CA2687424C - A contact pad and method of forming a contact pad for an integrated circuit - Google Patents

A contact pad and method of forming a contact pad for an integrated circuit Download PDF

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Publication number
CA2687424C
CA2687424C CA2687424A CA2687424A CA2687424C CA 2687424 C CA2687424 C CA 2687424C CA 2687424 A CA2687424 A CA 2687424A CA 2687424 A CA2687424 A CA 2687424A CA 2687424 C CA2687424 C CA 2687424C
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CA
Canada
Prior art keywords
projections
contact pad
projection
integrated circuit
plateau
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2687424A
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English (en)
French (fr)
Other versions
CA2687424A1 (en
Inventor
Leilei Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xilinx Inc
Original Assignee
Xilinx Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xilinx Inc filed Critical Xilinx Inc
Publication of CA2687424A1 publication Critical patent/CA2687424A1/en
Application granted granted Critical
Publication of CA2687424C publication Critical patent/CA2687424C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CA2687424A 2007-06-05 2008-06-05 A contact pad and method of forming a contact pad for an integrated circuit Active CA2687424C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/810,616 US7821132B2 (en) 2007-06-05 2007-06-05 Contact pad and method of forming a contact pad for an integrated circuit
US11/810,616 2007-06-05
PCT/US2008/065984 WO2008151301A1 (en) 2007-06-05 2008-06-05 A contact pad and method of forming a contact pad for an integrated circuit

Publications (2)

Publication Number Publication Date
CA2687424A1 CA2687424A1 (en) 2008-12-11
CA2687424C true CA2687424C (en) 2013-09-24

Family

ID=39671929

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2687424A Active CA2687424C (en) 2007-06-05 2008-06-05 A contact pad and method of forming a contact pad for an integrated circuit

Country Status (6)

Country Link
US (1) US7821132B2 (https=)
EP (1) EP2150975B1 (https=)
JP (1) JP5181261B2 (https=)
CN (1) CN101681900B (https=)
CA (1) CA2687424C (https=)
WO (1) WO2008151301A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110278054A1 (en) * 2010-05-14 2011-11-17 I-Tseng Lee Circuit board with notched conductor pads
US8766457B2 (en) 2010-12-01 2014-07-01 SK Hynix Inc. Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
US9087830B2 (en) * 2012-03-22 2015-07-21 Nvidia Corporation System, method, and computer program product for affixing a post to a substrate pad
WO2014039546A1 (en) * 2012-09-05 2014-03-13 Research Triangle Institute, International Electronic devices utilizing contact pads with protrusions and methods for fabrication
WO2014093938A1 (en) * 2012-12-13 2014-06-19 California Institute Of Technology Fabrication of three-dimensional high surface area electrodes
US10376146B2 (en) 2013-02-06 2019-08-13 California Institute Of Technology Miniaturized implantable electrochemical sensor devices
US9536850B2 (en) * 2013-03-08 2017-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Package having substrate with embedded metal trace overlapped by landing pad
US10820844B2 (en) 2015-07-23 2020-11-03 California Institute Of Technology Canary on a chip: embedded sensors with bio-chemical interfaces
DE102016115848B4 (de) * 2016-08-25 2024-02-01 Infineon Technologies Ag Halbleiterbauelemente und Verfahren zum Bilden eines Halbleiterbauelements
US20200006273A1 (en) * 2018-06-28 2020-01-02 Intel Corporation Microelectronic device interconnect structure
US12057429B1 (en) * 2021-06-23 2024-08-06 Hrl Laboratories, Llc Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5592736A (en) * 1993-09-03 1997-01-14 Micron Technology, Inc. Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads
US5686762A (en) * 1995-12-21 1997-11-11 Micron Technology, Inc. Semiconductor device with improved bond pads
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
US6313541B1 (en) * 1999-06-08 2001-11-06 Winbond Electronics Corp. Bone-pad with pad edge strengthening structure
JP2001168125A (ja) * 1999-12-03 2001-06-22 Nec Corp 半導体装置
DE10252556B3 (de) * 2002-11-08 2004-05-19 Infineon Technologies Ag Elektronisches Bauteil mit Außenkontaktelementen und Verfahren zur Herstellung einer Mehrzahl dieses Bauteils
US6959856B2 (en) * 2003-01-10 2005-11-01 Samsung Electronics Co., Ltd. Solder bump structure and method for forming a solder bump
KR100541396B1 (ko) * 2003-10-22 2006-01-11 삼성전자주식회사 3차원 ｕｂｍ을 포함하는 솔더 범프 구조의 형성 방법
US7170187B2 (en) * 2004-08-31 2007-01-30 International Business Machines Corporation Low stress conductive polymer bump
US7394159B2 (en) * 2005-02-23 2008-07-01 Intel Corporation Delamination reduction between vias and conductive pads

Also Published As

Publication number Publication date
JP5181261B2 (ja) 2013-04-10
US20080303152A1 (en) 2008-12-11
WO2008151301A1 (en) 2008-12-11
CN101681900A (zh) 2010-03-24
CN101681900B (zh) 2011-12-07
US7821132B2 (en) 2010-10-26
EP2150975B1 (en) 2016-10-26
CA2687424A1 (en) 2008-12-11
EP2150975A1 (en) 2010-02-10
JP2010529681A (ja) 2010-08-26

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