CN101473387A - 层叠型陶瓷电子元件 - Google Patents
层叠型陶瓷电子元件 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 123
- 239000004020 conductor Substances 0.000 claims abstract description 58
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 36
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 35
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000011701 zinc Substances 0.000 claims abstract description 17
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 47
- 238000009792 diffusion process Methods 0.000 claims description 29
- 239000012528 membrane Substances 0.000 claims description 16
- 230000000903 blocking effect Effects 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 abstract description 107
- 238000009713 electroplating Methods 0.000 abstract description 19
- 238000005245 sintering Methods 0.000 abstract description 9
- 239000002344 surface layer Substances 0.000 abstract 3
- 230000002159 abnormal effect Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000001354 calcination Methods 0.000 description 5
- 230000011218 segmentation Effects 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 230000004523 agglutinating effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000002671 adjuvant Substances 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229960004643 cupric oxide Drugs 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 101100537266 Caenorhabditis elegans tin-13 gene Proteins 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
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- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
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- 239000000080 wetting agent Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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Abstract
在具有将铁氧体陶瓷形成的层进行层叠的结构、并对铁氧体陶瓷添加铋作为烧结辅助剂的层叠型陶瓷电子元件中,对其表面导体膜实施电镀时,容易产生电镀膜的异常析出。使其组成为:在构成基材层(2)的铁氧体陶瓷中含有铋,但对于配置在基材层(2)的主面上的表面层(3,4),实质上不含有铋。使表面层(3,4)的锌含有量比基材层(2)的锌含有量更多,即使不对表面层(3,4)添加铋,也能提供良好的烧结性。
Description
技术领域
本发明涉及层叠型陶瓷电子元件,特别涉及具有将铁氧体陶瓷形成的层进行层叠的结构的层叠型陶瓷电子元件。
背景技术
很多情况下使用铁氧体陶瓷作为构成线圈元件的基体的材料。通常,在基体的表面上,形成成为端子或者线圈导体的一部分的导体膜。导体膜的结构是例如涂布含有银的导电性糊料,通过将其烧结形成厚膜。而且,含有这样的银的厚膜形成的导体膜、特别是成为端子的导体膜,在焊接到布线基板时,由于经常会引起焊锡浸出的问题,所以通常在含有银的导体膜上进行镀镍,并且为了使焊接性好,进行镀锡、镀焊锡或者镀金。
在上述的镀镍及镀锡时,通常使用电镀。然而,在电镀时会遭遇如下问题。
一般来讲,构成线圈元件的基体的铁氧体陶瓷与例如绝缘体陶瓷相比,电阻率较低。因此,在实施电镀的时候,有时会产生电镀膜从导体膜上析出到导体膜之外的基体的表面这样的电镀膜的异常析出。这样的电镀膜的异常析出,例如会导致由导体膜决定的端子间的距离缩短,特别是对于小型的线圈元件,有时耐电压性能下降,在最差的情况下会引起短路不良。
作为对于本发明来讲值得关注的已有技术,有日本专利特开2003-272914号公报(专利文献1)记载的方案。该专利文献1中记载的层叠型的线圈元件,对于构成基体的层叠结构的铁氧体陶瓷形成的层,添加铋作为烧结辅助剂。添加铋作为该烧结辅助剂,可以使铁氧体陶瓷在更低温下进行烧结,可以在内部导体使用银。
然而,在专利文献1所述的层叠型的线圈元件中可知,若对该基体的外表面上形成的导体膜进行电镀,更容易产生上述的电镀膜的异常析出,这是由铋引起的。即可知,铋以Bi2O3等状态存在于铁氧体陶瓷的晶粒边界,电镀膜的异常析出在基体表面存在铋的晶粒边界优先传递进行。
专利文献1:日本专利特开2003-272914号公报
发明内容
于是,本发明的目的是提供确保较低温的烧结性,同时可以抑制电镀膜的异常析出,具有将铁氧体陶瓷形成的层进行层叠的结构的层叠型陶瓷电子元件。
本发明的层叠型陶瓷电子元件包括:铁氧体陶瓷形成的基材层;配置在基材层的至少一个主面上、且由铁氧体陶瓷形成的表面层;以及在表面层的面向外侧的主面上形成的表面导体膜。而且,为了解决上述的技术问题,本发明的特征是,构成基材层的铁氧体陶瓷含有包括铋的多种金属元素,但构成表面层的铁氧体陶瓷实质上不含有铋。
较为理想的是,基材层及表面层都含有锌,表面层的锌含有量比基材层的锌含有量更多。
另外,形成表面层的铁氧体陶瓷除了实质上不含有铋之外,与构成基材层的铁氧体陶瓷的组成实质上具有相同的组成体系,即,是多个主结构成分重复的组成时较为理想。
表面层的厚度为30μm以上时较为理想。
另外,在表面导体膜和基材层之间,设有用于遮挡基材层中的铋的扩散的扩散防止层时较为理想。此时,较为理想的是,表面层的厚度为15μm以上,可以使表面层的厚度下限更薄。另外,较为理想的是,扩散防止层由内部导体膜构成。
本发明适用于在表面导体膜形成镀膜的层叠型陶瓷电子元件、即对表面导体膜实施镀膜的层叠型陶瓷电子元件。
本发明的层叠型陶瓷电子元件也可以包括与表面导体膜电连接的表面安装型电子元件。
若采用本发明,则由于构成基材层的铁氧体陶瓷含有铋,但构成表面层的铁氧体陶瓷实质上不含有铋,所以在层叠型陶瓷电子元件的表面、即暴露在电镀液的面中实质上不存在铋。因此,层叠型陶瓷电子元件的表面电阻上升,难以从表面导体膜发生漏电,所以可以使层叠型陶瓷电子元件的表面的电镀膜的异常析出难以产生。结果,可以使由于电镀膜的异常析出而导致的表面导体膜间的耐电压性下降或短路不良难以产生,可以得到可靠性好的层叠型陶瓷电子元件。
另外,若采用本发明,则由于对层叠型陶瓷电子元件具有抑制电镀膜的异常析出的作用的表面层,在使用与以往同样的生片加工来制造层叠型陶瓷电子元件时,准备不含有铋的生片,只需将其层叠就可以形成,因此可以不导致成品率下降及成本上升等,制造电镀膜的异常析出被抑制的层叠型陶瓷电子元件。
即,若采用本发明,则由于解决了电镀膜的异常析出的问题,所以例如不比对煅烧前或者煅烧后的层叠体实施特别的处理。因此,可以避免该处理用的工序增加、成本增加、难以适当且均匀地处理、由于处理导致的其它问题的发生等问题。
本发明中,基材层及表面层都含有锌的时候,若表面层的锌含有量比基材层的锌含有量更多,则表面层即使不含有铋,但表面层中也能得到良好的烧结性。
若表面层的厚度为30μm以上,则来自基材层的铋即使扩散,也不会达到表面层的面向外侧的主面,可以稳定得到电镀膜的异常析出被抑制的层叠型陶瓷电子元件。
若在表面导体膜和基材层之间,设置用于遮挡基材层中铋的扩散的扩散防止层,则可以有效地遮挡铋从基材层向表面导体膜附近的扩散。
另外,若设置扩散防止层,则将稳定并抑制电镀膜的异常析出所需的表面层的厚度可以薄至15μm,随之,可以有利于减小层叠型陶瓷电子元件的厚度。
若上述的扩散防止层由内部导体膜构成,则由于能够通过与其它内部导体膜同样的工序来形成扩散防止层,因此不需要设置扩散防止层用的特别的材料及工序。
本发明的层叠型陶瓷电子元件若还包括与表面导体膜电连接的表面安装型电子元件,则可以得到没有表面导体膜间的耐电压性下降或短路不良等、可靠性高的模块元件。
附图说明
图1是表示根据本发明的第一实施方式的层叠型陶瓷电子元件1的剖视图。
图2是表示根据本发明的第二实施方式的层叠型陶瓷电子元件1a的剖视图。
图3是表示根据本发明的第三实施方式的层叠型陶瓷电子元件1b的剖视图。
图4是表示根据本发明的第四实施方式的层叠型陶瓷电子元件1c的剖视图。
标号说明
1、1a、1b、1c 层叠型陶瓷电子元件
2 基材层
3、4 表面层
6 内部导体膜
7 表面导体膜
10、11 表面安装型电子元件
16、17、18 扩散防止层
21、22 端子导体膜
具体实施方式
图1是表示根据本发明的第一实施方式的层叠型陶瓷电子元件1的剖视图。
层叠型陶瓷电子元件1具有陶瓷层叠体5,该陶瓷层叠体5具有包括铁氧体陶瓷形成的基材层2;以及分别在基材层2的上下主面上配置的、且由铁氧体陶瓷形成的表面层3和4的层叠构造。
层叠型陶瓷电子元件1还包括设在陶瓷层叠体5的内部及外部的导体图案。导体图案大致分为内部导体膜6、表面导体膜7以及层间连接导体8。内部导体膜6及表面导体膜7是在制造该层叠型陶瓷电子元件1的过程中,在为形成基材层2或者表面层3或4而层叠的陶瓷生片的主面上形成的导体膜。层间连接导体8是在厚度方向贯穿上述陶瓷生片而设置的。
内部导体膜6是在陶瓷层叠体5的内部形成的。另一方面,表面导体膜7是在陶瓷层叠体5的主面、即表面层3或4的面向外侧的主面上形成的。
用特定的内部导体膜6及特定的层间连接导体8,在基材层2的内部形成线圈图案9。另外,形成线圈图案9的一部分的层间连接导体8在图1中未图示。
该层叠型陶瓷电子元件1例如构成DC-DC变换器,在表面层3的面向外侧的主面上安装表面安装型电子元件10及11。电子元件10例如是IC芯片,通过焊锡凸点12与在表面层3的面向外侧的主面上形成的表面导体膜7电连接。另一电子元件11例如是片状电容器,通过焊锡13与在表面层3的面向外侧的主面上形成的表面导体膜7电连接。在下方的表面层4的面向外侧的主面上形成的表面导体膜7,用作为在未图示的母板上安装该层叠型陶瓷电子元件1时的端子电极。
构成基材层2的铁氧体陶瓷含有包括铋的多种金属元素。另一方面,构成表面层3及4的铁氧体陶瓷实质上不含有铋。另外,构成表面层3及4的铁氧体陶瓷除了实质上不含有铋之外,与构成基材层2的铁氧体陶瓷的组成实质上具有相同的组成体系的、即多个主结构成分为重复的组成时较为理想。另外,基材层2及表面层3及4都含有锌,但表面层3及4的锌含有量比基材层2的锌含有量更多。
作为一个例子,作为构成基材层2的铁氧体陶瓷的原料粉末,可以使用将氧化铁(Fe2O3)、氧化锌(ZnO)、氧化镍(NiO)及氧化铜(CuO)以规定的比率调合并且添加Bi2O3作为烧结辅助剂的材料。该情况下,可以得到例如1MHz下的相对磁导率为150的铁氧体陶瓷。
另一方面,作为构成表面层3及4的铁氧体陶瓷的原料粉末,可以使用以上述基材层2用的原料粉末的组成为基本、但未添加Bi2O3的材料。此时,为了提高烧结性,锌的含有量比基材层2的情况更多。作为一个例子,可以使用与基材层2的主结构成分相同的、将氧化铁、氧化锌及氧化铜以规定的比率调合的材料作为原料粉末。使用该原料粉末得到的铁氧体陶瓷在例如1MHz下的相对磁导率为1。
上述的例子中,是使用Fe-Ni-Zn-Cu及Fe-Zn-Cu组成的材料作为铁氧体陶瓷,但也可以使用例如Fe-Mn-Zn等其它组成的材料。
接下来,就层叠型陶瓷电子元件1的制造方法进行说明。
首先,准备应该成为基材层2及表面层3及4的各个陶瓷生片。向如上所述调合的铁氧体陶瓷原料粉末添加粘合剂、增塑剂、湿润剂、分散剂等,并使其形成浆料,将其成形为片材状,得到这些陶瓷生片。
接下来,通过在特定的陶瓷生片形成贯穿孔,对贯穿孔填充导电性糊料,形成未烧结的层间连接导体8,另外,通过在特定的陶瓷生片上印刷导电性糊料,形成未烧结的内部导体膜6及表面导体膜7。形成这些内部导体膜6、表面导体膜7及层间连接导体8用的导电性糊料中含有的导电性金属以银或者银/钯作为主要成分时较为理想。
接下来,为了形成各个基材层2及表面层3及4,将规定片数的陶瓷生片以规定的顺序层叠,接下来通过压焊,得到未烧结状态的陶瓷层叠体5。
另外,以上的工序在对同时制造多个层叠型陶瓷电子元件1用的集合状态的陶瓷层叠体实施的时候,为了使该集合状态的陶瓷层叠体在之后易于分割,要形成分割槽。
接下来,煅烧未烧结的陶瓷层叠体,据此得到烧结的陶瓷层叠体5。此时,应该成为不含有铋的表面层3及4的陶瓷生片与应该成为基材层2的陶瓷生片相比,由于锌含有量较多,因此可以得到良好的烧结性。
接下来,对陶瓷层叠体5的表面露出的表面导体膜7实施镀膜处理。更具体地讲是实施电镀,据此,依次形成镀镍膜及镀锡膜。在电镀工序中,由于表面层3及4实质上不含有铋,在表面层3及4的面向外侧的主面没有铋,因此,表面电阻升高,难以产生镀膜的异常析出。另外,镀膜处理也可以是非电解电镀,在该情况下,例如依次形成镀镍膜及镀金膜。
接下来,在陶瓷层叠体5的上方主面上安装表面安装型电子元件10及11,使其成为与表面导体膜4电连接的状态。
而且,以上的工序在对集合状态的陶瓷层叠体实施的时候,沿着上述的分割槽实施分割工序,取出各个层叠型陶瓷电子元件1。虽然未图示,但可以根据需要对层叠型陶瓷电子元件1安装金属覆盖物。
以上的说明中,是在煅烧工序之前形成分割槽,但也可以不形成分割槽,在煅烧工序前分割集合状态的陶瓷层叠体,取出各个层叠型陶瓷电子元件1用的陶瓷层叠体5的原始状态层叠体。该情况下,对各个陶瓷层叠体5实施煅烧工序,电镀处理中例如使用筒电镀。
在这样得到的层叠型陶瓷电子元件1中,表面层3及4的各个厚度为30μm以上时较为理想。在厚度不到30μm的情况下,铋从基材层2扩散,有时会到达各个表面层3及4的面向外侧的主面;若厚度为30μm以上,则铋即使从基材层2扩散,也不会到达面向外侧的主面。所以,可以稳定并抑制电镀膜的异常析出。
图2是表示根据本发明的第二实施方式的层叠型陶瓷电子元件1a,是与图1对应的图。图2中,对于与图1所示的要素相当的要素标注了同样的参照标号,并省略重复说明。
图2所示的层叠型陶瓷电子元件1a与图1所示的层叠型陶瓷电子元件1相比较,特征是采取了用于遮挡基材层2中铋的扩散的措施。
图1所示的层叠型陶瓷电子元件1的情况下,位于表面层3及4内且处于表面导体膜7附近的内部导体膜6,虽然也具有某种程度遮挡基材层2中铋的扩散的作用,但为了使该作用更加完善,将图2与图1比较可知,该实施方式中的表面导体膜7的附近的内部导体膜6的面积更大。另外,在表面导体膜7的附近不存在合适的内部导体膜6的时候,通过重新形成内部导体膜,来形成扩散防止层16。扩散防止层16例如是沿着基材层2和表面层4的界面形成的。
如上所述,采取了用于遮挡基材层2中铋的扩散的措施时,各个表面层3及4的厚度即使薄至15μm左右,也能抑制各个表面层3及4的面向外侧的主面上的镀膜的异常析出。结果,可以有利于降低层叠型陶瓷电子元件1a的厚度。
图3表示根据本发明的第三实施方式的层叠型陶瓷电子元件1b,是与图1及图2对应的图。图3中,对于与图1或者图2所示的要素相当的要素标注了同样的参照标号,并省略重复说明。
图3所示的层叠型陶瓷电子元件1b中,也采取了用于遮挡基材层2中铋的扩散的措施。
图3所示的层叠型陶瓷电子元件1b中,沿着基材层2和表面层3的界面形成较大面积的扩散防止层17,另外,在表面层4的内部形成较大面积的扩散防止层18。这些扩散防止层17及18都由内部导体膜构成。这样,通过设置扩散防止层17及18,可以具有与上述的层叠型陶瓷电子元件1a的情况同样的效果。
通过使大面积的扩散防止层17及18例如具有作为电容器电极的功能,或者具有作为接地电位电极的功能,可以不进行额外的设计变更,使层叠型陶瓷电子元件1b具有遮挡铋的扩散的功能。
以上,与图示的实施方式相关说明了本发明,但在本发明范围内,可以进行其它各种变形例。
例如,图示的层叠型陶瓷电子元件1、1a及1b是在陶瓷层叠体5上安装表面安装元件9及10的多功能复合元件,但本发明还可以用于单功能元件、例如图4所示的片状线圈。
图4是表示本发明的第四实施方式,是构成片状线圈的层叠型陶瓷电子元件1c的剖视图。图4中,对于与图1所示的要素相当的要素标注了同样的参照标号,并省略重复说明。
在图4所示的构成片状线圈的层叠型陶瓷电子元件1c中,在陶瓷层叠体5的两端部形成端子导体膜21及22,线圈图案9的各端部被引出到陶瓷层叠体5的各端面,分别与端子导体膜21及22电连接。端子导体膜21及22的各一部分构成形成于表面层3及4的面向外侧的主面上的表面导体膜。
Claims (9)
1.一种层叠型陶瓷电子元件,其特征在于,包括:
由铁氧体陶瓷形成的基材层;
配置在所述基材层的至少一个主面上且由铁氧体陶瓷形成的表面层;以及
在所述表面层的面向外侧的主面上形成的表面导体膜,
构成所述基材层的所述铁氧体陶瓷含有包括铋的多种金属元素,但构成所述表面层的所述铁氧体陶瓷实质上不含有铋。
2.根据权利要求1所述的层叠型陶瓷电子元件,其特征在于,
所述基材层及所述表面层都含有锌,所述表面层的锌含有量比所述基材层的锌含有量更多。
3.根据权利要求1所述的层叠型陶瓷电子元件,其特征在于,
构成所述表面层的所述铁氧体陶瓷除了实质上不含有铋之外,与构成所述基材层的所述铁氧体陶瓷的组成实质上具有相同的组成体系。
4.根据权利要求1所述的层叠型陶瓷电子元件,其特征在于,
所述表面层的厚度为30μm以上。
5.根据权利要求1所述的层叠型陶瓷电子元件,其特征在于,
在所述表面导体膜和所述基材层之间,设置用于遮挡所述基材层中的铋的扩散的扩散防止层。
6.根据权利要求5所述的层叠型陶瓷电子元件,其特征在于,
所述表面层的厚度为15μm以上。
7.根据权利要求5所述的层叠型陶瓷电子元件,其特征在于,
所述扩散防止层由内部导体膜构成。
8.根据权利要求1所述的层叠型陶瓷电子元件,其特征在于,
在所述表面导体膜形成镀膜。
9.根据权利要求1所述的层叠型陶瓷电子元件,其特征在于,
还包括与所述表面导体膜电连接的表面安装型电子元件。
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JP4692574B2 (ja) * | 2008-05-26 | 2011-06-01 | 株式会社村田製作所 | 電子部品及びその製造方法 |
WO2010053038A1 (ja) | 2008-11-04 | 2010-05-14 | 株式会社村田製作所 | 実装型電子回路モジュール |
JP2012114345A (ja) * | 2010-11-26 | 2012-06-14 | Murata Mfg Co Ltd | セラミック多層基板 |
JP5921074B2 (ja) * | 2011-03-17 | 2016-05-24 | 株式会社村田製作所 | 積層基板の製造方法 |
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KR20180105891A (ko) * | 2017-03-16 | 2018-10-01 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
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Family Cites Families (15)
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---|---|---|---|---|
JPH0634452B2 (ja) * | 1985-08-05 | 1994-05-02 | 株式会社日立製作所 | セラミツクス回路基板 |
JPH05275240A (ja) | 1992-03-26 | 1993-10-22 | Taiyo Yuden Co Ltd | 積層チップインダクタ及びその製造方法 |
JP3447786B2 (ja) * | 1993-12-28 | 2003-09-16 | 太陽誘電株式会社 | 積層型電子部品 |
JP3693398B2 (ja) * | 1995-12-15 | 2005-09-07 | 松下電器産業株式会社 | セラミックス磁性体材料およびこれを用いた高周波用回路部品 |
US6228196B1 (en) * | 1998-06-05 | 2001-05-08 | Murata Manufacturing Co., Ltd. | Method of producing a multi-layer ceramic substrate |
JP2000294423A (ja) | 1999-04-09 | 2000-10-20 | Tdk Corp | 積層フェライトインダクタデバイス及びその製造方法 |
JP3687484B2 (ja) * | 1999-06-16 | 2005-08-24 | 株式会社村田製作所 | セラミック基板の製造方法および未焼成セラミック基板 |
JP3465649B2 (ja) * | 1999-11-11 | 2003-11-10 | 株式会社村田製作所 | セラミックインダクタ部品及び複合部品 |
JP3407716B2 (ja) * | 2000-06-08 | 2003-05-19 | 株式会社村田製作所 | 複合積層電子部品 |
TW527612B (en) * | 2000-12-25 | 2003-04-11 | Tdk Corp | Low-temperature burnt ferrite material and ferrite parts using the same |
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US6914513B1 (en) * | 2001-11-08 | 2005-07-05 | Electro-Science Laboratories, Inc. | Materials system for low cost, non wire-wound, miniature, multilayer magnetic circuit components |
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JP2003272914A (ja) * | 2002-03-12 | 2003-09-26 | Sumitomo Metal Ind Ltd | 酸化物磁性材料とその製造方法および積層チップインダクタ |
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CN102598165A (zh) * | 2009-11-11 | 2012-07-18 | 株式会社村田制作所 | 层叠陶瓷电子部件 |
CN115626820A (zh) * | 2022-11-02 | 2023-01-20 | 西南科技大学 | 一种异质叠层共烧铁氧体陶瓷的制备方法 |
CN115626820B (zh) * | 2022-11-02 | 2023-10-31 | 西南科技大学 | 一种异质叠层共烧铁氧体陶瓷的制备方法 |
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