CN101508873A - 导电性粘结膜、其制造方法、使用其的电子设备及其制造方法 - Google Patents

导电性粘结膜、其制造方法、使用其的电子设备及其制造方法 Download PDF

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Publication number
CN101508873A
CN101508873A CNA2009100061841A CN200910006184A CN101508873A CN 101508873 A CN101508873 A CN 101508873A CN A2009100061841 A CNA2009100061841 A CN A2009100061841A CN 200910006184 A CN200910006184 A CN 200910006184A CN 101508873 A CN101508873 A CN 101508873A
Authority
CN
China
Prior art keywords
terminal
conductive
adhesive film
fine particles
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2009100061841A
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English (en)
Chinese (zh)
Inventor
西面宗英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN101508873A publication Critical patent/CN101508873A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Combinations Of Printed Boards (AREA)
CNA2009100061841A 2008-02-15 2009-02-05 导电性粘结膜、其制造方法、使用其的电子设备及其制造方法 Pending CN101508873A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP034119/2008 2008-02-15
JP2008034119A JP2009191185A (ja) 2008-02-15 2008-02-15 導電性接着フィルム、導電性接着フィルムの製造方法、導電性接着フィルムを用いた電子機器、導電性接着フィルムを用いた電子機器の製造方法

Publications (1)

Publication Number Publication Date
CN101508873A true CN101508873A (zh) 2009-08-19

Family

ID=40955381

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2009100061841A Pending CN101508873A (zh) 2008-02-15 2009-02-05 导电性粘结膜、其制造方法、使用其的电子设备及其制造方法

Country Status (4)

Country Link
US (1) US20090208731A1 (enExample)
JP (1) JP2009191185A (enExample)
KR (1) KR20090088793A (enExample)
CN (1) CN101508873A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097342A (zh) * 2010-11-29 2011-06-15 南通富士通微电子股份有限公司 封装系统及装片胶厚度控制方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009186707A (ja) * 2008-02-06 2009-08-20 Seiko Epson Corp 電気光学装置の製造方法、電気光学装置
JP5543267B2 (ja) * 2010-05-07 2014-07-09 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法、並びに実装体及びその製造方法
JP2013037843A (ja) * 2011-08-05 2013-02-21 Sekisui Chem Co Ltd 接続構造体及び接続構造体の製造方法
KR101533304B1 (ko) * 2013-11-01 2015-07-02 에이큐 주식회사 단자부와 안테나 패턴부를 연결하는 장치
TWI748856B (zh) * 2021-01-29 2021-12-01 錼創顯示科技股份有限公司 微型發光二極體及顯示面板
CN116508116A (zh) * 2021-11-26 2023-07-28 京东方科技集团股份有限公司 导电胶膜及其制作方法、电子设备及其制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0362411A (ja) * 1989-07-31 1991-03-18 Canon Inc 異方性導電フィルムの製造方法
JPH07115260A (ja) * 1993-10-19 1995-05-02 Ricoh Co Ltd 電子部品の接続構造
US5808874A (en) * 1996-05-02 1998-09-15 Tessera, Inc. Microelectronic connections with liquid conductive elements
CN1139840C (zh) * 1997-06-13 2004-02-25 积水化学株式会社 安排微粒的方法、液晶显示器和各向异性导电膜
JPH11219982A (ja) * 1998-02-04 1999-08-10 Sony Chem Corp 導電粒子及びそれを用いた異方性導電接着剤
JP3622665B2 (ja) * 1999-12-10 2005-02-23 セイコーエプソン株式会社 接続構造、電気光学装置および電子機器
JP3816717B2 (ja) * 2000-03-10 2006-08-30 セイコーエプソン株式会社 液晶装置及びその製造方法
JP3454223B2 (ja) * 2000-03-27 2003-10-06 ソニーケミカル株式会社 半導体装置の製造方法
JP4865144B2 (ja) * 2001-05-08 2012-02-01 旭化成株式会社 接着剤層への粒子の配置方法
JP2003051661A (ja) * 2001-08-03 2003-02-21 Sekisui Chem Co Ltd 導電接続構造体の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102097342A (zh) * 2010-11-29 2011-06-15 南通富士通微电子股份有限公司 封装系统及装片胶厚度控制方法
CN102097342B (zh) * 2010-11-29 2013-04-17 南通富士通微电子股份有限公司 封装系统及装片胶厚度控制方法

Also Published As

Publication number Publication date
US20090208731A1 (en) 2009-08-20
KR20090088793A (ko) 2009-08-20
JP2009191185A (ja) 2009-08-27

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SE01 Entry into force of request for substantive examination
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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20090819