CN101622525A - 观察方法、检查装置及检查方法 - Google Patents

观察方法、检查装置及检查方法 Download PDF

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Publication number
CN101622525A
CN101622525A CN200880006492A CN200880006492A CN101622525A CN 101622525 A CN101622525 A CN 101622525A CN 200880006492 A CN200880006492 A CN 200880006492A CN 200880006492 A CN200880006492 A CN 200880006492A CN 101622525 A CN101622525 A CN 101622525A
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CN
China
Prior art keywords
mentioned
wavelength
light
inspection
photographs
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Pending
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CN200880006492A
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English (en)
Chinese (zh)
Inventor
深泽和彦
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Nikon Corp
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Nikon Corp
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Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN101622525A publication Critical patent/CN101622525A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN200880006492A 2007-02-28 2008-02-27 观察方法、检查装置及检查方法 Pending CN101622525A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP050821/2007 2007-02-28
JP2007050821 2007-02-28

Publications (1)

Publication Number Publication Date
CN101622525A true CN101622525A (zh) 2010-01-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880006492A Pending CN101622525A (zh) 2007-02-28 2008-02-27 观察方法、检查装置及检查方法

Country Status (6)

Country Link
US (1) US20090315988A1 (enExample)
JP (2) JPWO2008105460A1 (enExample)
KR (1) KR20090127892A (enExample)
CN (1) CN101622525A (enExample)
TW (1) TWI449898B (enExample)
WO (1) WO2008105460A1 (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102645177A (zh) * 2011-02-17 2012-08-22 竑腾科技股份有限公司 晶圆劈裂的前置检测方法
CN103038603A (zh) * 2010-07-30 2013-04-10 克拉-坦科股份有限公司 用于晶片锯痕的三维检查的装置和方法
CN105428268A (zh) * 2014-09-17 2016-03-23 华亚科技股份有限公司 晶圆传送盒的底座检查装置及方法
CN106164653A (zh) * 2014-03-31 2016-11-23 国立大学法人东京大学 检查系统和检查方法
CN109341519A (zh) * 2013-02-21 2019-02-15 诺威量测设备股份有限公司 用于确定结构中的兴趣区域的参数的方法和系统
CN109427609A (zh) * 2017-08-30 2019-03-05 台湾积体电路制造股份有限公司 半导体晶片在线检验的系统及方法
CN109863573A (zh) * 2016-12-12 2019-06-07 应用材料公司 使用多视角检测器通过在线sem在显示器基板上的ltps层鉴定以及检查大面积基板的方法
US10739272B2 (en) 2014-03-31 2020-08-11 The University Of Tokyo Inspection system and inspection method
US10872794B2 (en) 2017-06-20 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Automatic in-line inspection system
CN112461838A (zh) * 2019-09-09 2021-03-09 芯恩（青岛）集成电路有限公司 晶圆缺陷检测装置及方法
CN113866180A (zh) * 2021-12-06 2021-12-31 晶芯成(北京)科技有限公司 一种异物检测方法、半导体晶圆检测方法及系统
CN116107077A (zh) * 2021-11-11 2023-05-12 株式会社东京精密 显微镜以及半导体制造装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5563372B2 (ja) * 2010-05-20 2014-07-30 第一実業ビスウィル株式会社 外観検査装置
JPWO2012153695A1 (ja) * 2011-05-10 2014-07-31 国立大学法人豊橋技術科学大学 機能性光源を用いた検査装置と検査方法及び機能性光源とその設計方法
JP5400107B2 (ja) * 2011-08-16 2014-01-29 Ｃｋｄ株式会社 基板検査装置
FR2998047B1 (fr) * 2012-11-12 2015-10-02 Soitec Silicon On Insulator Procede de mesure des variations d'epaisseur d'une couche d'une structure semi-conductrice multicouche
TWI477766B (zh) * 2012-12-18 2015-03-21 Ind Tech Res Inst 檢測裝置以及檢測方法
JP6132678B2 (ja) * 2013-06-21 2017-05-24 富士フイルム株式会社 偏光フィルターおよびその応用
JP2016070730A (ja) * 2014-09-29 2016-05-09 株式会社Ｓｃｒｅｅｎホールディングス 画像取得装置および画像取得方法
JP6450633B2 (ja) * 2015-04-09 2019-01-09 東京エレクトロン株式会社 異物検出方法、異物検出装置および剥離装置
KR102532040B1 (ko) 2015-04-09 2023-05-15 도쿄엘렉트론가부시키가이샤 이물 제거 장치, 이물 제거 방법, 박리 장치, 이물 검출 방법 및 이물 검출 장치
US10003754B2 (en) 2015-06-18 2018-06-19 Agilent Technologies, Inc. Full field visual-mid-infrared imaging system
JP2017110975A (ja) * 2015-12-15 2017-06-22 キヤノン株式会社 計測装置、システム、計測方法、決定方法及びプログラム
JP6235684B1 (ja) * 2016-11-29 2017-11-22 Ckd株式会社 検査装置及びｐｔｐ包装機
DE112018006287T5 (de) * 2017-12-08 2020-10-08 Panasonic Intellectual Property Management Co., Ltd. Inspektionssystem, inspektionsverfahren, programm und speichermedium
JP7536591B2 (ja) * 2020-10-20 2024-08-20 タカノ株式会社 厚みムラ検査装置及び厚みムラ検査方法
US12068207B2 (en) 2022-05-27 2024-08-20 Taiwan Semiconductor Manufacturing Company, Ltd. Simultaneous multi-bandwidth optical inspection of semiconductor devices

Family Cites Families (17)

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JP2555051B2 (ja) * 1987-02-18 1996-11-20 株式会社日立製作所 パタ−ン検出方法及びその装置
JPS6486518A (en) * 1987-06-05 1989-03-31 Hitachi Ltd Reduction projection type position detection and device therefor
JP3388285B2 (ja) * 1993-12-27 2003-03-17 株式会社ニュークリエイション 検査装置
JPH08318619A (ja) * 1995-05-25 1996-12-03 Dainippon Printing Co Ltd 印刷物検査装置
JPH11237344A (ja) * 1998-02-19 1999-08-31 Hitachi Ltd 欠陥検査方法およびその装置
US6690469B1 (en) * 1998-09-18 2004-02-10 Hitachi, Ltd. Method and apparatus for observing and inspecting defects
US7061614B2 (en) * 2001-10-16 2006-06-13 Therma-Wave, Inc. Measurement system with separate optimized beam paths
JP2005061853A (ja) * 2003-08-13 2005-03-10 Nikon Corp 表面検査装置
TW200519373A (en) * 2003-10-27 2005-06-16 Nikon Corp Surface inspection device and method
TW200540939A (en) * 2004-04-22 2005-12-16 Olympus Corp Defect inspection device and substrate manufacturing system using the same
JP2005351845A (ja) * 2004-06-14 2005-12-22 Olympus Corp 基板検査装置および方法
US7539583B2 (en) * 2005-03-04 2009-05-26 Rudolph Technologies, Inc. Method and system for defect detection
US20080218732A1 (en) * 2005-07-27 2008-09-11 University Of Massachusetts Lowell Infrared Scanner for Biological Applications
JP4778755B2 (ja) * 2005-09-09 2011-09-21 株式会社日立ハイテクノロジーズ 欠陥検査方法及びこれを用いた装置
US7564544B2 (en) * 2006-03-22 2009-07-21 3i Systems Corporation Method and system for inspecting surfaces with improved light efficiency
US7586607B2 (en) * 2006-04-21 2009-09-08 Rudolph Technologies, Inc. Polarization imaging
WO2008007614A1 (en) * 2006-07-14 2008-01-17 Nikon Corporation Surface inspecting apparatus

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103038603A (zh) * 2010-07-30 2013-04-10 克拉-坦科股份有限公司 用于晶片锯痕的三维检查的装置和方法
US9140546B2 (en) 2010-07-30 2015-09-22 Kla-Tencor Corporation Apparatus and method for three dimensional inspection of wafer saw marks
CN102645177B (zh) * 2011-02-17 2014-08-20 竑腾科技股份有限公司 晶圆劈裂的前置检测方法
CN102645177A (zh) * 2011-02-17 2012-08-22 竑腾科技股份有限公司 晶圆劈裂的前置检测方法
CN109341519A (zh) * 2013-02-21 2019-02-15 诺威量测设备股份有限公司 用于确定结构中的兴趣区域的参数的方法和系统
CN109341519B (zh) * 2013-02-21 2020-12-08 诺威量测设备股份有限公司 用于确定结构中的兴趣区域的参数的方法和系统
US10724960B2 (en) 2014-03-31 2020-07-28 The University Of Tokyo Inspection system and inspection method
US10739272B2 (en) 2014-03-31 2020-08-11 The University Of Tokyo Inspection system and inspection method
CN106164653B (zh) * 2014-03-31 2019-10-29 国立大学法人东京大学 检查系统和检查方法
CN106164653A (zh) * 2014-03-31 2016-11-23 国立大学法人东京大学 检查系统和检查方法
CN105428268A (zh) * 2014-09-17 2016-03-23 华亚科技股份有限公司 晶圆传送盒的底座检查装置及方法
CN109863573B (zh) * 2016-12-12 2021-10-15 应用材料公司 检查基板的方法和具有指令存储于其上的计算机可读介质
CN109863573A (zh) * 2016-12-12 2019-06-07 应用材料公司 使用多视角检测器通过在线sem在显示器基板上的ltps层鉴定以及检查大面积基板的方法
US10872794B2 (en) 2017-06-20 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Automatic in-line inspection system
TWI713130B (zh) * 2017-08-30 2020-12-11 台灣積體電路製造股份有限公司 半導體晶片線上檢驗的系統及方法
CN109427609A (zh) * 2017-08-30 2019-03-05 台湾积体电路制造股份有限公司 半导体晶片在线检验的系统及方法
CN109427609B (zh) * 2017-08-30 2022-03-01 台湾积体电路制造股份有限公司 半导体晶片在线检验的系统及方法
CN112461838A (zh) * 2019-09-09 2021-03-09 芯恩（青岛）集成电路有限公司 晶圆缺陷检测装置及方法
CN112461838B (zh) * 2019-09-09 2023-03-10 芯恩（青岛）集成电路有限公司 晶圆缺陷检测装置及方法
CN116107077A (zh) * 2021-11-11 2023-05-12 株式会社东京精密 显微镜以及半导体制造装置
CN113866180A (zh) * 2021-12-06 2021-12-31 晶芯成(北京)科技有限公司 一种异物检测方法、半导体晶圆检测方法及系统

Also Published As

Publication number Publication date
WO2008105460A1 (ja) 2008-09-04
KR20090127892A (ko) 2009-12-14
JP2013083672A (ja) 2013-05-09
TWI449898B (zh) 2014-08-21
TW200844427A (en) 2008-11-16
JPWO2008105460A1 (ja) 2010-06-03
US20090315988A1 (en) 2009-12-24

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Application publication date: 20100106