CN101683934B - 粘接剂带卷 - Google Patents

粘接剂带卷 Download PDF

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Publication number
CN101683934B
CN101683934B CN2009101682990A CN200910168299A CN101683934B CN 101683934 B CN101683934 B CN 101683934B CN 2009101682990 A CN2009101682990 A CN 2009101682990A CN 200910168299 A CN200910168299 A CN 200910168299A CN 101683934 B CN101683934 B CN 101683934B
Authority
CN
China
Prior art keywords
adhesive
adhesive tape
mentioned
support film
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101682990A
Other languages
English (en)
Chinese (zh)
Other versions
CN101683934A (zh
Inventor
平尾充
川俣耕一
关贵志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN101683934A publication Critical patent/CN101683934A/zh
Application granted granted Critical
Publication of CN101683934B publication Critical patent/CN101683934B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers

Landscapes

  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesive Tapes (AREA)
  • Winding, Rewinding, Material Storage Devices (AREA)
  • Die Bonding (AREA)
CN2009101682990A 2005-08-31 2006-08-30 粘接剂带卷 Expired - Fee Related CN101683934B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005251268 2005-08-31
JP2005251268 2005-08-31
JP2005-251268 2005-08-31
JP2006-179765 2006-06-29
JP2006179765 2006-06-29
JP2006179765A JP4238885B2 (ja) 2005-08-31 2006-06-29 接着剤リール及び接着剤テープ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNA2006101219806A Division CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷

Publications (2)

Publication Number Publication Date
CN101683934A CN101683934A (zh) 2010-03-31
CN101683934B true CN101683934B (zh) 2012-06-13

Family

ID=37978091

Family Applications (5)

Application Number Title Priority Date Filing Date
CN2009101682990A Expired - Fee Related CN101683934B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN201010003397A Pending CN101792075A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN201110307866.3A Expired - Fee Related CN102514986B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CNA2006101219806A Pending CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101684040A Expired - Fee Related CN101665195B (zh) 2005-08-31 2006-08-30 一种粘接剂带以及粘结剂带的引出方法

Family Applications After (4)

Application Number Title Priority Date Filing Date
CN201010003397A Pending CN101792075A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN201110307866.3A Expired - Fee Related CN102514986B (zh) 2005-08-31 2006-08-30 粘接剂带卷
CNA2006101219806A Pending CN1923654A (zh) 2005-08-31 2006-08-30 粘接剂带卷
CN2009101684040A Expired - Fee Related CN101665195B (zh) 2005-08-31 2006-08-30 一种粘接剂带以及粘结剂带的引出方法

Country Status (4)

Country Link
JP (1) JP4238885B2 (enExample)
KR (1) KR100889648B1 (enExample)
CN (5) CN101683934B (enExample)
TW (1) TW200715672A (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5050832B2 (ja) * 2007-12-19 2012-10-17 日立化成工業株式会社 接着テープ用リール
WO2009133901A1 (ja) * 2008-04-28 2009-11-05 日立化成工業株式会社 回路接続材料、フィルム状接着剤、接着剤リール及び回路接続構造体
WO2010098354A1 (ja) * 2009-02-27 2010-09-02 日立化成工業株式会社 接着材リール
WO2013024544A1 (ja) * 2011-08-18 2013-02-21 日立化成工業株式会社 接着材リール
KR101568659B1 (ko) * 2013-03-29 2015-11-12 제일모직주식회사 도전성 접착층을 포함하는 이방 도전성 필름 및 상기 필름에 의해 접속된 반도체 장치
WO2016136946A1 (ja) * 2015-02-27 2016-09-01 デクセリアルズ株式会社 リール体、フィルム連結体、フィルム巻装体、及びフィルム連結体の製造方法
JP2016160027A (ja) * 2015-02-27 2016-09-05 デクセリアルズ株式会社 接着フィルム用リール及びこれに使用される連結体
JP6693161B2 (ja) * 2016-02-16 2020-05-13 デクセリアルズ株式会社 フィルム連結体、フィルム巻装体、リール体、及びフィルム連結体の製造方法
CN107298330B (zh) * 2016-04-14 2020-06-12 康菲德斯合股公司 在芯上布置材料幅的方法
JP6668164B2 (ja) * 2016-05-20 2020-03-18 デクセリアルズ株式会社 接着テープ構造体
CN109575829B (zh) * 2017-12-29 2021-05-07 宁波大榭开发区综研化学有限公司 一种段差多层复合膜和卷材及其制备方法
EP4000769A4 (en) * 2019-08-26 2023-08-16 Lintec Corporation Laminate manufacturing method
JP7877995B2 (ja) * 2022-09-29 2026-06-23 株式会社レゾナック 個片化体形成用積層フィルム及びその製造方法、巻回体、並びに積層体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04332782A (ja) * 1991-05-07 1992-11-19 Sekisui Chem Co Ltd ロール状粘着テープ
JPH05330722A (ja) * 1992-05-25 1993-12-14 Nitto Denko Corp テープディスペンサー
JPH0724947U (ja) * 1993-10-07 1995-05-12 祐久 小松 粘着テープ
CH689482A5 (de) * 1995-07-31 1999-05-14 Tela Papierfabrik Ag Papierrolle mit einem Endblattverschluss.
JP4465788B2 (ja) * 2000-03-28 2010-05-19 日立化成工業株式会社 異方導電材テープ及びリール
EP1249729A3 (en) * 2001-04-12 2005-07-13 Fuji Photo Film Co., Ltd. Rolled article, and method of and apparatus for processing rolled article
DE10123980B4 (de) * 2001-05-17 2008-01-10 Tesa Ag Abschlussbandage
KR100838880B1 (ko) * 2002-07-30 2008-06-16 히다치 가세고교 가부시끼가이샤 접착재 테이프, 그 접속방법, 제조방법, 압착방법
JP4239585B2 (ja) * 2002-12-24 2009-03-18 日立化成工業株式会社 接着剤テープの接続方法及び接着剤テープ接続体
JP2004077789A (ja) * 2002-08-19 2004-03-11 Konica Minolta Holdings Inc 遮光フランジ部材

Also Published As

Publication number Publication date
CN101683934A (zh) 2010-03-31
TW200715672A (en) 2007-04-16
KR20070026029A (ko) 2007-03-08
CN101665195A (zh) 2010-03-10
CN101665195B (zh) 2012-07-25
CN102514986B (zh) 2016-04-27
KR100889648B1 (ko) 2009-03-19
CN1923654A (zh) 2007-03-07
TWI301339B (enExample) 2008-09-21
CN101792075A (zh) 2010-08-04
CN102514986A (zh) 2012-06-27
JP4238885B2 (ja) 2009-03-18
JP2007092028A (ja) 2007-04-12

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Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Patentee after: HITACHI CHEMICAL Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: HITACHI CHEMICAL Co.,Ltd.

Address after: Tokyo, Japan

Patentee after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Patentee before: HITACHI CHEMICAL Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120613