CN101576688A - Substrate assembling system - Google Patents
Substrate assembling system Download PDFInfo
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- CN101576688A CN101576688A CNA200810179742XA CN200810179742A CN101576688A CN 101576688 A CN101576688 A CN 101576688A CN A200810179742X A CNA200810179742X A CN A200810179742XA CN 200810179742 A CN200810179742 A CN 200810179742A CN 101576688 A CN101576688 A CN 101576688A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Liquid Crystal (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a simple alignment system of a layout configuration. A panel alignment system has constitution in which a load-lock chamber, a deaerating chamber and a panel alignment chamber are arranged linearly, gate valves are provided between the respective chambers, a storing mechanism accumulating a plurality of sheets of lower substrates is provided in the deaerating chamber, upper substrates to be aligned are carried in to the panel alignment chamber by a carrying-in robot and held on an upper table, the panel alignment chamber is provided with a gate valve for receiving the products after being subjected to the alignment from a lower table and taking out the products, the lower substrates with liquid crystal dropped thereon are carried in to the load-lock chamber, and carried in to the deaerating chamber by a conveyor. The lower substrates are then conveyed in order of being carried in to the deaerating chamber into the panel alignment chamber by the conveyor.
Description
Technical field
The present invention relates to the base plate bonding system, particularly relate to the time that to seek to shorten by the end of bonding end, simultaneously can forwarder transport the base plate bonding system of adhesive base plate.
Background technology
In the manufacturing of LCD panel, the two sheet glass substrates that will be provided with transparency electrode, the film transistor matrix extremely approaching interval with a few μ m degree is arranged, by the bonding agent on the circumference that is arranged on substrate (below, be also referred to as sealant) bonding (back, substrate after bonding is called lattice), with sealing liquid crystal therefore and the operation in the space that forms.
This liquid crystal be sealed with under the liquid crystal drop to filling on the substrate according to a side of pattern plotter of sealant, so that inlet is not set, in vacuum chamber, the opposing party's substrate is configured on a side the substrate, make substrate up and down approaching, carry out bonding method etc.Patent documentation 1 discloses for substrate being transported into, transporting in this vacuum chamber the preparation room has been set, and makes to be the environment identical with the preparation room, the situation of carrying out the discrepancy of substrate in the vacuum chamber.
In addition, the formation of patent documentation 2 disclosed vacuum treatment installations is to transport from being transported into of preparation room in order to carry out material swimmingly, in order to carry out the handing-over of substrate in the preparation room, make conveying room also become true hollow body, and substrate is transported to load-lock chambers from process chamber.
[patent documentation 1] TOHKEMY 2001-305563 communique
[patent documentation 2] Japanese kokai publication hei 06-005687 communique
In above-mentioned patent documentation 1, because for when the discrepancy of substrate, making preparation room and vacuum chamber interior is identical environment, and become two bonding plate bases are transported in the preparation room of side's side, if the bonding end of two plate bases, the formation of discharging then from the preparation room that is arranged on the opposing party, so, the big area that is provided with that needs that the configuration of device increases.In addition, because need make each preparation room and bonding chamber become vacuum state, so, need configuration to be used for these device, want spended time by the end of becoming vacuum state, there is boundary in the shortening single products aspect the production time.
In addition, though as citing document 2, proposed to transport robot (robot mechanical hand) in central configuration, dispose load-lock chambers and a plurality of process chamber around it, the configuration of carrying out the processing of substrate constitutes, still, in this constitutes, be accompanied by the maximization of adhesive base plate, process chamber also increases, and needs large tracts of land.In addition, need transport with robot also is the special formation that can work under vacuum state.
Summary of the invention
To achieve these goals, in the present invention, constitute load-lock chambers and degas chamber and the configuration of base plate bonding chamber linearity, simultaneously, between each chamber, the family of power and influence is set, the accommodating mechanism of storage multi-disc infrabasal plate is set in degas chamber, be transported into the bonding upside substrate and the family of power and influence that the goods after bonding are transported in the setting of bonding chamber, be transported into bonding downside substrate from load-lock chambers, according to the order that is transported into degas chamber, transport by forwarder, infrabasal plate is transported to bonding chamber.
In addition, constitute from the load-lock chambers of the configuration of linearity roughly begin with bonding chamber be provided with abreast the substrate that transports processing and bonding after the mobile route of linearity of goods, be arranged on the mobile route and keep and transport the substrate of processing and the robot mechanical arm of goods, configuration constitutes the rotating room of substrate that side's side end setting at mobile route was transported into and transported the substrate of processing, and the storeroom of the goods that interim keeping finishes is set in the opposing party's end.
The invention effect
According to base plate bonding device of the present invention, because constituting can be with load-lock chambers, degas chamber, bonding chamber straight line configuration, the substrate that forwarder transports each chamber transports, simultaneously, be arranged on degas chamber with taking in the dripped accommodating mechanism of substrate of liquid crystal of multi-disc, from the forwarder to the accommodating mechanism, take care of successively, so, needn't use special vacuum robot to get final product, safeguard to become simple.
Description of drawings
Fig. 1 is the figure that expression becomes the example that the integral body of the base plate bonding system of an embodiment of the invention constitutes.
Fig. 2 is the figure that the summary of expression load-lock chambers constitutes.
Fig. 3 is the figure that the summary of expression degas chamber constitutes.
Fig. 4 is the figure that is used to illustrate the substrate reception mechanism of degas chamber.
Fig. 5 is the figure that the summary of the bonding chamber of expression constitutes.
Symbol description
2... rotating room, 3... transport moving track, the 4... of robot and transport robot, 5... load-lock chambers, 6... degas chamber, the bonding chamber of 7..., 8... panel storeroom.
Embodiment
Below, with reference to the accompanying drawings, an embodiment of base plate bonding device of the present invention is described.
Fig. 1 is the vertical view of the configured in one piece of expression base plate bonding device of the present invention.As shown in Figure 1, be provided with that the rotating room 2 of the substrate handled has been carried out in interim keeping in preceding operation and begin from the rotating room linearity configuration be used to make transport that robot 4 moves transport road 3.Transporting road 3 along this, is the center with the load-lock chambers 5 that is used to be transported into infrabasal plate, about respectively by family of power and influence G2～G5, degas chamber 6, bonding chamber 7 are set, become the chamber structure, so that can be to each room decompression.In addition, in the direction relative family of power and influence G1, G5, G6 are set also in load-lock chambers and bonding chamber 7 with transporting road 3.Have again,, be provided for transporting forwarder 5C, 6C, the 7C of infrabasal plate respectively in load-lock chambers, degas chamber 6, bonding chamber 7.This forwarder uses the roller forwarder in the present embodiment, but also can be to use the formation of belt conveyer.Transporting road 3 and end rotating room's opposition side, the panel storeroom 8 of the panel 9 of the bonding end of interim keeping is being set.When taking care of in storeroom 8, panel is incorporated in keeping in the box (accepting rack).If taken in the panel of regulation sheet number in the box, then transported according to each box operation rearwards.
In the rotating room 2, squarely become the colour filtering chip basic board of color filter (back is called CF substrate or upper substrate) 1a and be formed with TFT one, and smeared annularly and be used for bonding sealant, and substrate (back is called TFT substrate or the infrabasal plate) 1b of the liquid crystal agent of the only amount of having dripped in by the sealant area surrounded is transported into rotating room 2.At this moment, CF substrate 1a is transported in bonding supine mode, and TFT substrate 1b is transported in face (adhesive surface) mode up of the liquid crystal that drips.Therefore, CF substrate 1a rotates in bonding ventricumbent mode and is taken care of.
Fig. 2 is the cut-open view of expression load-lock chambers.The TFT substrate 1b that is transported in the substrate of rotating room 2 is maintained at the mechanical hand that transports robot 4, is transported to load-lock chambers 5.Be provided for forwarder 5C that TFT substrate 1b is transported to degas chamber 6 in load-lock chambers 5.In addition, be provided for receiving TFT substrate 1b, hand to the reception pin 11 on the forwarder 5C from the mechanical arm that transports robot 4.This reception pin 11 is incorporated in the bottom of forwarder 5C usually, when receiving TFT substrate 1b, makes drive unit 5M action, and reception pin 11 is risen, and receives TFT substrate 1b from the mechanical arm that transports robot 4.If TFT substrate 1b handed to receives pin 11, then transport the mechanical arm of robot and keep out of the way outside the family of power and influence G1, simultaneously, will receive the bottom that pin pawl 11 is accommodated in forwarder 5C, in view of the above, TFT substrate 1b is handed to forwarder 5C go up and constitute.If TFT substrate 1b is received on the forwarder 5C, then close family of power and influence G1, relief valve 5B1 is by the vacuum pump 5P1 that has driven, to reducing pressure in the load-lock chambers 5.At this moment, relief valve 5B1～5B3.Then, in the moment of the decompression power that reaches regulation, shut-off valve 5B1, relief valve 5B2,5B3 further reduce pressure by the vacuum pump 5P2 that has driven.If become the decompression state of regulation, then open family of power and influence G2, drive forwarder 5C, 1b transports to degas chamber 6 with the TFT substrate.
Fig. 3 is the cut-open view of expression degas chamber 6.At degas chamber 6 accommodating mechanism 30 is set, that this accommodating mechanism 30 has is multistage (maximum five in the present embodiment) substrate maintaining part (frame substrate) 30a is so that can devices spaced apart take in multi-disc TFT substrate 1b.In addition, in degas chamber 6, be retained as the decompression state (vacuum state) that in device work, is always regulation.
The drive member 30M that accommodating mechanism 30 has multistage substrate maintaining part 30a and is made of motor.Fig. 4 is the details of this accommodating mechanism of expression.Fig. 4 (a) is forwarder portion is seen in expression from the top figure, (b) is expression A-A cut-open view.Shown in Fig. 4 a, the substrate maintaining part 30a that constitutes accommodating mechanism 30 rises by making accommodating mechanism 30 between forwarder 6C, can keep the TFT substrate by substrate maintaining part 30a.That is, it is only roughly the same with forwarder 6C to constitute substrate maintaining part 30a, is provided with highlightedly to the inside, can deliver substrate effectively from forwarder.
If on forwarder 6C, transport TFT substrate 1b, then at first carry out contraposition by contraposition mechanism, the position of the waterside direction of TFT substrate 1b is positioned on the substrate maintaining part 30a.This contraposition mechanism as shown in Figure 3, the substrate block 13 that drives up and down by the cylinder 13D of the position of the direct of travel that is used for involutory TFT substrate 1b, with have the drive member 14D that constitutes by cylinder and motor, and move up and down by cylinder, and the rotating cam 14 by motor rotation, and having the drive member 15D that constitutes by cylinder and motor equally, the rotating cam 15 that is used for the position of contraposition left and right directions constitutes.If contraposition finishes, accommodating mechanism 30 is risen, TFT substrate 1b is received substrate maintaining part 30a.If TFT substrate 1b is received substrate maintaining part 30a, then make about forwarder 6C and keep out of the way, make drive member 30M action, accommodating mechanism 30 is risen, by forwarder 6C, make the position of the TFT substrate of taking in be located at the lower position that substrate maintaining part 30a that the top constitutes the next stage of accommodating mechanism 30 does not contact forwarder 6C.After this, forwarder 6C is turned back to common transporting position.Like this, can successively the TFT substrate be run up in the accommodating mechanism 30.
Though above-mentioned formation is to make forwarder keep out of the way the outside, receive the mode of substrate, also accommodating mechanism 30 can be constituted, in a plurality of post of the arranged outside of forwarder 6C portion (4 more than the position), by post portion, substrate maintaining part 30a is extended to forwarder 6C side, receive and the maintenance substrate.But, in this case, need form substrate maintaining part 30a long, need the material of selected aptly formation substrate maintaining part etc., so that when having kept substrate, can not produce deflection.
With multi-disc TFT substrate reception behind this accommodating mechanism 30, close family of power and influence G2, G3, the standby stipulated time,, eliminate the bubble that liquid crystal agent on the TFT substrate that drips in advance etc. is contained with this.
Fig. 5 is the cut-open view of expression base plate bonding device.
Open in advance family of power and influence G6 by transporting the mechanical arm of robot 4, is transported into bonding chamber 7 down with CF substrate (upper substrate) 1a adhesive surface.The CF substrate 1a that is transported into since with negative pressure feeding to the adsorption hole that on upper table, is provided with, so relief valve 7B1 by the vacuum pump 7TP that drives in advance, utilizes to attract absorption, adhesive surface is maintained on the upper table 7UT down.In addition, though in this figure, do not illustrate, but attract the absorption layer in hole to be arranged under the situation of upper table 7UT side at the band that can move up and down, make absorption layer be lowered to the CF real estate, after having kept the CF substrate by absorption layer, rise to upper table 7UT face,, can adsorb maintenance with this.In addition, Electrostatic Absorption member or adhesion retaining member are set, so that can under vacuum state, keep CF substrate 1a on upper table 7UT.By attracting absorption, CF substrate 1a is remained on upper table 7UT after, make the action of Electrostatic Absorption member or by attracting adsorption element to adsorb, until work top, in view of the above, the motion of adhesion retaining member, even the bonding indoor vacuum state that becomes also can keep substrate.
If the maintenance of CF substrate 1a finishes, then under the situation of the panel 9 after having bonding end on the lower table 7DT, keep panel 9 by the mechanical arm that transports robot, be transported to outside the bonding chamber 7.After this, close family of power and influence G6, relief valve 7B2, by the vacuum pump 7P1 of driving, making in the bonding chamber 7 becomes the specified vacuum state in advance.Then, shut-off valve 7B2, relief valve 7B3,7B4 further reduce pressure by the 7P2 that drives in advance.If become the specified vacuum state in the bonding chamber 7, then open family of power and influence G3, a slice TFT substrate 1b is transported to the lower table position of the bonding chamber 7 of same vacuum state from the degas chamber 6 of vacuum state by forwarder 7C.In bonding chamber, be positioned in the TFT substrate 1b that is transported on the forwarder 7C and stop at the position that lower table 7DT carries out mounting.If forwarder 7C stops, the side shifting that then lower table 7DT or the reception pawl that is arranged on lower table 7DT side made progress is from forwarder 7DT reception TFT substrate.If TFT substrate 1b is received lower table 7DT, then keep by electrostatic chuck or adhesion mechanism, TFT substrate 1b can not moved.After this, move in the horizontal direction, carry out contraposition with the CF substrate 1a that remains on upper table 7UT by making lower table 7DT.Constitute on TFT substrate 1b and CF substrate 1a and be respectively equipped with the mark that contraposition is used,, observe this mark, obtain the position amount of staggering by the not shown camera that goes out.If obtain the position amount of staggering, then use to be configured in the outer contraposition mechanism in bonding chamber (vacuum chamber of bonding usefulness), lower table is moved, carry out contraposition.
Above, the formation and the action thereof of each device is illustrated, then, molar behavior is described.
The molar behavior of native system then, is described.Here, the CF substrate is called upper substrate 1a, the TFT substrate is called infrabasal plate 1b describes.
At first, be transported into rotating room 2, the upper substrate 1a counter-rotating that is necessary to rotate is taken care of.In addition, do not need the infrabasal plate 1b that rotates to keep original state to take care of.Then, make and transport robot 4 actions, keep a slice infrabasal plate 1b, move to load-lock chambers 5.Open the family of power and influence G1 of the entrance side of load-lock chambers 5, a slice infrabasal plate 1b is handed to the forwarder 5C (because the details of delivering is illustrated in front, so omit explanation here) of load-lock chambers 5.If infrabasal plate 1b then closes family of power and influence G1 to the end of delivering of forwarder 5C.In addition, this moment load-lock chambers 5 other family of power and influence G2, G4 keeping closed condition.Then, with the decompression state that reduces pressure in the load-lock chambers 5 and stipulate.If decompression finishes, then open family of power and influence G2, drive forwarder 5C and 6C, make infrabasal plate 1b to degas chamber 6 side shiftings.If infrabasal plate 1b moves to degas chamber 6, then make accommodating mechanism 30 actions, will take care of transporting on the forwarder 6C on the substrate maintaining part 30a that the infrabasal plate 1b that comes is positioned in accommodating mechanism 30.
If infrabasal plate 1a is transported into degas chamber 6, then close family of power and influence G2.If family of power and influence G2 is closed, then after making load-lock chambers 5 turn back to atmospheric pressure, open family of power and influence G1.Transport robot 4 and get back to the rotating room,, keep a slice TFT substrate (infrabasal plate 1), before load-lock chambers 5, move, infrabasal plate is handed on the forwarder 5C of load-lock chambers 5 with before identical.If infrabasal plate 1b delivers end on forwarder 5C, the mechanical arm that transports robot 4 is kept out of the way outside the family of power and influence G1.After mechanical arm is kept out of the way, transport robot 4 and get back to rotating room 2, with before identical, keep a slice TFT substrate 1b, before load-lock chambers 5, move.
Then, close family of power and influence G1, to reducing pressure in the load-lock chambers 5.If reach the decompression state of regulation, then, open family of power and influence G2 with before identical, infrabasal plate 1b is accommodated on the shelf of sky of accommodating mechanism 30 of degas chamber 6.If infrabasal plate 1b is transported into degas chamber 6 fully, then close family of power and influence G2.Equally, successively infrabasal plate 1b is being transported into degas chamber 6, when the 4th infrabasal plate is stored in accommodating mechanism 30, transporting robot and take out upper substrate 1a and infrabasal plate 1b from the rotating room from load-lock chambers 5.Then, standby under the state before two substrates is remained on load-lock chambers 5.
If the 4th infrabasal plate 1b is transported into degas chamber 6, then close family of power and influence G2, the substrate of opening load-lock chambers 5 is transported into the family of power and influence G1 of usefulness, and infrabasal plate 1b is handed to forwarder 5C.As if the end of delivering of infrabasal plate 1b, then mechanical arm is kept out of the way outside the load-lock chambers 5, transports robot to bonding chamber 7 side shiftings.
At this moment, simultaneously the 5th infrabasal plate 1b remained on accommodating mechanism 30, with of the control member transmission of its signal to bonding chamber 7 sides.Bonding chamber 7 to be transported into side door valve G6 open, remain on the upper table 7UT that the upper substrate 1a on the mechanical arm that transports robot 4 is set in the bonding chamber 7 and attract absorption (order that upper table 7UT keeps is set forth in front, omitted explanation here).
If upper substrate is delivered to upper table 7UT, the mechanical arm that transports robot is kept out of the way outside the bonding chamber 7, close family of power and influence G6.Then, begin decompression in the bonding chamber 7.If confirm the indoor decompression pressure that reaches regulation, and after the 5th infrabasal plate is transported into degas chamber 6 through the stipulated time, then open the family of power and influence 3 indication to the control member instruction of degas chamber 6 from the control member of bonding chamber 7.The open family of power and influence G3 of the control member of degas chamber 6, simultaneously with a slice infrabasal plate (being accommodated in the infrabasal plate of accommodating mechanism at first) from accommodating mechanism 30 mountings to forwarder 6C, drive forwarder 6C, infrabasal plate 1b is transported to bonding chamber 7.Simultaneously, drive the forwarder 7C of bonding chamber 7, receive infrabasal plate 1b from forwarder 6C, if infrabasal plate is come the mounting position of lower table 7DT, forwarder 7C is stopped, mounting keeps to lower table 7DT, makes it motionless.The maintenance of infrabasal plate 1b is also same with upper substrate 1a, uses Electrostatic Absorption member or adhesion member etc. to keep.
If infrabasal plate 1b is remained on the lower table, then close family of power and influence G3, G6, carry out the contraposition of upper substrate and infrabasal plate simultaneously.The not shown camera that goes out is used in contraposition, and observation is arranged on the alignment mark of each substrate, obtains the position amount of staggering, and uses the horizontal pushing mechanism that has drive source in the outside of bonding chamber, moves in the horizontal direction, and lower table is carried out contraposition.
If contraposition finishes, then with the bonding indoor pressure that reduces pressure to and stipulate.Then, make upper table drop to the lower table side, carry out bonding.In this is bonding, carry out the several times contraposition.
If bonding end, then open family of power and influence G6.Transport robot and keep next upper substrate 1a by the rotating room in advance, standby before family of power and influence G6,1a hands to upper table 7UT with this upper substrate.As if the end that is transported into of upper substrate 1a, then transport the panel 9 that robot keeps bonding end, transport to storeroom 8, be accommodated on the accepting rack.
In addition, in the present embodiment, as shown in Figure 1, across load-lock chambers 5, at opposition side the bonding chamber of degas chamber is set also, undertaken between bonding operational period by the bonding chamber on one-sided (right side of figure), carry out supply,, can improve the single products production time with this to the substrate of the device in the left side of figure.
As mentioned above, by load-lock chambers, degas chamber, the configuration of bonding chamber linearity that substrate is transported into usefulness, can the mode of transporting robot movement being configured with this configuration, in view of the above, the layout of device integral body be simple.In addition,, use forwarder to transport, therefore, there is no need to use vacuum robot, can also safeguard simply owing to transport infrabasal plate via degas chamber to bonding chamber from load-lock chambers.
Claims (3)
1. base plate bonding system, it is characterized in that, constitute load-lock chambers and degas chamber and the configuration of base plate bonding chamber linearity, simultaneously, between each chamber, the family of power and influence is set, the accommodating mechanism of storage multi-disc infrabasal plate is set in above-mentioned degas chamber, be provided for being transported into the upside substrate and remaining on upper table in above-mentioned bonding chamber by the bonding robot that is transported into, simultaneously, receive the goods after bonding and the family of power and influence who transports from lower table, the downside substrate of the liquid crystal that drips is transported into above-mentioned load-lock chambers, be transported into above-mentioned degas chamber by forwarder, be accommodated in the accommodating mechanism that is arranged at above-mentioned degas chamber successively, according to the order that is transported into, above-mentioned infrabasal plate is handed off to forwarder, transports to above-mentioned bonding chamber.
2. base plate bonding as claimed in claim 1 system is characterized in that,
Constitute from the above-mentioned load-lock chambers of the configuration of linearity roughly begin with respect to above-mentioned bonding chamber be provided with abreast the substrate that transports processing and bonding after the mobile route of linearity of goods, setting has the robot that transports of mechanical arm, describedly transport robot keeps and transport processing on mobile route substrate and goods, configuration constitutes the turnover room that is transported into and transports the substrate of processing in side's side end setting of mobile route, and the storeroom of the goods that interim keeping finishes is set in the opposing party's end.
3. base plate bonding as claimed in claim 1 system is characterized in that,
Has the contraposition mechanism that the infrabasal plate that transports is carried out contraposition on above-mentioned forwarder at above-mentioned degas chamber, after by the contraposition of above-mentioned contraposition mechanism, above-mentioned accommodating mechanism is risen, infrabasal plate is received frame substrate, accommodating mechanism is risen, be positioned between frame substrate until above-mentioned forwarder.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-312182 | 2007-12-03 | ||
| JP2007312182 | 2007-12-03 | ||
| JP2007312182A JP5104257B2 (en) | 2007-12-03 | 2007-12-03 | Substrate bonding system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101576688A true CN101576688A (en) | 2009-11-11 |
| CN101576688B CN101576688B (en) | 2011-03-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810179742XA Expired - Fee Related CN101576688B (en) | 2007-12-03 | 2008-12-03 | Substrate assembling system |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5104257B2 (en) |
| KR (1) | KR101052846B1 (en) |
| CN (1) | CN101576688B (en) |
| TW (1) | TW200947076A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103698916A (en) * | 2013-12-23 | 2014-04-02 | 苏州博众精工科技有限公司 | Pipeline type LCD (Liquid Crystal Display) mounting equipment |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI416207B (en) * | 2010-01-07 | 2013-11-21 | Discovery High Technology Co Ltd | A method for attaching substrates |
| KR101247900B1 (en) * | 2010-02-23 | 2013-03-26 | 가부시키가이샤 히타치플랜트테크놀로지 | Liquid crystal substrate bonding system |
| JP6619762B2 (en) * | 2017-03-27 | 2019-12-11 | 平田機工株式会社 | Manufacturing system and manufacturing method |
| CN111725118A (en) * | 2020-06-19 | 2020-09-29 | 北京七星华创集成电路装备有限公司 | Turning device |
| CN112731697B (en) * | 2021-01-04 | 2022-09-27 | 河北光兴半导体技术有限公司 | Processing system and processing method of liquid crystal display panel |
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| JPH07183354A (en) * | 1993-12-24 | 1995-07-21 | Tokyo Electron Ltd | Transport system of substrate and method for transporting substrate |
| JP3535044B2 (en) * | 1999-06-18 | 2004-06-07 | 株式会社 日立インダストリイズ | Substrate assembling apparatus and method, and liquid crystal panel manufacturing method |
| US6298685B1 (en) * | 1999-11-03 | 2001-10-09 | Applied Materials, Inc. | Consecutive deposition system |
| JP3596492B2 (en) * | 2001-08-08 | 2004-12-02 | 松下電器産業株式会社 | Bonding method |
| JP2003110001A (en) | 2001-10-01 | 2003-04-11 | Shinko Electric Co Ltd | Loading and unloading device |
| US7027122B2 (en) * | 2002-03-12 | 2006-04-11 | Lg.Philips Lcd Co., Ltd. | Bonding apparatus having compensating system for liquid crystal display device and method for manufacturing the same |
| JP2006154166A (en) * | 2004-11-29 | 2006-06-15 | Seiko Epson Corp | Lamination device and method for electrooptical device |
| JP4165554B2 (en) * | 2005-10-26 | 2008-10-15 | 株式会社日立プラントテクノロジー | Board bonding equipment |
| JP4760457B2 (en) * | 2006-03-13 | 2011-08-31 | 株式会社日立プラントテクノロジー | Substrate bonding equipment |
-
2007
- 2007-12-03 JP JP2007312182A patent/JP5104257B2/en not_active Expired - Fee Related
-
2008
- 2008-11-26 KR KR1020080118022A patent/KR101052846B1/en not_active IP Right Cessation
- 2008-11-27 TW TW097145963A patent/TW200947076A/en not_active IP Right Cessation
- 2008-12-03 CN CN200810179742XA patent/CN101576688B/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103698916A (en) * | 2013-12-23 | 2014-04-02 | 苏州博众精工科技有限公司 | Pipeline type LCD (Liquid Crystal Display) mounting equipment |
| CN103698916B (en) * | 2013-12-23 | 2016-05-25 | 苏州博众精工科技有限公司 | A kind of pipeline system LCD mounting equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5104257B2 (en) | 2012-12-19 |
| TW200947076A (en) | 2009-11-16 |
| JP2009139392A (en) | 2009-06-25 |
| TWI379132B (en) | 2012-12-11 |
| KR101052846B1 (en) | 2011-08-01 |
| KR20090057901A (en) | 2009-06-08 |
| CN101576688B (en) | 2011-03-30 |
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