CN101633735B - 高折射率聚硅氧烷及其制备 - Google Patents

高折射率聚硅氧烷及其制备 Download PDF

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Publication number
CN101633735B
CN101633735B CN2009101680340A CN200910168034A CN101633735B CN 101633735 B CN101633735 B CN 101633735B CN 2009101680340 A CN2009101680340 A CN 2009101680340A CN 200910168034 A CN200910168034 A CN 200910168034A CN 101633735 B CN101633735 B CN 101633735B
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aryl
sio
polysiloxane
unit
refractive index
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Expired - Fee Related
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CN2009101680340A
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English (en)
Chinese (zh)
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CN101633735A (zh
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P·切瓦里尔
区端力
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Dow Silicones Corp
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Dow Corning Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • C09D183/08Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/12Organo silicon halides
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02Silicon compounds
    • C07F7/08Compounds having one or more C—Si linkages
    • C07F7/12Organo silicon halides
    • C07F7/121Preparation or treatment not provided for in C07F7/14, C07F7/16 or C07F7/20
    • C07F7/122Preparation or treatment not provided for in C07F7/14, C07F7/16 or C07F7/20 by reactions involving the formation of Si-C linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/22Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/38Polysiloxanes modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/38Polysiloxanes modified by chemical after-treatment
    • C08G77/382Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/385Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing halogens
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
CN2009101680340A 2001-07-28 2002-07-18 高折射率聚硅氧烷及其制备 Expired - Fee Related CN101633735B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0118473.8A GB0118473D0 (en) 2001-07-28 2001-07-28 High refractive index polysiloxanes and their preparation
GB0118473.8 2001-07-28

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB028166167A Division CN100547014C (zh) 2001-07-28 2002-07-18 高折射率聚硅氧烷及其制备

Publications (2)

Publication Number Publication Date
CN101633735A CN101633735A (zh) 2010-01-27
CN101633735B true CN101633735B (zh) 2011-07-20

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CN2009101680340A Expired - Fee Related CN101633735B (zh) 2001-07-28 2002-07-18 高折射率聚硅氧烷及其制备
CNB028166167A Expired - Fee Related CN100547014C (zh) 2001-07-28 2002-07-18 高折射率聚硅氧烷及其制备

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US (1) US7429638B2 (enExample)
EP (1) EP1417252B1 (enExample)
JP (1) JP2004536210A (enExample)
KR (3) KR20100024506A (enExample)
CN (2) CN101633735B (enExample)
AU (1) AU2002321283A1 (enExample)
CA (1) CA2455331A1 (enExample)
GB (1) GB0118473D0 (enExample)
WO (1) WO2003011944A2 (enExample)

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GB0118473D0 (en) 2001-07-28 2001-09-19 Dow Corning High refractive index polysiloxanes and their preparation
JP5296297B2 (ja) * 2005-04-04 2013-09-25 東レ・ファインケミカル株式会社 縮合多環式炭化水素基を有するシリコーン共重合体及びその製造方法
WO2006127100A1 (en) * 2005-05-26 2006-11-30 Dow Corning Corporation Process and silicone encapsulant composition for molding small shapes
WO2007086987A1 (en) * 2006-01-17 2007-08-02 Dow Corning Corporation Thermally stable transparent silicone resin compositions and methods for their preparation and use
EP1979774A1 (en) * 2006-02-01 2008-10-15 Dow Corning Corporation Impact resistant optical waveguide and method of manufacture thereof
US8258502B2 (en) * 2006-02-24 2012-09-04 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
WO2007120628A2 (en) * 2006-04-11 2007-10-25 Dow Corning Corporation A composition including a siloxane and a method of forming the same
US20070272934A1 (en) * 2006-05-23 2007-11-29 Kee Yean Ng LED device with improved life performance
US20070284687A1 (en) * 2006-06-13 2007-12-13 Rantala Juha T Semiconductor optoelectronics devices
TWI473255B (zh) * 2006-07-13 2015-02-11 Silecs Oy 半導體光電裝置
JP5035770B2 (ja) * 2007-02-16 2012-09-26 東レ・ファインケミカル株式会社 縮合多環式炭化水素基を有するシリコーン共重合体、及び、その製造方法
KR101430261B1 (ko) * 2007-02-23 2014-08-14 삼성전자주식회사 유기 실리콘 나노클러스터, 이의 제조방법, 이를 이용한박막형성 방법
JP5318383B2 (ja) * 2007-08-07 2013-10-16 デクセリアルズ株式会社 光学部品封止材及び発光装置
EP2422845B1 (en) 2010-08-24 2013-04-24 Polyphotonix Limited Lightguide phototherapy apparatus
EP2422844A1 (en) 2010-08-24 2012-02-29 Polyphotonix Limited Wearable phototherapy device
US8258636B1 (en) 2011-05-17 2012-09-04 Rohm And Haas Electronic Materials Llc High refractive index curable liquid light emitting diode encapsulant formulation
US8257988B1 (en) 2011-05-17 2012-09-04 Rohm And Haas Electronic Materials Llc Method of making light emitting diodes
WO2013005858A1 (ja) * 2011-07-07 2013-01-10 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
EP2733160A4 (en) * 2011-07-07 2014-12-17 Dow Corning Toray Co Ltd ORGANOPOLYSILOXAN AND MANUFACTURING METHOD THEREFOR
US8455607B2 (en) 2011-08-17 2013-06-04 Rohm And Haas Electronic Materials Llc Curable liquid composite light emitting diode encapsulant
US8450445B2 (en) 2011-08-17 2013-05-28 Rohm And Haas Electronic Materials Llc Light emitting diode manufacturing method
JP6022236B2 (ja) * 2012-06-28 2016-11-09 東レ・ダウコーニング株式会社 コーティング剤、電気・電子機器、および電気・電子機器の金属部の保護方法
CN104487516B (zh) * 2012-07-19 2017-10-24 东丽株式会社 聚硅氧烷组合物、电子器件及光学器件
JP2014077117A (ja) * 2012-09-21 2014-05-01 Dow Corning Toray Co Ltd 高屈折性表面処理剤、それを用いて表面処理された微細部材および光学材料
TWI689533B (zh) * 2014-03-28 2020-04-01 美商道康寧公司 包含與多氟聚醚矽烷反應的固化聚有機矽氧烷中間物之共聚物組成物及其相關形成方法
JP7357505B2 (ja) 2018-11-21 2023-10-06 信越化学工業株式会社 ヨウ素含有熱硬化性ケイ素含有材料、これを含むeuvリソグラフィー用レジスト下層膜形成用組成物、及びパターン形成方法
JP7368324B2 (ja) 2019-07-23 2023-10-24 信越化学工業株式会社 ケイ素含有レジスト下層膜形成用組成物及びパターン形成方法
US11685702B2 (en) * 2019-12-20 2023-06-27 Jsi Silicone Co. Method for producing arene compounds and arene compounds produced by the same
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US6285513B1 (en) * 1999-02-10 2001-09-04 Konica Corporation Optical element

Also Published As

Publication number Publication date
AU2002321283A1 (en) 2003-02-17
US7429638B2 (en) 2008-09-30
WO2003011944A3 (en) 2003-05-08
CA2455331A1 (en) 2003-02-13
EP1417252B1 (en) 2015-07-01
EP1417252A2 (en) 2004-05-12
US20040236057A1 (en) 2004-11-25
JP2004536210A (ja) 2004-12-02
KR20090016019A (ko) 2009-02-12
GB0118473D0 (en) 2001-09-19
KR20040030870A (ko) 2004-04-09
CN100547014C (zh) 2009-10-07
KR20100024506A (ko) 2010-03-05
CN101633735A (zh) 2010-01-27
CN1636031A (zh) 2005-07-06
WO2003011944A2 (en) 2003-02-13

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Address after: michigan

Patentee after: Dow organosilicon company

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Granted publication date: 20110720

Termination date: 20200718