CN101641204B - 树脂部件的接合方法 - Google Patents

树脂部件的接合方法 Download PDF

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Publication number
CN101641204B
CN101641204B CN2008800093314A CN200880009331A CN101641204B CN 101641204 B CN101641204 B CN 101641204B CN 2008800093314 A CN2008800093314 A CN 2008800093314A CN 200880009331 A CN200880009331 A CN 200880009331A CN 101641204 B CN101641204 B CN 101641204B
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resin component
base station
resin
laser
component
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CN101641204A (zh
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关原干司
上平真嘉
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Konica Minolta Opto Inc
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Konica Minolta Opto Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
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    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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Abstract

本发明提供一种树脂部件的接合方法，其中，在通过激光熔接接合树脂部件和树脂部件时，能够防止树脂部件在与接合用的基台、夹具的接触面上熔融。接合方法的特征在于，树脂部件(1)被载置于基台(3)上，基台(3)与树脂部件(1)接触的面为光学镜面。通过在树脂部件(1)表面涂布光吸收剂(4)，并在其上重合树脂部件(2)，然后从树脂部件(2)一侧照射激光(10)，由此使树脂部件(1)和树脂部件(2)的接合面的树脂熔融，接合两部件。透过接合面的激光(11)到达树脂部件(1)与基台(3)接触的接触面，但因为激光(11)在接触面上不散射或被吸收而是透过，所以能够防止树脂部件的熔融。

Description

树脂部件的接合方法
技术领域
本发明涉及用激光熔接接合树脂部件和树脂部件的接合方法。
背景技术
用激光熔接接合树脂部件和树脂部件时，必须用载置树脂部件的基台和夹具对树脂部件和树脂部件进行按压固定。参照图4，对树脂部件接合方法的以往技术作说明。图4是树脂部件接合方法的以往技术说明图，是树脂部件的截面图。
将例如平板形状的树脂部件20放置在平板形状的基台22上，在树脂部件20表面涂布光吸收剂23，将平板形状的树脂部件21重合到树脂部件20涂布了光吸收剂23的面上。在树脂部件21上载置由玻璃等光透过性部件构成的平板形状按压部件25，利用按压部件25和基台22夹紧树脂部件20和树脂部件21。在按压部件25压住树脂部件20、21的状态下，从按压部件25上方对树脂部件20、21照射激光10。激光10透过按压部件25和树脂部件21照射到光吸收剂23上。激光10被光吸收剂23吸收，在激光10被吸收的部分(图4所示熔融区域24)发热，树脂部件20和树脂部件21的接合面上的树脂熔融。树脂部件20和树脂部件21由此接合。
激光熔接时，激光的大多透过树脂部件20。透过树脂部件20的激光11到达与树脂部件20接触的基台22表面。在基台22表面(与树脂部件20接触的面)是由不透过激光的材料构成时，激光11在基台22表面散射或被吸收，基台22表面(与树脂部件20接触的面)发热。一旦基台22表面发热，与基台22表面接触的树脂部件20表面便熔融(图4所示的熔融区域26)，有基台22表面形状被转印到树脂部件20表面的担忧。尤其是在基台22表面粗糙的情况时，基台22表面形状转印到树脂部件20表面的话会导致接合部件表面状态劣化。表面状态劣化降低外观质量。例如在对接合部件照射光线进行光学检测和评价等时，外观质量的降低对检测和评价性能都会产生不良影响。
专利文献1中公开了一种通过热压接、超声波熔接、粘结剂或激光熔接接合塑料基板与塑料基板的方法。但是，专利文献1中的激光熔接中，没有公开为了避免在基台表面发热的方法，难以解决上述问题。
专利文献1：特开2005-74775号公报
发明内容
发明欲解决的课题
本发明为了解决上述问题，以提供一种树脂部件的接合方法为目的，其中，在通过激光熔接接合树脂部件和树脂部件时，能够防止树脂部件在与接合用的基台、夹具的接触面上熔融。
用来解决课题的手段
本发明的第1方式，是一种树脂部件的接合方法，其特征在于，将对入射激光具有光透过性的第1树脂部件，载置于与所述第1树脂部件接触的面为光学镜面的基台上，在所述第1树脂部件的与所述基台相反的面上，经由对入射光具有光吸收性的光吸收剂，重合具有光透过性的第2树脂部件，在按压所述第1树脂部件和所述第2树脂部件的状态下，从所述第2树脂部件一侧的外部，经由所述光吸收剂照射激光，使所述第1树脂部件和所述第2树脂部件的接合面熔融，由此接合所述第1树脂部件和所述第2树脂部件。本发明中的光学镜面是指表面粗糙度Ra被形成在5nm以上100nm以下之范围的面。
本发明的第2方式，是第1方式涉及的树脂部件的接合方法，其特征在于，在所述第2树脂部件上重合与所述第2树脂部件接触的面为光学镜面的按压部件，在由所述按压部件和所述基台夹住所述第1树脂部件和所述第2树脂部件、按压所述第1树脂部件和所述第2树脂部件的状态下，照射激光。
本发明的第3方式，是第2方式涉及的树脂部件的接合方法，其特征在于，所述基台和所述按压部件中的至少一个由对入射的激光具有光透过性的光透过性部件构成，经由所述一个光透过性部件照射激光。
本发明的第4方式，是第1方式或第2方式的任何一项中涉及的树脂部件的接合方法，其特征在于，所述基台的至少与所述第1树脂部件接触的面，是由对入射的激光具有光透过性的光透过性部件构成的。
本发明的第5方式，是第3方式或第4方式的任何一项中涉及的树脂部件的接合方法，其特征在于，所述光透过性部件是玻璃、石英或透明树脂。
本发明的第6方式，是第1方式或第2方式的任何一项中涉及的树脂部件的接合方法，其特征在于，所述基台的至少与所述第1树脂部件接触的面，是由金属构成的。
本发明的第7方式，是第1方式至第6方式的任何一项中涉及的树脂部件的接合方法，其特征在于，所述第1树脂部件和所述第2树脂部件中的至少一个树脂部件在所述接合表面上形成了槽。
发明的效果
根据本发明，通过熔接接合树脂部件和树脂部件时，通过使载置树脂部件的基台为光学镜面，这样照射到树脂部件且透过树脂部件的激光在基台表面不会散射或被吸收。因此，基台和树脂部件的接触面上不发热，能够防止树脂部件在接触面上熔融。
附图说明
图1：本发明实施方式涉及的树脂部件接合方法的说明图，树脂部件的截面图。
图2：本发明实施方式涉及的树脂部件接合方法的说明图，树脂部件的截面图。
图3：变形例涉及的树脂部件接合方法的说明图，树脂部件的截面图。
图4：以往技术涉及的树脂部件接合方法的说明图，树脂部件的截面图。
符号说明
1、2、7    树脂部件
3       基台
4       光吸收剂
5       熔融区域
6       按压部件
8       槽
10、11  激光
具体实施方式
(实施方式)
参照图1及图2，对本发明实施方式涉及的树脂部件的接合方法作说明。图1及图2是本发明实施方式涉及的树脂部件接合方法的说明图，是树脂部件的截面图。
如图1(a)所示，树脂部件1和树脂部件2是平板形状的基板。并且树脂部件1和树脂部件2具有光透过性。接合树脂部件1和树脂部件2时，将树脂部件1载置于平板形状的基台3。
基台3与树脂部件1接触的面是光学镜面。本发明中的“光学镜面”是指表面粗糙度Ra在5nm以上100nm以下之范围的面。
基台3采用对入射的激光具有光透过性的材料。“具有光透过性”是指对入射光具有透过率在80％以上之特性。例如采用玻璃、石英或透明树脂等作为基台3的材料。作为玻璃材料，采用BK7、合成石英等。作为透明树脂材料，采用对波长800nm左右的激光具有透过性的聚甲基丙烯酸甲基、环状聚烯烃、聚碳酸酯等。本实施方式中，基台3的透过率在80％至95％。
本实施方式中，为了通过激光熔接接合树脂部件1和树脂部件2，树脂部件1和树脂部件2采用对激光具有透过性的树脂。例如聚甲基丙烯酸甲基、环状聚烯烃等，因为对波长800nm左右的激光具有透过性，所以用作树脂基板1、2。
(激光熔接)
通过照射激光接合树脂部件1和树脂部件2时，如图1(a)所示，在树脂部件1表面涂布光吸收剂4。通过例如分配器、压印方式在树脂部件1表面涂布光吸收剂4。光吸收剂是对入射的激光具有光吸收性的物质。光吸收性是指对激光波长具有50％至95％的吸收。本实施方式中的光吸收剂4根据激光波长，采用红外线吸收剂或紫外线吸收剂。
在树脂部件1表面涂布光吸收剂4之后，如图1(b)所示，重合树脂部件1和树脂部件2。然后在按压树脂部件1和树脂部件2的状态下，对树脂部件1和树脂部件2照射激光10。图1所示的例子中，从树脂部件2侧照射激光10，激光10透过树脂部件2被光吸收剂4吸收。激光10被吸收的部分(图1(b)所示的熔融区域5)发热，在树脂部件1和树脂部件2接合面上的树脂熔融。
如上所述，由于树脂部件1和树脂部件2接合面上的树脂熔融，树脂部件1和树脂部件2被接合。激光熔接可以采用周知的方法。例如可以采用特开2005-74796号公报中记载的方法。作为1例，用输出功率0.1W至20W的红外线激光对树脂部件1、2上面进行扫描，由此接合树脂部件1、2。
照射到树脂部件1和树脂部件2上的激光10透过树脂部件1和树脂部件2的接合面。透过接合面的激光11透过树脂部件1到达基台3。基台3由玻璃、石英或透明树脂等透过激光的材料构成，并且基台3的表面(与树脂部件1的接触面)是光学镜面(表面粗糙度Ra在5nm以上100nm以下)，所以，透过树脂部件1的激光11透过基台3。此时，激光11在基台3和树脂部件1的接触面上不散射也不被吸收。结果，基台3和树脂部件1的接触面上不发热，所以在接触面上树脂部件1的表面(与基台3的接触面)不熔融。
作为基台3的材料，考虑基台3的平面性、树脂部件1、2接合时的冷却效果，优选采用玻璃。
如上所述，通过使基台3的表面(与树脂部件1的接触面)为光学镜面，这样能够使树脂部件1的表面(与基台3的接触面)不熔融地接合树脂部件1和树脂部件2。因此，能够使基台3的表面形状不转印到树脂部件1表面(与基台3的接触面)上地接合树脂部件1和树脂部件2。由此能够提高接合部件的外观质量。
上述接合制成的部件表面反映基台3的表面状态。因此，能够制作外观质量良好的部件。
作为基台3的材料，也可以用反射激光的材料来代替透过激光的材料。例如，可以采用金属作为基台3的材料。基台3的材料采用金属时，也使基台3的表面(与树脂部件1的接触面)为光学镜面(表面粗糙度Ra在5nm以上100nm以下)。这样，虽然基台3采用金属，但因为与树脂部件1的接触面也为光学镜面，所以透过树脂部件1的激光11在基台3的表面(与树脂部件1的接触面)被反射。此时，激光11在基台3和树脂部件1的接触面上不散射也不被吸收。结果，基台3和树脂部件1的接触面上不发热，所以在接触面上树脂部件1的表面(与基台3的接触面)不熔融。这样，能够使基台3的表面形状不转印到树脂部件1表面(与基台3的接触面)上地接合树脂部件1和树脂部件2。
作为用于基台3的金属，采用不锈钢类合金、铝合金等，也可以实施Ni-P化学沉积、镀Cr等表面处理。
优选按压树脂部件1和树脂部件2的按压部件与树脂部件的接触面也为光学镜面(表面粗糙度Ra在5nm以上100nm以下)。激光熔接时，如图2所示，在树脂部件2上面载置平板形状的按压部件6，由按压部件6和基台3夹紧树脂部件1和树脂部件2。该按压部件6采用透过激光的材料。例如，采用玻璃、石英或透明树脂等作为按压部件6的材料。
在按压部件6按压树脂部件1、2的状态下，从按压部件6的上方对树脂部件1、2照射激光10。激光10透过按压部件6和树脂部件2照射到光吸收剂4上。于是，树脂部件1和树脂部件2的接合面上的树脂熔融，树脂部件1和树脂部件2接合。
用来按压树脂部件1和树脂部件2的按压部件6的表面(与树脂部件2的接触面)为光学镜面(表面粗糙度Ra在5nm以上100nm以下)。因此，从按压部件6的上方照射的激光10，在按压部件6和树脂部件2的接触面上不会散射或被吸收。结果，按压部件6和树脂部件2的接触面上不发热，所以接触面上树脂部件2的表面(与按压部件6的接触面)不熔融。这样，能够使按压部件6的表面形状不转印到树脂部件2的表面(与按压部件6的接触面)上地接合树脂部件1和树脂部件2。
基台3至少与树脂部件1接触的表面是由透过激光的材料构成即可。也就是说，即使基台3整体不用透过激光的材料构成，只要与树脂部件1接触的表面是用透过激光的材料构成即可。也就是说，用玻璃、石英或透明树脂构成基台3的表面(与树脂部件1接触的表面)，并且将该表面形成为光学镜面(表面粗糙度Ra在5nm以上100nm以下)。这样，通过用透过激光的材料构成基台3的表面，并且使该表面为光学镜面，激光11在基台3和树脂部件1的接触面上不散射也不被吸收。接触面上不会发热。结果，与基台3的接触面上树脂部件1不熔融，能够使基台3的表面形状不转印到树脂部件1的表面(与基台3的接触面)上地接合树脂部件1和树脂部件2。
还可以用对入射的激光具有光透过性的部件构成基台3和按压部件6中的任意一个，用金属构成另一个。“具有光透过性”是指对入射光具有透过率在80％以上的特性。例如，采用玻璃、石英或透明树脂等作为具有光透过性的部件。作为玻璃材料，采用BK7、合成石英等。作为透明树脂材料，采用对波长800nm左右的激光具有透过性的聚甲基丙烯酸甲基、环状聚烯烃、聚碳酸酯等。本实施方式中，基台3和按压部件6中的任意一个的透过率在80％至95％。
此时，经由由对激光具有光透过性的部件构成的基台3或按压部件6，对树脂部件1、2照射激光。例如，用金属构成基台3时，用玻璃、石英或透明树脂构成按压部件6，经由按压部件6对树脂部件1、2照射激光。另外，用金属构成按压部件6时，用玻璃、石英或透明树脂构成基台3，经由基台3对树脂部件1、2照射激光。基台2和按压部件6双方都用透过激光的部件(玻璃、石英或透明树脂)构成时，可以从任意一侧对树脂部件1、2照射激光。
(变形例)
接下去参照图3，对上述实施方式涉及的树脂部件接合方法的变形例作说明。图3是变形例涉及的树脂部件接合方法的说明图，是树脂部件的截面图。上述实施方式中接合了表面平坦的树脂部件和树脂部件。也可以接合表面有微细形状的树脂部件和树脂部件。该变形例中，接合表面形成了槽的树脂部件和平板形状的树脂部件。
如图3(a)所示，树脂部件7的表面上形成有沿着表面延伸的槽8。与树脂部件7接合的对方树脂部件2是平板形状的基板。把形成有槽8的面放在内侧，接合树脂部件7和树脂部件2，由此制作内部形成了流路的部件。树脂部件2起到作为槽8的盖子之功能。
如图3(a)所示，以形成有槽8的面的相反表面为基台3侧，在基台3上载置树脂部件7。通过例如压印方式，在树脂部件7槽8之外的表面上涂布光吸收剂4。通过在槽8之外的表面上涂布光吸收剂4，这样能够抑制在槽8的发热、熔融，激光熔接时，能够维持槽8的形状。
在树脂部件7的表面涂布光吸收剂4之后，如图3(b)所示，以形成有槽8的面为内侧，重合树脂部件2和树脂部件7。在按压树脂部件2和树脂部件7的状态下，对树脂部件2和树脂部件7照射激光10。与上述实施方式相同，从树脂部件2侧照射激光10，激光10透过树脂部件2被光吸收剂4吸收。激光10被吸收的部分(图3(b)所示的熔融区域5)发热，树脂部件2和树脂部件7的接合面上树脂熔融。
如上所述，由于树脂部件2和树脂部件7的接合面上树脂熔融，树脂部件2和树脂部件7被接合。
与上述实施方式相同，激光10透过树脂部件2和树脂部件7的接合面。透过接合面的激光11透过树脂部件7。基台3与上述实施方式相同，由玻璃、石英或透明树脂等透过激光的材料构成，并且基台3的表面(与树脂部件7的接触面)是光学镜面(表面粗糙度Ra在5nm以上100nm以下)，所以，透过树脂部件7的激光11透过基台3。此时，激光11在基台3和树脂部件7的接触面上不散射也不被吸收，接触面上不发热。这样在与基台3的接触面上，能够使得树脂部件7的表面(与基台3的接触面)不熔融地接合树脂部件2和树脂部件7。
树脂部件2和树脂部件7接合成的部件，可以用作例如进行核酸、蛋白质、血液等液体试料的化学反应、分离、分析等的微型分析芯片或被称之为μTAS(Micro Total Analysis Systems)的装置。
用于上述微型芯片时，例如在表面形成了槽8的树脂部件7上形成贯通基板的贯通孔。该贯通孔与槽8相接，并且树脂部件7和树脂部件2接合后成为连接外部与槽8的开口部。该开口部是用来导入、保存、排出胶滞体、试料、缓冲液的孔。开口部的形状除了圆形和矩形之外还可以是其他各种形状。在上述开口部上连接分析装置上设有的导管和管嘴，通过导管和管嘴将胶滞体、试料或缓冲液等导入槽8或从槽8排出。也可以在树脂部件2上形成贯通孔，形成开口部。
如上所述，用树脂部件2、7作为微型芯片时，树脂部件2、7的形状只要是容易操纵、分析的形状，任何形状都可以。例如优选10mm方至200mm方左右的大小，更优选10mm方至100mm方。树脂部件2、7的形状只要符合分析手法和分析装置即可，优选正方形、长方形、圆形等形状。
有关槽8的形状，考虑到分析试料、试药的使用量可以少一些，还有成型模具的制作精度、转印性、脱模性等，优选宽度为10μm至200μm、深度为30μm至200μm范围内的数值，但并没有特殊限定。纵横比(槽深/槽宽)优选为0.1至3左右，更优选为0.2至2左右。槽8的宽和深还可以根据微型芯片的用途决定。为了方便说明，图3(a)及图3(b)所示的槽8的截面形状为矩形形状，槽8的宽度在深度方向上不变。该形状是槽8的一例，截面形状也可以是曲面形状。
树脂部件2、7用作微型芯片时，树脂部件2、7的板厚在0.2mm至5mm左右范围，若考虑成型性，优选为0.5mm至2mm。作为盖子功能的树脂部件2上不形成槽时，可以不是板状部件而用薄膜(片状部件)。此时优选薄膜的厚度为30μm至300μm，更优选为50μm至150μm。
如上所述，通过用基台3接合树脂部件2、7制造微型芯片，能够制作表面粗糙度Ra良好的微型芯片。这样，检查时不妨碍光线的透过，能够良好地进行检查和分析。
(实施例)
接下去说明具体实施例。
(树脂部件1、2)
用注射成型机成型透明树脂材料环状聚烯烃树脂(日本ゼオン公司制造、ゼオノア)，制作外形尺寸为50mm×50mm×1mm的板状部件。该板状部件相当于上述实施方式中的树脂部件1和树脂部件2。
(基台3、按压部件6)
载置树脂部件1的基台3采用玻璃基板，其是表面粗糙度Ra为10nm的光学镜面。玻璃材料用BK7。该基台3的透过率为92％。
用来按压树脂部件1和树脂部件2的按压部件6采用玻璃基板，其是表面粗糙度Ra为10nm的光学镜面。玻璃材料用BK7。该按压部件6的透过率为92％。
(激光熔接接合)
将树脂部件1载置于由玻璃基板构成的基台3上，在树脂部件1的表面涂布光吸收剂4。光吸收剂4是采用GENTEX公司制造的红外线吸收剂“Clearweld”。然后，使光吸收剂4介于中间地在树脂部件1上重合树脂部件2。
由基台3和按压部件6夹紧树脂部件1、2，在夹紧状态下对树脂部件1、2照射激光，由此接合树脂部件1和树脂部件2。下面出示激光照射条件和加压条件。
在用100N的加压力加压树脂部件1和树脂部件2的状态下，用波长808nm、斑点径φ0.6mm的红外线激光，以输出功率5W一边照射一边以10mm/sec的扫描速度全面扫描，由此接合树脂部件1和树脂部件2。
(評価)
确认到了树脂部件1的表面(与基台3接触的面)没有熔融。还确认到了树脂部件2的表面(与按压部件6接触的面)没有熔融。这样，避免了在树脂部件1表面(与基台3接触的面)的树脂熔融，并且，避免了在树脂部件2表面(与按压部件6接触的面)的树脂熔融，提高了由树脂部件1和树脂部件2构成的部件的外观质量。
本发明不局限于上述实施例中采用的树脂材料、基台3及按压部件6的表面粗糙度Ra条件。采用上述实施方式中举出的树脂也能够得到与上述实施例同样的效果。另外，只要基台3和按压部件6的表面为光学镜面(表面粗糙度Ra在5nm以上100nm以下)，便能够得到与上述实施例同样的效果。

Claims (7)

1.一种使光线透过而在检查或分析中使用的树脂部件的接合方法，其特征在于，
将对入射激光具有光透过性的第1树脂部件，载置于与所述第1树脂部件接触的面为光学镜面的基台上，
在所述第1树脂部件的与所述基台相反的面上，经由对入射光具有光吸收性的光吸收剂，重合具有光透过性的第2树脂部件，在按压所述第1树脂部件和所述第2树脂部件的状态下，从所述第2树脂部件一侧的外部经由所述光吸收剂照射激光，使所述第1树脂部件和所述第2树脂部件的接合面熔融，由此接合所述第1树脂部件和所述第2树脂部件，
所述光学镜面是被形成为表面粗糙度Ra在5nm以上100nm以下之范围的面。
2.如权利要求1中记载的树脂部件的接合方法，其特征在于，在所述第2树脂部件上重合与所述第2树脂部件接触的面为光学镜面的按压部件，在由所述按压部件和所述基台夹住所述第1树脂部件和所述第2树脂部件、按压所述第1树脂部件和所述第2树脂部件的状态下，照射激光。
3.如权利要求2中记载的树脂部件的接合方法，其特征在于，所述基台和所述按压部件中的至少一个由对入射的激光具有光透过性的光透过性部件构成，经由所述一个光透过性部件照射激光。
4.如权利要求1中记载的树脂部件的接合方法，其特征在于，所述基台的至少与所述第1树脂部件接触的面，是由对入射的激光具有光透过性的光透过性部件构成的。
5.如权利要求4中记载的树脂部件的接合方法，其特征在于，所述光透过性部件是玻璃、石英或透明树脂。
6.如权利要求1中记载的树脂部件的接合方法，其特征在于，所述基台的至少与所述第1树脂部件接触的面，是由金属构成的。
7.如权利要求1中记载的树脂部件的接合方法，其特征在于，所述第1树脂部件和所述第2树脂部件中的至少一个树脂部件在所述接合表面上形成了槽。
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