CN101670215A - 分离液气混合物的分离器及包含该分离器的基板处理设备 - Google Patents

分离液气混合物的分离器及包含该分离器的基板处理设备 Download PDF

Info

Publication number
CN101670215A
CN101670215A CN200910170848A CN200910170848A CN101670215A CN 101670215 A CN101670215 A CN 101670215A CN 200910170848 A CN200910170848 A CN 200910170848A CN 200910170848 A CN200910170848 A CN 200910170848A CN 101670215 A CN101670215 A CN 101670215A
Authority
CN
China
Prior art keywords
separator box
separator
porous plate
liquid
discharge opeing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910170848A
Other languages
English (en)
Chinese (zh)
Inventor
金正善
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semes Co Ltd
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of CN101670215A publication Critical patent/CN101670215A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0042—Degasification of liquids modifying the liquid flow
    • B01D19/0052—Degasification of liquids modifying the liquid flow in rotating vessels, vessels containing movable parts or in which centrifugal movement is caused
    • B01D19/0057—Degasification of liquids modifying the liquid flow in rotating vessels, vessels containing movable parts or in which centrifugal movement is caused the centrifugal movement being caused by a vortex, e.g. using a cyclone, or by a tangential inlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34—Chemical or biological purification of waste gases
    • B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • B01D53/77—Liquid phase processes
    • B01D53/78—Liquid phase processes with gas-liquid contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Degasification And Air Bubble Elimination (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Separating Particles In Gases By Inertia (AREA)
CN200910170848A 2008-09-10 2009-09-09 分离液气混合物的分离器及包含该分离器的基板处理设备 Pending CN101670215A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080089171 2008-09-10
KR1020080089171A KR101000296B1 (ko) 2008-09-10 2008-09-10 기액 분리 장치 및 이를 포함하는 기판 처리 장치

Publications (1)

Publication Number Publication Date
CN101670215A true CN101670215A (zh) 2010-03-17

Family

ID=42017761

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910170848A Pending CN101670215A (zh) 2008-09-10 2009-09-09 分离液气混合物的分离器及包含该分离器的基板处理设备

Country Status (4)

Country Link
JP (1) JP4870801B2 (ko)
KR (1) KR101000296B1 (ko)
CN (1) CN101670215A (ko)
TW (1) TWI367776B (ko)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102720549A (zh) * 2012-06-20 2012-10-10 河北省电力勘测设计研究院 真空能旋涡凝汽器
CN103157583A (zh) * 2011-12-13 2013-06-19 亚智科技股份有限公司 槽体排泡装置与方法
CN104174188A (zh) * 2014-08-08 2014-12-03 西北工业大学 一种水洞除气装置
CN110685892A (zh) * 2019-10-31 2020-01-14 汤业禧 一种隔膜真空泵
CN110947578A (zh) * 2018-09-27 2020-04-03 细美事有限公司 药液供应装置
CN111569560A (zh) * 2020-05-26 2020-08-25 江苏双旭科技有限公司 膨胀释能汽水分离器

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2529672C1 (ru) * 2013-07-09 2014-09-27 Шлюмберже Текнолоджи Б.В. Многофазный сепаратор-измеритель
KR101817215B1 (ko) * 2016-03-16 2018-01-11 세메스 주식회사 펌프 및 액 공급 장치
CN108786283B (zh) * 2018-08-31 2023-10-10 中冶北方（大连）工程技术有限公司 一种选矿脱水作业用三级气液分离系统
KR102168831B1 (ko) * 2018-12-10 2020-10-22 주식회사 포스코 폐액 자동배출 여과장치
CN111900102A (zh) * 2019-05-06 2020-11-06 弘塑科技股份有限公司 单晶圆湿处理设备
KR102375491B1 (ko) * 2020-05-22 2022-03-17 주식회사 티에스티이 세포도말용 진공 흡입 장치
CN117443082A (zh) * 2022-06-09 2024-01-26 河北雄安三千科技有限责任公司 分离装置和分离方法
KR102613617B1 (ko) * 2023-02-13 2023-12-14 주식회사 어반트리 지속 가능한 항균 집진기

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61106324A (ja) * 1984-10-25 1986-05-24 Advantest Corp Ｉｃハンドリング装置
JPS61197206A (ja) * 1985-02-27 1986-09-01 Toyoda Gosei Co Ltd ゴム材料準備装置
JPH02120675A (ja) * 1988-10-31 1990-05-08 Nippon Telegr & Teleph Corp <Ntt> 電気信号測定方法
JP3140624B2 (ja) * 1993-12-28 2001-03-05 日本電熱計器株式会社 霧状フラックスの捕集装置
JP3769114B2 (ja) * 1997-11-07 2006-04-19 九州電力株式会社 ガスタービンの性能低下防止装置
JP2004016842A (ja) * 2002-06-12 2004-01-22 Tsudakoma Corp ミスト回収装置
EP2082077A2 (en) * 2006-09-22 2009-07-29 Applied Materials, Inc. System and method including a particle trap/filter for recirculating a dilution gas

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103157583A (zh) * 2011-12-13 2013-06-19 亚智科技股份有限公司 槽体排泡装置与方法
CN102720549A (zh) * 2012-06-20 2012-10-10 河北省电力勘测设计研究院 真空能旋涡凝汽器
CN104174188A (zh) * 2014-08-08 2014-12-03 西北工业大学 一种水洞除气装置
CN104174188B (zh) * 2014-08-08 2015-09-30 西北工业大学 一种水洞除气装置
CN110947578A (zh) * 2018-09-27 2020-04-03 细美事有限公司 药液供应装置
CN110685892A (zh) * 2019-10-31 2020-01-14 汤业禧 一种隔膜真空泵
CN110685892B (zh) * 2019-10-31 2021-09-03 福雪莱冷暖设备(东莞)有限公司 一种隔膜真空泵
CN111569560A (zh) * 2020-05-26 2020-08-25 江苏双旭科技有限公司 膨胀释能汽水分离器
CN111569560B (zh) * 2020-05-26 2021-06-25 江苏双旭动力科技有限公司 膨胀释能汽水分离器

Also Published As

Publication number Publication date
TW201016293A (en) 2010-05-01
KR20100030288A (ko) 2010-03-18
JP2010064068A (ja) 2010-03-25
TWI367776B (en) 2012-07-11
KR101000296B1 (ko) 2010-12-13
JP4870801B2 (ja) 2012-02-08

Similar Documents

Publication Publication Date Title
CN101670215A (zh) 分离液气混合物的分离器及包含该分离器的基板处理设备
KR101817212B1 (ko) 처리액 분사 유닛 및 기판 처리 장치
CN104646337A (zh) 清洁基板的设备
KR101688620B1 (ko) 웨이퍼 수납용기
KR101853265B1 (ko) 증착 마스크
CN208422868U (zh) 用于处理基板的腔室
TWI641035B (zh) 基板處理裝置
KR20140115959A (ko) 노즐 세정 유닛 및 노즐 세정 방법
US20160020085A1 (en) Substrate processing device
WO2018041099A1 (zh) 镜片防污染装置及方法
US9873939B2 (en) Microfluidic device and method using double anodic bonding
KR101177926B1 (ko) 진공흡착장치
CN104051301A (zh) 基板处理装置以及喷出头待机方法
CN102092955B (zh) 蚀刻设备
US20190189471A1 (en) Standby port and substrate processing apparatus having the same
TW202129808A (zh) 基板處理裝置
TWI718529B (zh) 單晶圓濕處理設備
EP3151981B1 (en) System and method for cleaning an object
CN110917774A (zh) 一种用于环保设备的废气处理输送装置
US20170098538A1 (en) Substrate processing apparatus
JP2006026634A (ja) 吸入ユニットアセンブリー
KR101884852B1 (ko) 처리액 분사 유닛 및 기판 처리 장치
CN103041940A (zh) 流体喷射装置
WO2011129152A1 (ja) 旋回流形成体及び非接触搬送装置
CN101315874B (zh) 基板的保持装置及基板的处理方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20100317