CN101484957B - 使用液晶聚合物(lcp)材料的变压器及其相关联的制作方法 - Google Patents
使用液晶聚合物(lcp)材料的变压器及其相关联的制作方法 Download PDFInfo
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Abstract
本发明提供一种变压器及其制作方法,其包含蚀刻在第一液晶聚合物(LCP)薄片的金属包层上作为金属电路的第一半一次绕组与二次绕组。二次绕组与所述一次绕组以间隔关系定位。第二LCP薄片施加在所述第一LCP薄片上。第二半一次绕组与二次绕组作为金属电路蚀刻在第二LCP薄片的金属包层上。通过导电通路,相应的第一半一次绕组与第二半一次绕组彼此互连,且所述第一半二次绕组与第二半二次绕组彼此连接。
Description
技术领域
本发明涉及变压器的领域,且更明确地说,涉及使用陶瓷、铁氧体或液晶聚合物材料来制作变压器。
背景技术
用于阻抗匹配和单端到差分转换(BALUNS)的小型、低成本、小信号变压器对于使用标准绕线铁芯技术的便携式设计来说往往过大。低温共烧陶瓷铁氧体带和糊状物中的一些进步允许绕线铁芯的替代制造方案。举例来说,变压器结构或类似装置的一些制造方法使用金属化的磁性衬底或生带工艺,例如第6,007,758号和第5,802,702号美国专利中所揭示的工艺。举例来说,可穿过涂覆有导电材料的陶瓷体和侧壁而形成通路。可穿过所述陶瓷体形成小孔,且所述小孔与所述通路相交。可对未经烧制的陶瓷体进行金属化,以便形成导电路径。而且,一些装置可通过单个通路涂覆步骤由多个未经烧制的铁氧体层形成,从而允许生带型制造。
其它工艺使用传统的低温共烧陶瓷(low temperature co-fired ceramic,LTCC)与铁氧体带/墨的组合,例如第5,312,674号和第5,532,667号美国专利中所揭示的工艺。举例来说,铁磁材料可以墨或带的形式提供,且可使用与低温共烧陶瓷带大致相同的热收缩特征的烧制温度分布图(firing profile)来烧结。
可使用例如第5,349,743号美国专利中所揭示的多层共烧陶瓷带技术将其它磁性组件制造为整体结构。磁性材料和绝缘非磁性材料的多个层可形成具有磁性区域和绝缘非磁性区域的整体结构。可使用通过传导通路穿过多层结构而连接的丝网印刷导体来形成绕组。
仍需要进行改进以确保传统的厚膜印刷和市售多层化陶瓷(铁氧体)带处理可与银和金厚膜导体一起使用而无需绕线。需要针对具有低构形的高频、小信号应用而实施的较小设计。需要允许导体与铁芯整合的灵活设计。需要最小数目的具有简单图案的层,以提供一次绕组与二次绕组之间紧密耦合的相互作用。
发明内容
本发明提供一种变压器及其制作方法,其包含蚀刻在第一液晶聚合物(LCP)薄片的金属包层上作为金属电路的第一半一次绕组与二次绕组,使得二次绕组与一次绕组以间隔关系定位。第二LCP薄片施加在所述第一LCP薄片上。第二半一次绕组与二次绕组作为金属电路蚀刻在第二LCP薄片的金属包层上。通过导电通路,相应的第一半一次绕组与第二半一次绕组彼此互连,且第一半二次绕组与第二半二次绕组彼此连接。
导电通路可形成为电镀通孔或填充有导电填充材料的穿孔。
在又一方面,第一LCP薄片与第二LCP薄片可在高压釜内熔合在一起。第一LCP薄片与第二LCP薄片可双轴定向。可在第一LCP薄片和第二LCP薄片中的至少一者内提供铁氧体填料。可在第一LCP薄片与第二LCP薄片之间添加铁氧体层。
在另一方面,LCP薄片的厚度可介于约25微米到约3毫米之间。在一个非限制性实例中,金属包层可形成为铜包层。
附图说明
当根据附图考虑时,本发明的其它目标、特征和优点将从以下对本发明的详细描述中变得明显,在附图中:
图1是现有技术电路板的平面图,其展示各种电子组件和使用标准设计形成的作为小型电路的三个“小”变压器,且展示此些现有技术变压器的较大构形。
图2是现有技术复合磁性组件结构的等角局部透视图。
图3是与图2中所示结构类似的现有技术复合磁性组件结构的另一等角图。
图4是根据本发明一个非限制性实例的变压器的平面图。
图5到图10是展示用于制造图4中所示的变压器的步骤序列的平面图。
图11是根据本发明非限制性实例的变压器的另一实例的平面图。
图12到图15是展示用于制造图11的实例中所示的变压器的步骤序列的平面图。
图16是说明用于使用液晶聚合物(LCP)薄片来制造变压器的步骤的实例的流程图。
图17是通过根据图16的流程图中所述的示范性步骤,使用LCP薄片而形成的变压器的截面图。
具体实施方式
现将参看附图在下文中更全面地描述不同实施例,在附图中展示优选实施例。可陈述许多不同形式,且所描述的实施例不应被解释为限于本文所陈述的实施例。确切地说,提供这些实施例是为了使得本发明将详尽且完整,且将向所属领域的技术人员充分传达范围。相同的数字始终指代相同的元件。
根据贯穿本描述内容而描述的非限制性实例,如所描述的变压器及其制作方法允许使用传统的厚膜印刷和市售的多层陶瓷(铁氧体)带处理,其可与金属厚膜导体(例如,银或金,作为非限制性实例)共烧。无需绕线,且针对高频小信号应用,较小的设计是可能的。变压器具有用于更为灵活的体积有效设计的低构形,因为导体和铁芯被整合。如所描述的变压器设计可使用简单的图案和在一次绕组与二次绕组之间提供紧密耦合相互作用的最小数目的层。还有可能使用液晶聚合物(LCP)薄片来制造根据本发明非限制性实例的变压器。
所述变压器可适合与射频(RF)和中频(IF)电路一起使用,且经小型化以用于有问题且常见的组件。所述变压器可使用市售材料,且可使用市售工艺来制造所述变压器。根据本发明的非限制性实例,此变压器结构在商品变压器市场中且在便携式无线设计中具有广泛的适用性。所述变压器结构可尤其与许多S波段接收器设计有关。
出于描述的目的,下文简要描述各种现有技术设计,接着是根据本发明非限制性实例的变压器及其制作方法的非限制性实例。
图1展示上面安装有大量电子组件的电路板10的平面图,所述电子组件包含集成电路(IC)12和大量其它电子组件14。三个“小”变压器16作为小型电路安装在电路板10上。可使用标准绕线铁芯技术来形成这些现有技术变压器。这些类型的现有技术变压器16具有较高构形和较大的占用面积。在一些情况下,与所说明且安装在电路板10上的其它组件12、14中的许多组件相比,现有技术变压器16垂直延伸较长的距离。
另一现有技术整体结构使用多层共烧陶瓷带技术,且图2和图3中展示实例。例如变压器的这些磁性组件的制造使用多个磁性材料层且使非磁性材料绝缘,以形成具有界限分明的磁性区域与绝缘非磁性区域的整体结构。可使用通过传导通路穿过多层结构而连接的丝网印刷导体来形成绕组。
应理解,已发现共烧多层构造日渐可与微电子电路封装制造中的传统厚膜技术竞争。可利用用于各个层的未经烧制的生(介电)陶瓷带来构造共烧多层封装。相容的导电组合物可使用散布在介电层之间的印刷导体层以及层间连接通路。导电层通常印刷在生带上,且在一个操作中层压和烧制整个组合件。这可减小电路的实体大小并改进其可靠性。
第5,349,743号美国专利中说明图2和图3中所示的现有技术实例。多份两种陶瓷生带材料以所需的几何形状分层,以形成具有界限分明的磁性区域和非磁性区域的层压结构。传导路径沉积在选定的绝缘非磁性带层上。这些传导路径由所述层中所形成的通路连接,以形成磁性组件的所需多匝绕组。
传导路径可由可用印刷或其它沉积技术处理的导电材料构造,且可与铁氧体材料的烧制和烧结工艺特征相容。合适的导电材料包含分散在有机粘结剂中的钯(Pd)或钯-银组合物(Pd-Ag)。其它合适组合物包含导电金属氧化物(在粘结剂中),其与构造磁性装置的过程中所使用的铁氧体材料具有相同的烧制和烧结特征。
通过分层技术形成的结构在压力下层压,且在1100摄氏度到1400摄氏度的温度下共烧和烧结,以形成具有所需电特性和磁特性的整体磁性组件结构。
为了增加电阻率且进一步降低第二带材料的低磁导率,用Mn将Ni铁氧体粉末材料掺杂到等于总材料组合物的1mol%到10mol%的含量。
将图2中所示的组件构造为具有环形磁性铁芯结构的多绕组变压器。此环形铁芯具有四个界限分明的区31到34,所述区中的每一者由多个高磁导率陶瓷生带层构造。区32和34分别由导电绕组35和36限定。这些绕组分别形成变压器的一次绕组和二次绕组。然而,如果这些绕组串联连接,那么所述结构充当多匝电感器。可通过将导体线匝对丝网印刷到多个绝缘非磁性陶瓷生带层上来形成绕组35和36。每一绝缘非磁性层可具有合适的小孔,以用于容纳磁性生带分层插入物区。
用导电通路37(即,填充有导电材料的通孔)将印刷在每一层上的线匝连接到其它层的线匝。使用额外的绝缘非磁性层来容纳磁性带区中的区31和33,且形成组件的顶部和底部结构。使用导电通路38来将绕组35和36的末端连接到位于组件顶部表面上的连接件衬垫39。所述结构的绝缘非磁性区域由40表示。绕组35和36的电流激励在由环形铁芯的区31到34界定的闭合磁性路径中产生磁通量。此实施例中的通量路径在垂直平面内,例如,在图3中所示的x-z平面内。
图3中展示另一现有技术磁性组件的透视图。如像先前实例的情况一样,也将此组件构造为具有环形磁性铁芯结构的多绕组变压器。与图2的实施例的主要不同之处在于通量路径是水平的,即,在X-Y平面内。环形铁芯由定位在顶部部件55与底部部件56(其两者是绝缘非磁性材料层)之间的磁性材料主结构41界定。部件41进一步嵌有绝缘非磁性材料插入物42、43和44,所述插入物为形成绕组的一部分的传导通路61提供支撑。绕组51和52分别是变压器的一次绕组和二次绕组。绕组51和52可串联连接以形成电感器。通过以下步骤来形成这些绕组:在靠近所述结构顶部的部件55层上丝网印刷导体,且在靠近所述结构底部的部件层56上丝网印刷导体,并用传导通路61使这些印刷导体互连以形成绕组。连接件衬垫57印刷在顶部部件层58的顶部表面上,且通过传导通路62连接到绕组51和52。
图4和图11中展示根据本发明非限制性实例的两种不同的变压器结构,其展示位于共用铁芯上的一次绕组和二次绕组。图4以100说明变压器,且展示具有开口区104的矩形配置的铁芯102。图5到图10中展示用于制造图4中所示变压器100的步骤。说明相应的一次绕组106和二次绕组108。
图5是展示大体上平坦的基座110的平面图,所述基座110在此实例中形成为大体上平坦的陶瓷衬底,以在制造序列中用作厚膜衬底。大体上平坦配置的第一半一次绕组112形成于陶瓷衬底110上。通常可通过在基座110上丝网印刷金属导体(例如,银或金丝网印刷导体)来形成此绕组。在一个非限制性实例中,基座陶瓷材料可以是矾土型陶瓷。如所说明,第一半一次绕组112的末端112延伸超过其它线圈末端,且充当连接点中的一者,即,完成的变压器100的端子。可使用标准光刻技术来印刷金属导体。
如图6中所示,将铁氧体糊状物114施加到第一半一次绕组112以及基座上,保持末端暴露。铁氧体糊状物114可以是无机糊状物,例如(作为非限制性实例)包含铁氧体-陶瓷微粒和粘结剂的陶瓷浆料。稍后可对铁氧体糊状物114进行烧制以获得增强的密度和性能。视最终用途设计而定,此系统可以是低温系统或高温系统。还有可能使用钨或钼。应理解,无需在此步骤进行烧制,尽管有可能在整个工艺中进行一次或多次烧制。
如图7中所示,第二半一次绕组120印刷在铁氧体层114上,使得此第二半一次绕组的末端与铁氧体层114重叠,并接触第一半一次绕组的暴露末端。一个末端120a较长且形成端子连接。因此,绕组末端彼此接触,且在由铁氧体糊状物114形成的铁氧体铁芯上形成完成的变压器一次绕组。有可能叠印铁氧体,使得由第一半一次绕组形成的绕组导体均不暴露。可在图案中形成通路,且使其填充有导电糊状物或对其进行电镀以形成导电通路。如果铁氧体糊状物较厚且难以叠印第二半一次绕组以使得绕组末端将连接第一半一次绕组的绕组末端,那么上述情况是可能的。如所描述,可使用常见的厚膜工艺来形成通路。
线距可以是约2密耳到约4密耳。在非限制性实例中,厚膜工艺可为约0.5密耳,例如,约12微米,至多达2密耳到约4密耳的厚膜系统限额。应理解,还可能使用生带系统和通路。
如图8中所示,如所说明,介电层130可沉积在第二半一次绕组120上。此介电层130可以是玻璃材料和类似结构,且形成对应于图4中所示空腔104的空腔。还有可能使用烧穿且留有孔的材料,只要留有某一用于在其上进行印刷的结构。在一些制造序列中,可通过蒸镀来形成所述孔。
如图8中所示,第一半二次绕组140印刷在电介质130上,且包含充当完成的变压器的端子的末端140a。如图9中所示,添加第二铁氧体层150,且将第二半二次绕组160印刷在铁氧体层150上,使得其末端连接到第一半二次绕组140的末端,如图10中所示。一个末端160a充当完成的变压器的端子。同样,如果铁氧体层150较厚,那么所述层可叠印在第一半二次绕组160上。导电通路可用于附接第一半二次绕组140与第二半二次绕组160。在图10中所示的步骤之后,可施加涂层或其它层,以帮助保护完成的变压器结构。
图11中展示根据本发明非限制性实例的变压器的第二实例,且其具有图12到图15中所示的制造序列步骤。此变压器设计可用于可在约2.0GHz到约4.0GHz下操作且经设计以取代一些商业上买卖双方直接交易零件的小型S波段接收器。以200说明变压器,且所述变压器包含具有中心部分204的铁芯202,在中心部分204上绕有一次变压器绕组206和二次变压器绕组208。
如图12中所示,基座层210可形成为生带层,例如,LTCC结构,例如在一个非限制性实例中为未经烧制的铁氧体带。第一半一次绕组212与第一半二次绕组214一起印刷,且间隔于“线匝”或经印刷的第一半一次绕组导体之间。所述导体彼此间隔开,使得形成第一半二次绕组214的导电金属线与形成第一半一次绕组212的任何导电金属线间隔开。末端212a、214a暴露,从而形成一次绕组和二次绕组的端子。
铁氧体层220(图13)形成“缠绕铁芯(wrap core)”,且施加在第一半一次绕组212和第一半二次绕组214上。此铁氧体层220内形成有导体通路222,其可形成为电镀通孔或填充有导电填料的穿孔。
如所说明,第二半一次绕组230和第二半二次绕组232印刷在此铁氧体“缠绕铁芯”220上,使得绕组末端连接到导电通路222,且连接第一半一次绕组212与第一半二次绕组214的末端。如所说明,每一绕组230、232的较长末端形成端子230a、232a。可将层放置在第二半一次绕组230和第二半二次绕组232上,以仅使末端暴露,如图5中所说明。此层可以是铁氧体层250。
应理解,任何所形成的空腔都是有利的,因为通量通常留在磁阻最小的路径中。如果一些空腔紧邻外侧上的通路沿边缘纵向放置,那么这在一些实例中可改进效率。
图16展示流程图且说明用于使用液晶聚合物(LCP)来制作与图11中所示的变压器结构类似的变压器结构的步骤序列。用于形成所述变压器的步骤可类似于图12到图15中所示的那些符号,但代替地使用一系列蚀刻步骤。通常,液晶聚合物可以薄片形式供应,在一个非限制性实例中,作为双轴定向膜而供应。所述液晶聚合物可包含正交晶体结构作为双轴定向膜。可使用铁氧体填料来增加磁导率和磁特性。LCP薄片优选作为包含金属包层(例如,铜包层)的层压件而供应,所述层压件经蚀刻以形成类似于图12中所示的结构且具有第一半一次绕组和二次绕组的局部变压器结构,随后添加另一LCP薄片且进行蚀刻,以形成第二半一次绕组与二次绕组。
如图16的流程图中所示,可回蚀第一LCP层(区块300)以形成第一半一次绕组与二次绕组。在一个非限制性实例中,施加铁氧体层(区块302),且施加第二LCP层并对其进行蚀刻(区块304)以形成第二半一次绕组与二次绕组。可形成通路(区块306)并用盖层覆盖(区块308)。所述LCP薄片可(例如)在高压釜中熔合在一起。
图17是可用于使用LCP形成变压器的不同层的截面图。变压器结构310包含第一LCP层312,其包含形成第一半一次绕组与二次绕组的经回蚀的LCP电路层314。添加铁氧体层316,且随后添加第二LCP层320,其包含用于第二半一次绕组与二次绕组的经回蚀的LCP电路层322。通路324在LCP电路层314、322之间连接,从而使一次绕组彼此互连,且使二次绕组彼此互连。可在第二LCP层320上添加盖层326。视所用处理序列而定,在一些情况下,此层还可具有邻近铁氧体的LCP电路层。
LCP具有独特的特性,且可在压力下自熔合。高压釜可用于施加热量和压力,以允许LCP薄片自熔合。还可使用具有电镀通孔的传统预浸料工艺。因此,有可能以加载有用于磁性变压器特性的铁氧体以及经回蚀的铜包层的LCP材料薄片开始。可形成第一半一次绕组和第一半二次绕组,并施加另一LCP薄片,其经回蚀以形成第二半一次绕组和第二半二次绕组。当完全组合时,可钻制通路,并对其进行电镀或以导电糊状物填充。
液晶聚合物通常形成为热塑性聚合物材料,且具有彼此连接的刚性和柔性单体。区段在剪流方向上彼此对准。即使在LCP冷却到熔融温度以下时,此定向方向和结构仍持续。这不同于在固态下分子随机定向的大多数热塑性聚合物。
因此,LCP具有有利的电、热、机械和化学特性。LCP可用于高密度印刷电路板(PCB)制造和半导体封装。LCP在约0.5GHz到约40GHz的范围内可具有约为3的介电常数,及约0.004的低耗损因子,以及低吸湿性和低透湿性。
LCP可作为在约25微米到约3毫米的范围内的薄膜材料而供应。在一些非限制性实例中,一侧或两侧可包含厚度约为18微米的铜包层,且其范围可能更大。可在真空压力机中在大约LCP的熔点下层压此铜包层(层)。可使用微加工技术以允许MEMS应用。这可包含光刻、金属化、蚀刻和电镀。以下情况是可能的,可在约熔点或略低于熔点下,使用热接合工艺和轻微压力来使一些LCP材料接合到MEMS相关材料。可形成复合多层三维结构。
Claims (6)
1.一种制作变压器的方法,其包括:
在第一液晶聚合物薄片的金属包层上蚀刻第一半一次绕组与第一半二次绕组作为金属电路,使得所述二次绕组的轴与所述一次绕组的轴以相间隔且大致平行的关系定位;
在所述第一液晶聚合物薄片上施加铁氧体层;
在所述铁氧体层上施加第二液晶聚合物薄片,其中,所述铁氧体层在所述第一液晶聚合物薄片和所述第二液晶聚合物薄片之间;
在所述第二液晶聚合物薄片的金属包层上蚀刻第二半一次绕组与第二半二次绕组作为金属电路;
使所述第一液晶聚合物薄片与所述第二液晶聚合物薄片熔合在一起;以及
通过导电通路,使所述第一半一次绕组与所述第二半一次绕组彼此互连,且使所述第一半二次绕组与所述第二半二次绕组彼此互连,以在具有开口区的共同矩形铁芯上形成大致矩形配置的具有一次绕组和二次绕组的变压器结构。
2.根据权利要求1所述的方法,其进一步包括将所述导电通路形成为电镀通孔。
3.根据权利要求1所述的方法,其进一步包括在所述液晶聚合物薄片内穿孔,并用导电填充材料来填充所述孔以形成所述导电通路。
4.一种变压器,其包括:
第一液晶聚合物薄片,其具有相对侧以及位于所述侧中的至少一者上的金属包层;
作为金属电路蚀刻在所述金属包层上的第一半一次绕组与第一半二次绕组,使得所述二次绕组的轴与所述一次绕组的轴以相间隔且大致平行的关系定位;
第二液晶聚合物薄片,其具有相对侧以及位于所述侧中的至少一者上的金属包层,且施加在所述第一液晶聚合物薄片上;
铁氧体层,置于所述第一液晶聚合物薄片和所述第二液晶聚合物薄片之间;
作为金属电路蚀刻在所述第二液晶聚合物薄片的所述金属包层上的第二半一次绕组与第二半二次绕组;以及
导电通路,其形成于第一液晶聚合物薄片和第二液晶聚合物薄片内,且使相应的第一半一次绕组与第二半一次绕组彼此互连,并使第一半二次绕组与第二半二次绕组彼此互连,其中,所述第一液晶聚合物薄片和所述第二液晶聚合物薄片包括双轴定向的液晶聚合物薄片。
5.根据权利要求4所述的变压器,其中所述导电通路形成为电镀通孔。
6.根据权利要求4所述的变压器,其中所述导电通路形成为填充有导电填充材料的穿孔。
Applications Claiming Priority (3)
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US11/428,963 US7340825B2 (en) | 2006-07-06 | 2006-07-06 | Method of making a transformer |
US11/428,963 | 2006-07-06 | ||
PCT/US2007/072763 WO2008005993A1 (en) | 2006-07-06 | 2007-07-03 | Transformer and associated method of making using liquid crystal polymer (lcp) material |
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CN101484957A CN101484957A (zh) | 2009-07-15 |
CN101484957B true CN101484957B (zh) | 2012-04-18 |
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CN2007800256459A Expired - Fee Related CN101484957B (zh) | 2006-07-06 | 2007-07-03 | 使用液晶聚合物(lcp)材料的变压器及其相关联的制作方法 |
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US (3) | US7340825B2 (zh) |
EP (1) | EP2044600B1 (zh) |
JP (1) | JP2009543361A (zh) |
KR (1) | KR101057567B1 (zh) |
CN (1) | CN101484957B (zh) |
CA (1) | CA2656644C (zh) |
TW (1) | TWI348718B (zh) |
WO (1) | WO2008005993A1 (zh) |
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JPWO2012111203A1 (ja) * | 2011-02-15 | 2014-07-03 | 株式会社村田製作所 | 積層型インダクタ素子 |
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EP2044600B1 (en) | 2015-06-17 |
JP2009543361A (ja) | 2009-12-03 |
CA2656644A1 (en) | 2008-01-10 |
US7391293B2 (en) | 2008-06-24 |
US20080007380A1 (en) | 2008-01-10 |
CN101484957A (zh) | 2009-07-15 |
WO2008005993A1 (en) | 2008-01-10 |
US20080007383A1 (en) | 2008-01-10 |
KR20090030335A (ko) | 2009-03-24 |
TWI348718B (en) | 2011-09-11 |
TW200811890A (en) | 2008-03-01 |
KR101057567B1 (ko) | 2011-08-17 |
US7340825B2 (en) | 2008-03-11 |
EP2044600A1 (en) | 2009-04-08 |
US20080005890A1 (en) | 2008-01-10 |
CA2656644C (en) | 2012-12-04 |
US7509727B2 (en) | 2009-03-31 |
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