CN101681900B - 接触垫和形成用于集成电路的接触垫的方法 - Google Patents

接触垫和形成用于集成电路的接触垫的方法 Download PDF

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Publication number
CN101681900B
CN101681900B CN2008800187222A CN200880018722A CN101681900B CN 101681900 B CN101681900 B CN 101681900B CN 2008800187222 A CN2008800187222 A CN 2008800187222A CN 200880018722 A CN200880018722 A CN 200880018722A CN 101681900 B CN101681900 B CN 101681900B
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China
Prior art keywords
protrusions
protrusion
platform
contact pad
contact mat
Prior art date
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Active
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CN2008800187222A
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English (en)
Chinese (zh)
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CN101681900A (zh
Inventor
张蕾蕾
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Xilinx Inc
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Xilinx Inc
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Publication date
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Publication of CN101681900A publication Critical patent/CN101681900A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN2008800187222A 2007-06-05 2008-06-05 接触垫和形成用于集成电路的接触垫的方法 Active CN101681900B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/810,616 US7821132B2 (en) 2007-06-05 2007-06-05 Contact pad and method of forming a contact pad for an integrated circuit
US11/810,616 2007-06-05
PCT/US2008/065984 WO2008151301A1 (en) 2007-06-05 2008-06-05 A contact pad and method of forming a contact pad for an integrated circuit

Publications (2)

Publication Number Publication Date
CN101681900A CN101681900A (zh) 2010-03-24
CN101681900B true CN101681900B (zh) 2011-12-07

Family

ID=39671929

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800187222A Active CN101681900B (zh) 2007-06-05 2008-06-05 接触垫和形成用于集成电路的接触垫的方法

Country Status (6)

Country Link
US (1) US7821132B2 (https=)
EP (1) EP2150975B1 (https=)
JP (1) JP5181261B2 (https=)
CN (1) CN101681900B (https=)
CA (1) CA2687424C (https=)
WO (1) WO2008151301A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110278054A1 (en) * 2010-05-14 2011-11-17 I-Tseng Lee Circuit board with notched conductor pads
US8766457B2 (en) 2010-12-01 2014-07-01 SK Hynix Inc. Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
US9087830B2 (en) * 2012-03-22 2015-07-21 Nvidia Corporation System, method, and computer program product for affixing a post to a substrate pad
WO2014039546A1 (en) * 2012-09-05 2014-03-13 Research Triangle Institute, International Electronic devices utilizing contact pads with protrusions and methods for fabrication
WO2014093938A1 (en) * 2012-12-13 2014-06-19 California Institute Of Technology Fabrication of three-dimensional high surface area electrodes
US10376146B2 (en) 2013-02-06 2019-08-13 California Institute Of Technology Miniaturized implantable electrochemical sensor devices
US9536850B2 (en) * 2013-03-08 2017-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Package having substrate with embedded metal trace overlapped by landing pad
US10820844B2 (en) 2015-07-23 2020-11-03 California Institute Of Technology Canary on a chip: embedded sensors with bio-chemical interfaces
DE102016115848B4 (de) * 2016-08-25 2024-02-01 Infineon Technologies Ag Halbleiterbauelemente und Verfahren zum Bilden eines Halbleiterbauelements
US20200006273A1 (en) * 2018-06-28 2020-01-02 Intel Corporation Microelectronic device interconnect structure
US12057429B1 (en) * 2021-06-23 2024-08-06 Hrl Laboratories, Llc Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6384343B1 (en) * 1999-12-03 2002-05-07 Nec Corporation Semiconductor device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592736A (en) * 1993-09-03 1997-01-14 Micron Technology, Inc. Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads
US5686762A (en) * 1995-12-21 1997-11-11 Micron Technology, Inc. Semiconductor device with improved bond pads
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US6313541B1 (en) * 1999-06-08 2001-11-06 Winbond Electronics Corp. Bone-pad with pad edge strengthening structure
DE10252556B3 (de) * 2002-11-08 2004-05-19 Infineon Technologies Ag Elektronisches Bauteil mit Außenkontaktelementen und Verfahren zur Herstellung einer Mehrzahl dieses Bauteils
US6959856B2 (en) * 2003-01-10 2005-11-01 Samsung Electronics Co., Ltd. Solder bump structure and method for forming a solder bump
KR100541396B1 (ko) * 2003-10-22 2006-01-11 삼성전자주식회사 3차원 ｕｂｍ을 포함하는 솔더 범프 구조의 형성 방법
US7170187B2 (en) * 2004-08-31 2007-01-30 International Business Machines Corporation Low stress conductive polymer bump
US7394159B2 (en) * 2005-02-23 2008-07-01 Intel Corporation Delamination reduction between vias and conductive pads

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6384343B1 (en) * 1999-12-03 2002-05-07 Nec Corporation Semiconductor device

Also Published As

Publication number Publication date
JP5181261B2 (ja) 2013-04-10
US20080303152A1 (en) 2008-12-11
CA2687424C (en) 2013-09-24
WO2008151301A1 (en) 2008-12-11
CN101681900A (zh) 2010-03-24
US7821132B2 (en) 2010-10-26
EP2150975B1 (en) 2016-10-26
CA2687424A1 (en) 2008-12-11
EP2150975A1 (en) 2010-02-10
JP2010529681A (ja) 2010-08-26

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