JP2009139392A - Liquid crystal panel assembly system - Google Patents

Liquid crystal panel assembly system Download PDF

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JP2009139392A
JP2009139392A JP2007312182A JP2007312182A JP2009139392A JP 2009139392 A JP2009139392 A JP 2009139392A JP 2007312182 A JP2007312182 A JP 2007312182A JP 2007312182 A JP2007312182 A JP 2007312182A JP 2009139392 A JP2009139392 A JP 2009139392A
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substrate
chamber
bonding
conveyor
load lock
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JP5104257B2 (en
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Takuya Kaizu
拓哉 海津
Hiroaki Takeda
紘明 武田
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Hitachi Plant Technologies Ltd
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Hitachi Plant Technologies Ltd
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Priority to TW097145963A priority patent/TW200947076A/en
Priority to CN200810179742XA priority patent/CN101576688B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Liquid Crystal (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple alignment system of a layout configuration. <P>SOLUTION: A panel alignment system has constitution in which a load-lock chamber, a deaerating chamber and a panel alignment chamber are arranged linearly, gate valves are provided between the respective chambers, a storing mechanism accumulating a plurality of sheets of lower substrates is provided in the deaerating chamber, upper substrates to be aligned are carried in to the panel alignment chamber by a carrying-in robot and held on an upper table, the panel alignment chamber is provided with a gate valve for receiving the products after being subjected to the alignment from a lower table and taking out the products, the lower substrates with liquid crystal dropped thereon are carried in to the load-lock chamber, and carried in to the deaerating chamber by a conveyor. The lower substrates are then conveyed in order of being carried in to the deaerating chamber into the panel alignment chamber by the conveyor. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は基板貼り合せシステム係り、特に、貼り合せ完了までの時間短縮を図ると共に、貼り合せ基板をコンベア搬送できる基板貼り合せシステムに関する。   The present invention relates to a substrate bonding system, and more particularly to a substrate bonding system capable of reducing the time until completion of bonding and conveying the bonded substrates on a conveyor.

液晶表示パネルの製造には、透明電極や薄膜トランジスタアレイを設けた２枚のガラス基板を数μｍ程度の極めて接近した間隔をもって基板の周縁部に設けた接着剤（以下、シール剤ともいう）で貼り合せ（以後、貼り合せ後の基板をセルと呼ぶ）、それによって形成される空間に液晶を封止する工程がある。   In manufacturing a liquid crystal display panel, two glass substrates provided with a transparent electrode and a thin film transistor array are attached with an adhesive (hereinafter also referred to as a sealing agent) provided on the peripheral edge of the substrate with a very close distance of about several μm. There is a process of bonding (hereinafter, the substrate after bonding is referred to as a cell) and sealing the liquid crystal in the space formed thereby.

この液晶の封止には、注入口を設けないようにシール剤をクローズしたパターンに描画した一方の基板上に液晶を滴下しておいて、真空チャンバ内において他方の基板を一方の基板上に配置し、上下の基板を接近させて貼り合せる方法などがある。この真空チャンバ内に基板を搬入・搬出するために予備室を設け、真空チャンバ内を予備室と同じ雰囲気にして基板の出し入れを行うことが特許文献１に開示されている。   To seal the liquid crystal, liquid crystal is dropped on one substrate drawn in a pattern in which a sealing agent is closed so as not to provide an injection port, and the other substrate is placed on one substrate in a vacuum chamber. There is a method of arranging and bonding the upper and lower substrates close to each other. Patent Document 1 discloses that a preliminary chamber is provided for loading / unloading a substrate into / from the vacuum chamber, and the substrate is loaded / removed in the same atmosphere as the preliminary chamber.

また、予備室から材料の搬入搬出をスムーズに行うために、予備室内で基板の受け渡しを行うために、搬送室も真空状体にして処理室からロードロック室に基板を搬送する構成の真空処理装置が特許文献２に開示されている。   In addition, in order to smoothly carry in and out the material from the spare chamber, the vacuum chamber is configured so that the substrate is transferred from the processing chamber to the load lock chamber in order to transfer the substrate in the spare chamber. An apparatus is disclosed in US Pat.

特開２００１−３０５５６３号公報JP 2001-305563 A 特開平０６−００５６８７号公報Japanese Patent Laid-Open No. 06-005687

上記特許文献１では、基板の出し入れの際に予備室と真空チャンバ内を同じ雰囲気にするために、一方側の予備室内に貼り合せる２枚の基板を搬入して、２枚の基板の貼り合せが終了すると他方に設けた予備室から排出する構成となっているために、装置の配置が長くなる大きな設置面積を必要としている。又、それぞれの予備室、及び貼り合せ室を真空状態する必要があるために、そのための装置を配置する必要があり、真空状態するまでに時間がかかりタクトタイムを短くするには限界がある。   In the above-mentioned Patent Document 1, in order to make the preliminary chamber and the vacuum chamber have the same atmosphere when the substrates are taken in and out, the two substrates to be bonded are brought into one of the preliminary chambers, and the two substrates are bonded together. When the process is completed, the apparatus is discharged from the spare chamber provided on the other side, so that a large installation area is required to increase the arrangement of the apparatus. Further, since it is necessary to evacuate each of the preliminary chambers and the bonding chamber, it is necessary to arrange an apparatus for that purpose, and it takes time until the evacuation takes place, and there is a limit to shortening the tact time.

また、引用文献２のように、中央に搬送ロボット（ロボットハンド）を配置しその周囲にロードロック室及び複数の処理室を配置して、基板の処理を行う配置構成も提案されているが、この構成では、貼り合せ基板の大型化に伴い処理室も大きくなり、大面積が必要となる。又搬送用ロボットも真空状態で稼動できる特殊な構成のものを必要になる。   In addition, as in Cited Document 2, an arrangement configuration in which a transfer robot (robot hand) is arranged in the center and a load lock chamber and a plurality of processing chambers are arranged around it to perform substrate processing has been proposed. In this configuration, the processing chamber becomes larger with an increase in size of the bonded substrate, and a large area is required. Also, a special robot that can operate in a vacuum state is required for the transfer robot.

上記目的を達成するため、本発明では、ロードロック室と脱気室及び基板貼り合せ室を直線状に配置すると共に、各室間にゲートバルブを設け、脱気室内には複数枚の下基板を蓄積する収納機構を設け、貼り合せ室には、貼り合せる上側基板の搬入と、貼り合せ後の製品を搬出するゲートバルブを設け、ロードロック室から貼り合せる下側基板を搬入し、脱気室に搬入された順に下基板をコンベア搬送で貼り合せ室に搬送する構成とした。   In order to achieve the above object, in the present invention, the load lock chamber, the deaeration chamber, and the substrate bonding chamber are linearly arranged, and a gate valve is provided between the chambers, and a plurality of lower substrates are provided in the deaeration chamber. A storage mechanism is provided, and the bonding chamber is provided with a gate valve for carrying the upper substrate to be bonded and a product for unloading the bonded product, and the lower substrate to be bonded is loaded from the load lock chamber and deaerated. It was set as the structure which conveys a lower board | substrate to a bonding chamber by conveyor conveyance in the order carried in to the chamber.

また、略直線状に配置されたロードロック室から貼り合せ室に平行に、処理する基板及び貼り合せ後の製品を搬送する直線状の移動経路を設けて、移動系路上を処理する基板及び製品を保持して搬送するロボットハンドを設けた構成とし、移動経路の一方側端部に処理する基板を搬入及び搬出する基板の回転室を、他方の端部に出来上がった製品を一時保管する保管室を設けた配置構成とした。   In addition, a substrate and a product for processing on the moving system path are provided in parallel with the bonding chamber from the load lock chamber arranged in a substantially straight line, and a linear movement path for conveying the substrate to be processed and the product after bonding is provided. A holding room for holding and transporting a substrate, a rotating chamber for loading and unloading a substrate to be processed at one end of the moving path, and a storage chamber for temporarily storing the finished product at the other end The arrangement configuration was provided.

本発明の基板貼合装置によれば、ロードロック室、脱気室、貼り合せ室を直線配置にして、各室の基板搬送をコンベア搬送するように構成する共に、脱気室に液晶を滴下した基板を複数枚収納する収納機構を設けてコンベアから収納機構に順次保管できるようにしたことで、特殊な真空ロボットを使用せずに済み、メンテナンスが簡単になった。   According to the substrate bonding apparatus of the present invention, the load lock chamber, the deaeration chamber, and the bonding chamber are arranged in a straight line so that the substrate conveyance in each chamber is conveyed by the conveyor, and the liquid crystal is dropped into the deaeration chamber. By providing a storage mechanism for storing a plurality of substrates, which can be stored sequentially from the conveyor to the storage mechanism, a special vacuum robot is not required and maintenance is simplified.

以下、本発明の基板貼合装置の一実施例を図に基づいて説明する。
図１には本発明の基板貼り合せ装置の全体配置の平面図を示す。図１に示すように前工程で処理をされた基板を一時保管する回転室２と、回転室から直線状に配置された搬送ロボット４を移動するための搬送路３が設けられている。この搬送路３に沿って下基板を搬入するためのロードロック室５を中心として左右に脱気室６、貼り合せ室７がそれぞれゲートバルブＧ２〜Ｇ５を介して設けられ、それぞれの部屋が減圧できるようにチャンバ構成となっている。また、ロードロック室と貼り合せ室７には搬送路３に対向する方向にもゲートバルブＧ１，Ｇ５，Ｇ６が設けてある。さらに、ロードロック室、脱気室６、貼り合せ室７には、下基板を搬送するためのコンベア５Ｃ，６Ｃ，７Ｃがそれぞれ設けてある。このコンベアには、本実施例ではローラコンベアを用いているが、ベルトコンベアを用いる構成としても良い。搬送路３の回転室とは反対側の端部には貼り合せの終了したパネル９を一時保管するパネル保管室８が設けてある。保管室８に保管するときパネルはカセット（収納棚）に収納されて保管される。所定の枚数のパネルがカセットに収納されると、カセットごと次の工程に搬送される。 Hereinafter, one Example of the board | substrate bonding apparatus of this invention is described based on figures.
FIG. 1 shows a plan view of the overall arrangement of the substrate bonding apparatus of the present invention. As shown in FIG. 1, a rotating chamber 2 for temporarily storing a substrate processed in the previous process and a transfer path 3 for moving a transfer robot 4 arranged in a straight line from the rotating chamber are provided. A deaeration chamber 6 and a bonding chamber 7 are provided on the left and right of the load lock chamber 5 for carrying the lower substrate along the transfer path 3 through gate valves G2 to G5, respectively. It has a chamber configuration so that it can be used. The load lock chamber and the bonding chamber 7 are also provided with gate valves G1, G5, and G6 in the direction facing the transfer path 3. Further, the load lock chamber, the deaeration chamber 6 and the bonding chamber 7 are respectively provided with conveyors 5C, 6C and 7C for transferring the lower substrate. In this embodiment, a roller conveyor is used as the conveyor, but a belt conveyor may be used. A panel storage chamber 8 for temporarily storing the bonded panel 9 is provided at the end of the transfer path 3 opposite to the rotating chamber. When storing in the storage chamber 8, the panel is stored in a cassette (storage shelf). When a predetermined number of panels are stored in the cassette, the entire cassette is transported to the next step.

回転室２には、一方にカラーフィルタを形成したカラーフィルタ基板（以後ＣＦ基板又は上基板と称する）１ａと、ＴＦＴが形成され貼り合せのためのシール剤が環状に塗布され、シール剤で囲まれた領域内に液晶剤が最適量滴下された基板（以後ＴＦＴ基板又は下基板と称する）１ｂが回転室２に搬入される。このとき、ＣＦ基板１ａは貼り合せ面が上向きで、ＴＦＴ基板１ｂは液晶を滴下した面（貼り合せ面）が上向きとなるよう搬入されている。そのため、ＣＦ基１ａ板は貼り合せ面が下向きとなるように回転させて保管する。   A color filter substrate (hereinafter referred to as a CF substrate or an upper substrate) 1a having a color filter formed on one side and a TFT is formed on the rotating chamber 2 and a sealing agent for bonding is applied in an annular shape and surrounded by the sealing agent. A substrate (hereinafter referred to as a TFT substrate or a lower substrate) 1 b on which an optimal amount of liquid crystal agent has been dropped in the region is carried into the rotating chamber 2. At this time, the CF substrate 1a is carried in such that the bonding surface faces upward, and the TFT substrate 1b faces the surface on which the liquid crystal is dropped (bonding surface) facing upward. Therefore, the CF base 1a plate is rotated and stored so that the bonding surface faces downward.

図２にロードロック室の断面図を示す。回転室２に搬入された基板のうちＴＦＴ基板１ｂは、搬送ロボット４のハンド部に保持されてロードロック室５に搬送される。ロードロック室５には脱気室６にＴＦＴ基板１ｂを搬送するためのコンベア５Ｃが設けてある。また、搬送ロボット４のハンドからＴＦＴ基板１ｂを受け取り、コンベア５Ｃ上に受け渡すための受け取りピン１１が設けてある。この受け取りピン１１は、通常はコンベア５Ｃの下部に収納されていて、ＴＦＴ基板１ｂを受け取るとき駆動装置５Ｍを動作させて受け取りピン１１を上昇させて搬送ロボット４のハンドからＴＦＴ基板１ｂを受け取る。ＴＦＴ基板１ｂを受け取りピン１１に受け渡すと搬送ロボットのハンドはゲートバルブＧ１の外に退避し、同時に受け取ピン爪１１をコンベア５Ｃの下部に収納することで、コンベア５Ｃ上にＴＦＴ基板１ｂを受け渡す構成となっている。コンベア５Ｃ上にＴＦＴ基板１ｂを受け取ると、ゲートバルブＧ１を閉じてバルブ５Ｂ１を開放し、既に駆動している真空ポンプ５Ｐ１によりロードロック室５内を減圧する。このとき、バルブ５Ｂ１〜５Ｂ３を開放してある。そして所定の減圧力になった時点でバルブ５Ｂ１を閉じ、バルブ５Ｂ２，５Ｂ３を開放して、既に駆動している真空ポンプ５Ｐ２によりさらに減圧する。所定の減圧状態になるとゲートバルブＧ２を開き、コンベア５Ｃが駆動され脱気室６にＴＦＴ基板１ｂが搬送される。   FIG. 2 shows a cross-sectional view of the load lock chamber. Of the substrates carried into the rotation chamber 2, the TFT substrate 1 b is held by the hand portion of the transfer robot 4 and transferred to the load lock chamber 5. The load lock chamber 5 is provided with a conveyor 5 </ b> C for transporting the TFT substrate 1 b to the deaeration chamber 6. A receiving pin 11 is provided for receiving the TFT substrate 1b from the hand of the transfer robot 4 and transferring it to the conveyor 5C. The receiving pin 11 is normally stored under the conveyor 5C, and when receiving the TFT substrate 1b, the driving device 5M is operated to raise the receiving pin 11 and receive the TFT substrate 1b from the hand of the transfer robot 4. When the TFT substrate 1b is transferred to the receiving pin 11, the hand of the transfer robot retreats out of the gate valve G1, and at the same time, the receiving pin claw 11 is stored in the lower part of the conveyor 5C, thereby receiving the TFT substrate 1b on the conveyor 5C. It is configured to pass. When the TFT substrate 1b is received on the conveyor 5C, the gate valve G1 is closed and the valve 5B1 is opened, and the load lock chamber 5 is depressurized by the already driven vacuum pump 5P1. At this time, the valves 5B1 to 5B3 are opened. When the predetermined pressure reduction is reached, the valve 5B1 is closed, the valves 5B2 and 5B3 are opened, and the pressure is further reduced by the already driven vacuum pump 5P2. When the pressure is reduced, the gate valve G2 is opened, the conveyor 5C is driven, and the TFT substrate 1b is transferred to the deaeration chamber 6.

図３に脱気室６の断面図を示す。脱気室６には、複数枚のＴＦＴ基板１ｂが間隔を開けて収納できるように多段(本実施例では最大５枚)に基板保持部（基板受け）３０ａを備えた収納機構３０が設けてある。なお脱気室６内は、装置稼働中は常に所定の減圧状態(真空状態)に保持されている。   FIG. 3 shows a sectional view of the deaeration chamber 6. The deaeration chamber 6 is provided with a storage mechanism 30 provided with substrate holding portions (substrate receivers) 30a in multiple stages (maximum of five in this embodiment) so that a plurality of TFT substrates 1b can be stored at intervals. is there. The inside of the deaeration chamber 6 is always kept in a predetermined reduced pressure state (vacuum state) while the apparatus is in operation.

収納機構３０は複数段の基板保持部３０ａとモータからなる駆動手段３０Ｍを備えている。この収納機構の詳細を図4に示す。図４の（ａ）にコンベア部を上方から見た図を、（ｂ）にＡ−Ａ断面図を示す。図４ａに示すように収納機構３０の基板保持部３０ａがコンベア６Ｃの間に位置し、収納機構３０を上昇させることでＴＦＴ基板を基板保持部３０ａで保持できるように構成してある。即ち、基板保持部３０ａはコンベア６Ｃと略同じだけ内側に突出して設けられており、基板をコンベアから確実に受け渡されるように構成されている。
コンベア６Ｃ上をＴＦＴ基板１ｂが搬送されて来ると、まずＴＦＴ基板１ｂの水辺方向の位置を基板保持部３０ａに載るように位置合せ機構により位置合せを行う。この位置合せ機構は、図３に示すようにＴＦＴ基板１ｂの進行方向の位置を合せるためのシリンダ１３Ｄにより上下に駆動される基板ストッパ１３と、シリンダとモータからなる駆動手段１４Ｄを備え、シリンダで上下に移動され、モータにより回転される回転カム１４と、同じくシリンダとモータからなる駆動手段１５Ｄを備え、左右方向の位置を合せるための回転カム１５とから構成されている。位置合せが終了すると収納機構３０を上昇させて、基板保持部３０ａにＴＦＴ基板１ｂを受け取る。基板保持部３０ａにＴＦＴ基板１ｂを受け取ると、コンベア６Ｃを左右に退避させ駆動手段３０Ｍを動作させ収納機構３０を上昇させて収納したＴＦＴ基板の位置がコンベア６Ｃより上方に、収納機構３０を構成する次の段の基板保持部３０ａがコンベア６Ｃに接触しない下方位置に位置するようにする。その後コンベア６Ｃを通常の搬送位置に戻す。このように、順次、収納機構３０にＴＦＴ基板を集積できるようにしてある。 The storage mechanism 30 includes a plurality of stages of substrate holders 30a and driving means 30M including a motor. The details of this storage mechanism are shown in FIG. The figure which looked at the conveyor part from the upper direction to Fig.4 (a), and AA sectional drawing are shown to (b). As shown in FIG. 4a, the substrate holding portion 30a of the storage mechanism 30 is positioned between the conveyors 6C, and the TFT substrate can be held by the substrate holding portion 30a by raising the storage mechanism 30. That is, the substrate holding part 30a is provided so as to protrude inward substantially as much as the conveyor 6C, and is configured to reliably transfer the substrate from the conveyor.
When the TFT substrate 1b is conveyed on the conveyor 6C, first, alignment is performed by an alignment mechanism so that the position of the TFT substrate 1b in the waterside direction is placed on the substrate holding portion 30a. As shown in FIG. 3, this alignment mechanism includes a substrate stopper 13 driven up and down by a cylinder 13D for aligning the position of the TFT substrate 1b in the advancing direction, and driving means 14D composed of a cylinder and a motor. The rotary cam 14 is moved up and down and rotated by a motor, and the rotary cam 15 is provided with driving means 15D, which is also composed of a cylinder and a motor, and adjusts the position in the left-right direction. When the alignment is completed, the storage mechanism 30 is raised and the TFT substrate 1b is received by the substrate holding portion 30a. When the TFT substrate 1b is received by the substrate holding part 30a, the conveyor 6C is retracted left and right, the driving means 30M is operated to raise the storage mechanism 30, and the position of the TFT substrate stored is configured above the conveyor 6C. The next stage substrate holder 30a is positioned at a lower position where it does not contact the conveyor 6C. Thereafter, the conveyor 6C is returned to the normal transport position. In this way, the TFT substrate can be integrated in the storage mechanism 30 sequentially.

以上の構成はコンベアを外側に退避させて基板を受け取る方式であるが、収納機構３０をコンベア６Ｃの外側に複数の柱部（４箇所以上）を設け、柱部より基板保持部３０ａをコンベア６Ｃ側に延伸させて基板を受け取り保持するように構成してもよい。しかし、この場合基板保持部３０ａを長く形成することが必要になり、基板を保持したときにたわみの発生しないように、基板保持部を形成する材料等を適性に選定する必要がある。   The above configuration is a method of receiving the substrate by retracting the conveyor to the outside, but the storage mechanism 30 is provided with a plurality of column parts (four or more) outside the conveyor 6C, and the substrate holding unit 30a is connected to the conveyor 6C from the column part. You may comprise so that it may be extended to the side and a board | substrate may be received and hold | maintained. However, in this case, it is necessary to form the substrate holding portion 30a long, and it is necessary to appropriately select a material or the like for forming the substrate holding portion so as not to bend when the substrate is held.

この収納機構３０に複数枚のＴＦＴ基板を収納後、ゲートバルブＧ２、Ｇ３を閉じて所定時間待機させることで、ＴＦＴ基板上に予め滴下されている液晶剤等に含まれる気泡を取り除く。   After storing a plurality of TFT substrates in the storage mechanism 30, the gate valves G2 and G3 are closed and kept waiting for a predetermined time, thereby removing bubbles contained in the liquid crystal agent or the like dropped in advance on the TFT substrate.

図５に基板貼り合せ装置の断面図を示す。   FIG. 5 shows a cross-sectional view of the substrate bonding apparatus.

予め、ゲートバルブＧ６を開放してＣＦ基板(上基板)１ａを搬送ロボット４のハンドに貼り合せ面を下向きにして貼り合せ室７に搬入する。搬入されたＣＦ基板１ａは上テーブルに設けた吸着孔に負圧を供給するためバルブ７Ｂ１を開放し、予め駆動している真空ポンプ７ＴＰにより、上テーブル７ＵＴに吸引吸着により貼り合せ面を下にして保持される。なお、本図には図示していないが、上テーブル７ＵＴ側に上下移動可能な吸引孔付きの吸着パッドを設けてある場合は、吸着パッドをＣＦ基板面まで降下させて、吸着パッドでＣＦ基板を保持した後、上テーブル７ＵＴ面まで持ち上げることで、吸着保持することが可能である。また、上テーブル７ＵＴには真空状態でＣＦ基板１ａを保持できるように静電吸着手段か又は粘着保持手段を設けてある。吸引吸着で上テーブル７ＵＴにＣＦ基板１ａを保持した後、静電吸着手段を動作させるか、吸引吸着手段でテーブル面まで吸着することで粘着保持手段が働き貼り合せ室内が真空状態になっても基板を保持できるものである。   In advance, the gate valve G6 is opened, and the CF substrate (upper substrate) 1a is carried into the bonding chamber 7 with the bonding surface facing downward on the hand of the transfer robot 4. The loaded CF substrate 1a opens the valve 7B1 in order to supply negative pressure to the suction hole provided in the upper table, and the upper surface 7UT is sucked and sucked by the vacuum pump 7TP that is driven in advance so that the bonding surface is lowered. Held. Although not shown in the figure, when a suction pad with a suction hole that can move up and down is provided on the upper table 7UT side, the suction pad is lowered to the CF substrate surface, Can be held by suction by lifting up to the surface of the upper table 7UT. The upper table 7UT is provided with an electrostatic chucking means or an adhesive holding means so that the CF substrate 1a can be held in a vacuum state. Even after the CF substrate 1a is held on the upper table 7UT by suction suction, the electrostatic suction means is operated, or the suction holding means works to suck the table surface. A substrate can be held.

ＣＦ基板１ａの保持が完了すると、下テーブル７ＤＴ上に貼り合せの完了したパネル９が存在する場合は、パネル９を搬送ロボットのハンドで保持して、貼り合せ室７の外に搬送する。その後ゲートバルブＧ６を閉じ、バルブ７Ｂ２を開放して、予め先に駆動している真空ポンプ７Ｐ１により貼り合せ室７内を所定の真空状態にする。その後、バルブ７Ｂ２を閉じ、バルブ７Ｂ３，７Ｂ４を開放し、予め先に駆動している７Ｐ２によりさらに減圧する。貼り合せ室７内が所定の真空状態になるとゲートバルブＧ３を開き真空状態の脱気室６からＴＦＴ基板１ｂを１枚、同じ真空状態の貼り合せ室７の下テーブル位置までコンベア７Ｃにて搬送する。貼り合せ室にはコンベア７Ｃ上に載せられて、搬送されてきたＴＦＴ基板１ｂが下テーブル７ＤＴの載置する位置に停止させる。コンベア７Ｃが停止すると下テーブル７ＤＴ又は下テーブル７ＤＴ側に設けてある受け取り爪を上側に移動してコンベア７ＤＴ上からＴＦＴ基板を受け取る。下テーブル７ＤＴにＴＦＴ基板１ｂを受け取ると、ＴＦＴ基板１ｂが移動しないように、静電チャック、又は粘着機構にて保持する。その後、下テーブル７ＤＴを水平方向に移動させることで上テーブル７ＵＴに保持しているＣＦ基板１ａと位置合せを行う。ＴＦＴ基板１ｂとＣＦ基板１ａにはそれぞれ位置合せ用のマークが設けられており、図示していないカメラにてこのマークを観測して、位置ずれ量を求める。位置ずれ量が求まると、下テーブルを貼り合せ室（貼り合せ用の真空チャンバ）の外に配置した位置合せ機構を用いて移動させて位置合せを行う構成としてある。   When the holding of the CF substrate 1a is completed, if the panel 9 that has been bonded is present on the lower table 7DT, the panel 9 is held by the hand of the transfer robot and transferred to the outside of the bonding chamber 7. Thereafter, the gate valve G6 is closed, the valve 7B2 is opened, and the inside of the bonding chamber 7 is brought into a predetermined vacuum state by the previously driven vacuum pump 7P1. Thereafter, the valve 7B2 is closed, the valves 7B3 and 7B4 are opened, and the pressure is further reduced by 7P2 previously driven. When the inside of the bonding chamber 7 is in a predetermined vacuum state, the gate valve G3 is opened and one TFT substrate 1b is transferred from the deaeration chamber 6 in the vacuum state to the lower table position of the bonding chamber 7 in the same vacuum state by the conveyor 7C. To do. In the bonding chamber, the TFT substrate 1b that is placed on the conveyor 7C and transported is stopped at a position where the lower table 7DT is placed. When the conveyor 7C stops, the lower claw 7DT or the receiving claw provided on the lower table 7DT side is moved upward to receive the TFT substrate from the conveyor 7DT. When the TFT substrate 1b is received by the lower table 7DT, it is held by an electrostatic chuck or an adhesive mechanism so that the TFT substrate 1b does not move. Thereafter, the lower table 7DT is moved in the horizontal direction to align with the CF substrate 1a held on the upper table 7UT. An alignment mark is provided on each of the TFT substrate 1b and the CF substrate 1a, and this mark is observed by a camera (not shown) to obtain a positional deviation amount. When the amount of displacement is obtained, the lower table is moved using an alignment mechanism arranged outside the bonding chamber (bonding vacuum chamber) to perform alignment.

以上それぞれの装置の構成とその動作を説明したが、次に全体動作を説明する。   The configuration and operation of each device have been described above. Next, the overall operation will be described.

次に、本システムの全体動作を説明する。ここでは、ＣＦ基板を上基板１ａ、ＴＦＴ基板を下基板１ｂと称して説明する。   Next, the overall operation of this system will be described. Here, the CF substrate is referred to as the upper substrate 1a, and the TFT substrate is referred to as the lower substrate 1b.

まず回転室２に搬入されて、回転の必要な上基板１ａを反転し保管する。また回転の不要な下基板１ｂはそのままの状態を保持して保管する。次に、搬送ロボット４を動作させ、下基板１ｂを１枚保持してロードロック室５に移動する。ロードロック室５の入り口側のゲートバルブＧ１を開き、下基板１ｂの１枚をロードロック室５のコンベア５Ｃに受け渡す(受け渡しの詳細は先に説明しているのでここでの説明は省略する)。コンベア５Ｃに下基板１ｂの受け渡しが完了するとゲートバルブＧ１を閉じる。なお、この時ロードロック室５の他のゲートバルブＧ２，Ｇ４は閉じられたままである。次に、ロードロック室５内を所定の減圧状態まで減圧する。減圧が終了すると、ゲートバルブＧ２を開き脱気室６側に下基板１ｂが移動するようにコンベア５Ｃ及び６Ｃを駆動する。下基板１ｂが脱気室６に移動すると収納機構３０を動作させて、コンベア６Ｃ上を搬送されてきた下基板１ｂを収納機構３０の基板保持部３０ａに載せて保管する。   First, it is carried into the rotation chamber 2, and the upper substrate 1a that needs to be rotated is reversed and stored. The lower substrate 1b that does not need to be rotated is stored as it is. Next, the transfer robot 4 is operated to hold one sheet of the lower substrate 1 b and move to the load lock chamber 5. The gate valve G1 on the entrance side of the load lock chamber 5 is opened, and one of the lower substrates 1b is transferred to the conveyor 5C of the load lock chamber 5 (the details of the transfer have been described earlier, so the description here is omitted). ). When the delivery of the lower substrate 1b to the conveyor 5C is completed, the gate valve G1 is closed. At this time, the other gate valves G2 and G4 of the load lock chamber 5 remain closed. Next, the inside of the load lock chamber 5 is depressurized to a predetermined depressurized state. When the decompression is finished, the gate valve G2 is opened and the conveyors 5C and 6C are driven so that the lower substrate 1b moves to the deaeration chamber 6 side. When the lower substrate 1b moves to the deaeration chamber 6, the storage mechanism 30 is operated, and the lower substrate 1b conveyed on the conveyor 6C is placed on the substrate holding portion 30a of the storage mechanism 30 and stored.

脱気室６に下基板１ａが搬入されるとゲートバルブＧ２を閉じる。ゲートバルブＧ２が閉じられるとロードロック室５を大気圧に戻した後、ゲートバルブＧ１を開放する。搬送ロボット４は回転室に戻り、先ほどと同じくＴＦＴ基板（下基板１）を１枚保持し、ロードロック室５の前に移動し、下基板をロードロック室５のコンベア５Ｃ上に受け渡す。コンベア５Ｃ上に下基板１ｂの受け渡しが完了すると、搬送ロボット４のハンドをゲートバルブＧ１の外に退避させる。ハンド退避後、搬送ロボット４は回転室２に戻り先ほどと同じく１枚のＴＦＴ基板１ｂを保持し、ロードロック室５の前に移動する。   When the lower substrate 1a is carried into the deaeration chamber 6, the gate valve G2 is closed. When the gate valve G2 is closed, the load lock chamber 5 is returned to atmospheric pressure, and then the gate valve G1 is opened. The transfer robot 4 returns to the rotation chamber, holds one TFT substrate (lower substrate 1) as before, moves to the front of the load lock chamber 5, and transfers the lower substrate onto the conveyor 5C of the load lock chamber 5. When the delivery of the lower substrate 1b is completed on the conveyor 5C, the hand of the transfer robot 4 is retracted outside the gate valve G1. After the hand is retracted, the transfer robot 4 returns to the rotation chamber 2, holds the same TFT substrate 1 b as before, and moves to the front of the load lock chamber 5.

次に、ゲートバルブＧ１を閉じて、ロードロック室５内を減圧する。所定の減圧状態になると、先ほどと同じくゲートバルブＧ２を開き脱気室６の収納機構３０の空いている棚に下基板１ｂを収納する。脱気室６に下基板１ｂが完全に搬入されると、ゲートバルブＧ２を閉じる。同じようにロードロック室５から脱気室６に下基板１ｂを順次搬入し収納機構３０に４枚目の下基板が蓄積されるときに、搬送ロボットは回転室から上基板１ａと下基板１ｂを取り出す。そして、ロードロック室５に前に両基板を保持した状態で待機する。   Next, the gate valve G1 is closed, and the inside of the load lock chamber 5 is decompressed. When a predetermined reduced pressure state is reached, the gate valve G2 is opened as before, and the lower substrate 1b is stored in an empty shelf of the storage mechanism 30 of the deaeration chamber 6. When the lower substrate 1b is completely carried into the deaeration chamber 6, the gate valve G2 is closed. Similarly, when the lower substrate 1b is sequentially carried from the load lock chamber 5 to the deaeration chamber 6 and the fourth lower substrate is accumulated in the storage mechanism 30, the transfer robot takes out the upper substrate 1a and the lower substrate 1b from the rotation chamber. . And it waits in the state which hold | maintained both the board | substrates before in the load lock chamber 5. FIG.

４枚目の下基板１ｂが脱気室６に搬入されるとゲートバルブＧ２が閉じられ、ロードロック室５の基板搬入用のゲートバルブＧ１が開かれ、下基板１ｂがコンベア５Ｃに受け渡される。下基板１ｂの受け渡しが完了するとハンドがロードロック室５の外に退避され、搬送ロボットが貼り合せ室７側に移動する。   When the fourth lower substrate 1b is carried into the deaeration chamber 6, the gate valve G2 is closed, the substrate loading gate valve G1 in the load lock chamber 5 is opened, and the lower substrate 1b is delivered to the conveyor 5C. When the delivery of the lower substrate 1b is completed, the hand is retracted out of the load lock chamber 5, and the transfer robot moves to the bonding chamber 7 side.

このとき、同時に５枚目の下基板１ｂが収納機構３０に保持され、その信号が貼り合せ室７側の制御手段に伝達される。貼り合せ室７の搬入側ゲートバルブＧ６が開放され、搬送ロボット４のハンドに保持された上基板１ａが貼り合せ室７内に設けてある上テーブル７ＵＴに吸引吸着される（上テーブル７ＵＴへの保持手順は先に述べているのでここでの説明は省略する）。   At this time, the fifth lower substrate 1b is simultaneously held in the storage mechanism 30, and the signal is transmitted to the control means on the bonding chamber 7 side. The loading side gate valve G6 of the bonding chamber 7 is opened, and the upper substrate 1a held by the hand of the transfer robot 4 is sucked and adsorbed to the upper table 7UT provided in the bonding chamber 7 (to the upper table 7UT). Since the holding procedure has been described above, description thereof is omitted here).

上基板が上テーブル７ＵＴへ受け渡されると、搬送ロボットのハンドを貼り合せ室７の外に退避させ、ゲートバルブＧ６を閉じる。次に、貼り合せ室７内の減圧を開始する。室内が所定の減圧圧力になりかつ脱気室６に５枚目の下基板が搬入されてから所定時間経過したことを確認すると、貼り合せ室７の制御手段から脱気室６の制御手段にゲートバルブ３の開放指示を指令する。脱気室６の制御手段はゲートバルブＧ３を開放すると共に下基板１枚（最初に収納機構に収納した下基板）を収納機構３０からコンベア６Ｃに載せコンベア６Ｃを駆動して貼り合せ室７に下基板１ｂを搬出する。同時に貼り合せ室７のコンベア７Ｃを駆動して下基板１ｂをコンベア６Ｃから受け取り、下基板が下テーブル７ＤＴの載置位置に来るとコンベア７Ｃを停止させ、下テーブル７ＤＴ上に載置して動かないように保持する。下基板１ｂの保持も上基板１ａと同様に静電吸着手段、又は粘着手段等を用いて保持する。   When the upper substrate is delivered to the upper table 7UT, the hand of the transfer robot is retracted out of the bonding chamber 7, and the gate valve G6 is closed. Next, pressure reduction in the bonding chamber 7 is started. When it is confirmed that a predetermined time has elapsed after the chamber is at a predetermined reduced pressure and the fifth lower substrate is carried into the deaeration chamber 6, the gate valve is connected from the control means of the bonding chamber 7 to the control means of the deaeration chamber 6. 3 open instruction is commanded. The control means of the deaeration chamber 6 opens the gate valve G3 and places one lower substrate (the lower substrate first stored in the storage mechanism) on the conveyor 6C from the storage mechanism 30 and drives the conveyor 6C to the bonding chamber 7. The lower substrate 1b is carried out. At the same time, the conveyor 7C of the laminating chamber 7 is driven to receive the lower substrate 1b from the conveyor 6C. When the lower substrate comes to the placement position of the lower table 7DT, the conveyor 7C is stopped and placed on the lower table 7DT to move. Hold to not. Similarly to the upper substrate 1a, the lower substrate 1b is also held using an electrostatic chucking means or an adhesive means.

下基板１ｂを下テーブルに保持すると、ゲートバルブＧ３，Ｇ６閉じると共に、上基板と下基板の位置合せを行う。位置合せには、図示していないカメラを用いて、各基板に設けてある位置合せマークを観測して、位置ずれ量を求め、下テーブルを貼り合せ室の外側に駆動源を備えた横押し機構を用いて水平方向に移動して位置合せを行う。   When the lower substrate 1b is held on the lower table, the gate valves G3 and G6 are closed and the upper substrate and the lower substrate are aligned. For alignment, use a camera (not shown) to observe alignment marks provided on each substrate to determine the amount of displacement, and press the lower table laterally with a drive source outside the bonding chamber. The position is adjusted by moving in the horizontal direction using the mechanism.

位置合せが終了すると、貼り合せ室内を所定の圧まで減圧する。その後、上テーブルを下テーブル側に降下させて貼り合せを行う。この貼り合せ中には何回か位置合せを行う。   When the alignment is completed, the pressure in the bonding chamber is reduced to a predetermined pressure. Thereafter, the upper table is lowered to the lower table side to perform bonding. The alignment is performed several times during the pasting.

貼り合せが完了すると、ゲートバルブＧ６を開放する。搬送ロボットは、予め回転室より次の上基板１ａを保持してゲートバルブＧ６の前で待機しており、この上基板１ａを上テーブル７ＵＴに受け渡す。上基板１ａの搬入が終了すると、搬送ロボットは貼り合せの完了したパネル９を保持して、保管室８に搬送し収納棚に収納する。   When the bonding is completed, the gate valve G6 is opened. The transfer robot holds the next upper substrate 1a from the rotation chamber in advance and stands by in front of the gate valve G6, and transfers the upper substrate 1a to the upper table 7UT. When the transfer of the upper substrate 1a is completed, the transfer robot holds the panel 9 on which the bonding has been completed, transfers it to the storage chamber 8, and stores it in the storage shelf.

なお本実施例では、図１に示すように、ロードロック室５を挟んで反対側にも脱気室貼り合せ室を設けてあり、片側(図の右側)の貼り合せ室で貼り合せ作業を行っている間に、図の左側の装置に基板の供給を行うことで、タクトタイムを向上することが可能となる。   In this embodiment, as shown in FIG. 1, a deaeration chamber bonding chamber is provided on the opposite side across the load lock chamber 5, and the bonding operation is performed in the bonding chamber on one side (right side in the figure). While the operation is being performed, the tact time can be improved by supplying the substrate to the apparatus on the left side of the figure.

以上のように、基板搬入用のロードロック室、脱気室、貼り合せ室を直線状に配置し、その配置と平行に搬送ロボットを移動できるように配置することで、装置全体のレイアウトが簡単となる。また、下基板をロードロック室から脱気室を経て貼り合せ室に搬送するためにコンベア搬送を用いることで、真空ロボットを使用する必要が無くなり、メンテナンスも簡単に行うことが出来る。   As described above, the load lock chamber, deaeration chamber, and bonding chamber for substrate loading are arranged in a straight line, and the transfer robot can be moved in parallel with the arrangement, thereby simplifying the layout of the entire device. It becomes. In addition, by using the conveyor conveyance for conveying the lower substrate from the load lock chamber to the bonding chamber through the deaeration chamber, it is not necessary to use a vacuum robot, and maintenance can be easily performed.

本発明の一実施形態になる基板貼合システムの全体構成の１例を示す図である。It is a figure which shows one example of the whole structure of the board | substrate bonding system which becomes one Embodiment of this invention. ロードロック室の概略構成を示す図である。It is a figure which shows schematic structure of a load lock chamber. 脱気室の概略構成を示す図である。It is a figure which shows schematic structure of a deaeration chamber. 脱気室の基板収納機構を説明するための図である。It is a figure for demonstrating the board | substrate storage mechanism of a deaeration chamber. 貼り合せ室の概略構成を示す図である。It is a figure which shows schematic structure of a bonding chamber.

符号の説明Explanation of symbols

２…回転室、３…搬送ロボットの移動レール、４…搬送ロボット、５…ロードロック室、６…脱気室、７…貼り合せ室、８…パネル保管室。   2 ... Rotating chamber, 3 ... Moving rail of transfer robot, 4 ... Transfer robot, 5 ... Load lock chamber, 6 ... Deaeration chamber, 7 ... Bonding chamber, 8 ... Panel storage chamber.

Claims (3)

ロードロック室と脱気室及び基板貼り合せ室を直線状に配置すると共に、各室間にゲートバルブを設け、前記脱気室内には複数枚の下基板を蓄積する収納機構を設け、前記貼り合せ室には貼り合せる搬入ロボットにより上側基板を搬入して上テーブルに保持すると共に、貼り合せ後の製品を下テーブルから受け取り搬出するためのゲートバルブを設け、前記ロードロック室に液晶を滴下した下側基板を搬入し、コンベアにより前記脱気室に搬入し、前記脱気室に設けられた収納機構に順次収納し、搬入された順に前記下基板をコンベアに受け渡し前記貼り合せ室に搬送する構成とした基板貼り合せシステム。   The load lock chamber, the deaeration chamber and the substrate bonding chamber are arranged in a straight line, a gate valve is provided between the chambers, and a storage mechanism for accumulating a plurality of lower substrates is provided in the deaeration chamber. In the bonding chamber, the upper substrate is loaded by a loading robot to be bonded and held on the upper table, and a gate valve for receiving and transferring the bonded product from the lower table is provided, and the liquid crystal is dropped into the load lock chamber. A lower substrate is carried in, carried into the deaeration chamber by a conveyor, sequentially stored in a storage mechanism provided in the deaeration chamber, and the lower substrate is transferred to the conveyor in the order of carrying in and conveyed to the bonding chamber. A substrate bonding system with a configuration. 請求項１に記載の基板貼り合せシステムにおいて、
略直線状に配置された前記ロードロック室から前記貼り合せ室に対して平行に、処理する基板及び貼り合せ後の製品を搬送する直線状の移動経路を設けて、移動系路上を処理する基板及び製品を保持して搬送するハンドを供えた搬送ロボットを設けた構成とし、移動経路の一方側端部に処理する基板を搬入及び搬出するターンオーバ室を、他方の端部に出来上がった製品を一時保管する保管室を設けた配置構成とした基板貼り合せシステム。 The substrate bonding system according to claim 1,
A substrate for processing on a moving system path by providing a linear movement path for conveying a substrate to be processed and a product after bonding in parallel to the bonding chamber from the load lock chamber arranged in a substantially straight line. And a transfer robot provided with a hand for holding and transporting the product, a turnover chamber for loading and unloading the substrate to be processed at one end of the moving path, and a finished product at the other end. Substrate bonding system with an arrangement that has a storage room for temporary storage. 請求項１に記載の基板貼り合せシステムにおいて、
前記脱気室には前記コンベア上を搬送されてきた下基板の位置合せを行う位置合せ機構を備え、前記位置合せ機構で位置合せ後に前記収納機構を上昇して下基板を基板受けに受け取り、基板受け間に前記コンベアが位置するまで収納機構を上昇させることを特徴とする基板貼り合せシステム。 The substrate bonding system according to claim 1,
The deaeration chamber includes an alignment mechanism for aligning the lower substrate that has been transported on the conveyor, and after the alignment by the alignment mechanism, the storage mechanism is raised to receive the lower substrate in the substrate receiver, A substrate bonding system, wherein the storage mechanism is raised until the conveyor is positioned between the substrate receivers.
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TW097145963A TW200947076A (en) 2007-12-03 2008-11-27 Liquid crystal panel assembly system
CN200810179742XA CN101576688B (en) 2007-12-03 2008-12-03 Substrate assembling system

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