by electronic components such as a diffusion chip or the like, using the = mold 41, the graphite heat transfer sheet 30 is controlled to a predetermined ratio, and the ratio == ink = greatly Improve the heat transfer efficiency. And == squeeze: the door = Γ, 52 graphite density becomes smaller and the heat conduction efficiency is poor. Also, this method of crushing can insert more stable money into the surface of the graphite thermal conductive sheet 30. ..., Μ, Γχ Γχ 健 健 , , , , , , 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑佳ί Invented pure _. Conversely, the purpose is to broaden the various equalization of the bottles in the scope of the patent scope of the invention. Moon month [schematic description] Figure 1 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a heat dissipating component of a conventional technique; 12 200848991 FIG. 3 is a flow chart of a method for processing a graphite thermal conductive sheet of the present invention; FIG. 4 is a schematic view of a graphite thermal conductive sheet of the present invention; Figure 5 is a schematic cross-sectional view of the mold structure required for the third embodiment of the present invention; Figure 6 is a flow chart of the upper, lower concave and convex molding of the graphite thermal conductive sheet of the present invention, and Figure 7 is a schematic diagram of the mold structure of the present invention in conjunction with Figure 6; Figure 9 is a schematic view of the graphite thermal conductive sheet formed by the heat dissipating member of the present invention; Figure 9 is a schematic view of the other three embodiments of Figure 9A, B, and C; Ten series of graphite material heat sink parts of the invention. [Main component symbol description] Heat dissipating component 10 Graphite thermal sheet 2, 30 Specific contour shape 31 Aluminum foil 32 Graphite layer 34 Graphite heat conduction plate 35 Mold structure 39 Male mold 40 Top Mold 41 Female mold 42 Inner material plate 44 Base plate 46 Elastic member 48 First thickness D1 Second thickness D2 13 200848991 Bending portion 4, 52 Concave, convexly shaped portion 55 Second recessed portion 64 Flat plate 6, 54 First Recessed portion 62 heat sink 14, 70 14