CN101627097A - 用于抛光多晶硅的化学机械抛光液 - Google Patents
用于抛光多晶硅的化学机械抛光液 Download PDFInfo
- Publication number
- CN101627097A CN101627097A CN200780029104A CN200780029104A CN101627097A CN 101627097 A CN101627097 A CN 101627097A CN 200780029104 A CN200780029104 A CN 200780029104A CN 200780029104 A CN200780029104 A CN 200780029104A CN 101627097 A CN101627097 A CN 101627097A
- Authority
- CN
- China
- Prior art keywords
- polishing
- polishing fluid
- silica
- abrasive grains
- polysilicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本发明公开了一种用于抛光多晶硅的化学机械抛光液，该抛光液包括研磨颗粒和水，其还包括一种或多种氧化剂。本发明的抛光液可以在碱性条件下显著改变多晶硅的去除速率，调节多晶硅与二氧化硅的选择比，并明显提高多晶硅的平坦化效率和抛光残留物的去除。
Description
PCT国内申请，说明书已公开。
Claims (1)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2006101161222A CN101143996A (zh) | 2006-09-15 | 2006-09-15 | 用于抛光多晶硅的化学机械抛光液 |
| CN200610116122.2 | 2006-09-15 | ||
| PCT/CN2007/002716 WO2008040158A1 (fr) | 2006-09-15 | 2007-09-14 | Liquide de polissage chimico-mécanique destiné à polir du polysilicium |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210548151.1A Division CN103045099B (zh) | 2007-09-14 | 2007-09-14 | 用于抛光多晶硅的化学机械抛光液 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101627097A true CN101627097A (zh) | 2010-01-13 |
Family
ID=39206738
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101161222A Pending CN101143996A (zh) | 2006-09-15 | 2006-09-15 | 用于抛光多晶硅的化学机械抛光液 |
| CN200780029104A Pending CN101627097A (zh) | 2006-09-15 | 2007-09-14 | 用于抛光多晶硅的化学机械抛光液 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101161222A Pending CN101143996A (zh) | 2006-09-15 | 2006-09-15 | 用于抛光多晶硅的化学机械抛光液 |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN101143996A (zh) |
| WO (1) | WO2008040158A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101747844B (zh) * | 2008-12-19 | 2014-04-16 | 安集微电子（上海）有限公司 | 一种化学机械抛光液及其应用 |
| CN101747842B (zh) * | 2008-12-19 | 2014-12-31 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| CN101696345B (zh) * | 2009-10-21 | 2013-09-18 | 南昌大学 | 一种铝掺杂氧化铈抛光粉及其制备方法 |
| CN113528028A (zh) * | 2021-08-23 | 2021-10-22 | 长鑫存储技术有限公司 | 化学机械抛光液、半导体结构及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3810588B2 (ja) * | 1998-06-22 | 2006-08-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| TW512170B (en) * | 1998-07-24 | 2002-12-01 | Ibm | Aqueous slurry composition and method for polishing a surface using the same |
| JP4366735B2 (ja) * | 1998-11-05 | 2009-11-18 | Ｊｓｒ株式会社 | 重合体粒子を含有する研磨剤 |
| FR2789998B1 (fr) * | 1999-02-18 | 2005-10-07 | Clariant France Sa | Nouvelle composition de polissage mecano-chimique d'une couche en un materiau conducteur d'aluminium ou d'alliage d'aluminium |
| US6280490B1 (en) * | 1999-09-27 | 2001-08-28 | Fujimi America Inc. | Polishing composition and method for producing a memory hard disk |
| DE10048477B4 (de) * | 2000-09-29 | 2008-07-03 | Qimonda Ag | Verfahren zum chemisch-mechanischen Polieren von Schichten aus Metallen der Platingruppe |
| CN1140599C (zh) * | 2002-05-10 | 2004-03-03 | 河北工业大学 | 超大规模集成电路多层铜布线用化学机械全局平面化抛光液 |
| WO2006068328A1 (en) * | 2004-12-22 | 2006-06-29 | Showa Denko K.K. | Polishing composition and polishing method |
-
2006
- 2006-09-15 CN CNA2006101161222A patent/CN101143996A/zh active Pending
-
2007
- 2007-09-14 WO PCT/CN2007/002716 patent/WO2008040158A1/zh active Search and Examination
- 2007-09-14 CN CN200780029104A patent/CN101627097A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN101143996A (zh) | 2008-03-19 |
| WO2008040158A1 (fr) | 2008-04-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100113 |