CN101490570A - 探针阵列结构以及制造探针阵列结构的方法 - Google Patents

探针阵列结构以及制造探针阵列结构的方法 Download PDF

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Publication number
CN101490570A
CN101490570A CNA2006800501795A CN200680050179A CN101490570A CN 101490570 A CN101490570 A CN 101490570A CN A2006800501795 A CNA2006800501795 A CN A2006800501795A CN 200680050179 A CN200680050179 A CN 200680050179A CN 101490570 A CN101490570 A CN 101490570A
Authority
CN
China
Prior art keywords
substrate
contact structures
probe
tip
probe array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800501795A
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English (en)
Chinese (zh)
Inventor
B·N·埃尔德里奇
T·方
J·K·格里特斯
I·Y·坎达斯
马伦裕
G·L·马修
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN101490570A publication Critical patent/CN101490570A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CNA2006800501795A 2006-01-03 2006-12-19 探针阵列结构以及制造探针阵列结构的方法 Pending CN101490570A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/306,574 US20070152685A1 (en) 2006-01-03 2006-01-03 A probe array structure and a method of making a probe array structure
US11/306,574 2006-01-03

Publications (1)

Publication Number Publication Date
CN101490570A true CN101490570A (zh) 2009-07-22

Family

ID=38223689

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800501795A Pending CN101490570A (zh) 2006-01-03 2006-12-19 探针阵列结构以及制造探针阵列结构的方法

Country Status (7)

Country Link
US (1) US20070152685A1 (https=)
EP (1) EP1977260A2 (https=)
JP (1) JP2009524800A (https=)
KR (1) KR20080081991A (https=)
CN (1) CN101490570A (https=)
TW (1) TW200736619A (https=)
WO (1) WO2007081522A2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104254781A (zh) * 2012-03-07 2014-12-31 爱德万测试公司 转移电子探针组件到空间变换器
CN108020695A (zh) * 2017-11-23 2018-05-11 武汉迈斯卡德微电子科技有限公司 一种探针的制作方法
CN109752576A (zh) * 2017-11-01 2019-05-14 中华精测科技股份有限公司 探针卡装置及其信号传输模块
CN111557041A (zh) * 2018-02-06 2020-08-18 株式会社日立高新技术 半导体装置的制造方法
CN116183986A (zh) * 2014-12-30 2023-05-30 泰克诺探头公司 用于测试头的接触探针的制造方法

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JP4916893B2 (ja) * 2007-01-05 2012-04-18 株式会社日本マイクロニクス プローブの製造方法
US8513942B1 (en) * 2009-12-23 2013-08-20 Formfactor, Inc. Method of forming a probe substrate by layering probe row structures and probe substrates formed thereby
US8476538B2 (en) * 2010-03-08 2013-07-02 Formfactor, Inc. Wiring substrate with customization layers
US8519534B2 (en) * 2010-09-22 2013-08-27 Palo Alto Research Center Incorporated Microsprings partially embedded in a laminate structure and methods for producing same
TWI458985B (zh) * 2011-02-23 2014-11-01 King Yuan Electronics Co Ltd 高硬度耐磨探針與其製作方法
US8525168B2 (en) * 2011-07-11 2013-09-03 International Business Machines Corporation Integrated circuit (IC) test probe
KR101378012B1 (ko) 2012-03-14 2014-03-24 삼성전자주식회사 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
US9878401B1 (en) 2013-01-15 2018-01-30 Microfabrica Inc. Methods of forming parts using laser machining
WO2014113508A2 (en) 2013-01-15 2014-07-24 Microfabrica Inc. Methods of forming parts using laser machining
KR101877861B1 (ko) * 2017-01-23 2018-08-09 (주)다람기술 검사프로브 제조방법 및 제조장치, 그리고 이에 의해 제조된 검사프로브
US11821918B1 (en) 2020-04-24 2023-11-21 Microfabrica Inc. Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
US11828775B1 (en) 2020-05-13 2023-11-28 Microfabrica Inc. Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships
WO2021261287A1 (ja) * 2020-06-22 2021-12-30 株式会社ヨコオ プランジャ及びプランジャの製造方法
IT202000017539A1 (it) * 2020-07-20 2022-01-20 Technoprobe Spa Sonda di contatto per testa di misura
TWI843252B (zh) * 2022-10-25 2024-05-21 台灣光罩股份有限公司 微機電探針及其製造方法

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US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US20030048108A1 (en) * 1993-04-30 2003-03-13 Beaman Brian Samuel Structural design and processes to control probe position accuracy in a wafer test probe assembly
US5785538A (en) * 1995-11-27 1998-07-28 International Business Machines Corporation High density test probe with rigid surface structure
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US6043670A (en) * 1997-12-16 2000-03-28 Lucent Technologies Inc. Method for testing integrated circuits
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JP4041619B2 (ja) * 1999-05-28 2008-01-30 東京エレクトロン株式会社 インターコネクタの製造方法
JP2001093635A (ja) * 1999-09-22 2001-04-06 Shin Etsu Polymer Co Ltd 電気コネクタ及びその製造方法、電気コネクタの接続構造、並びにこれを有する電気電子部品
US6661244B2 (en) * 2000-03-06 2003-12-09 Wentworth Laboratories, Inc. Nickel alloy probe card frame laminate
US6586955B2 (en) * 2000-03-13 2003-07-01 Tessera, Inc. Methods and structures for electronic probing arrays
JP2002062313A (ja) * 2000-08-22 2002-02-28 Toppan Printing Co Ltd 電気検査用治具及びその製造方法
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JP4262099B2 (ja) * 2004-01-07 2009-05-13 ユニテクノ株式会社 半導体集積回路の検査治具
US7180318B1 (en) * 2004-10-15 2007-02-20 Xilinx, Inc. Multi-pitch test probe assembly for testing semiconductor dies having contact pads

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104254781A (zh) * 2012-03-07 2014-12-31 爱德万测试公司 转移电子探针组件到空间变换器
CN104254781B (zh) * 2012-03-07 2021-10-15 爱德万测试公司 转移电子探针组件到空间变换器
CN116183986A (zh) * 2014-12-30 2023-05-30 泰克诺探头公司 用于测试头的接触探针的制造方法
CN109752576A (zh) * 2017-11-01 2019-05-14 中华精测科技股份有限公司 探针卡装置及其信号传输模块
CN109752576B (zh) * 2017-11-01 2021-01-08 中华精测科技股份有限公司 探针卡装置及其信号传输模块
CN108020695A (zh) * 2017-11-23 2018-05-11 武汉迈斯卡德微电子科技有限公司 一种探针的制作方法
CN108020695B (zh) * 2017-11-23 2020-11-10 武汉迈斯卡德微电子科技有限公司 一种探针的制作方法
CN111557041A (zh) * 2018-02-06 2020-08-18 株式会社日立高新技术 半导体装置的制造方法
CN111557041B (zh) * 2018-02-06 2023-12-26 株式会社日立高新技术 半导体装置的制造方法

Also Published As

Publication number Publication date
KR20080081991A (ko) 2008-09-10
EP1977260A2 (en) 2008-10-08
WO2007081522A2 (en) 2007-07-19
TW200736619A (en) 2007-10-01
US20070152685A1 (en) 2007-07-05
WO2007081522A3 (en) 2009-02-12
JP2009524800A (ja) 2009-07-02

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SE01 Entry into force of request for substantive examination
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Open date: 20090722