CN101455131A - 电路板设备、布线板连接方法和电路板模块设备 - Google Patents
电路板设备、布线板连接方法和电路板模块设备 Download PDFInfo
- Publication number
- CN101455131A CN101455131A CNA200780019088XA CN200780019088A CN101455131A CN 101455131 A CN101455131 A CN 101455131A CN A200780019088X A CNA200780019088X A CN A200780019088XA CN 200780019088 A CN200780019088 A CN 200780019088A CN 101455131 A CN101455131 A CN 101455131A
- Authority
- CN
- China
- Prior art keywords
- anisotropic conductive
- wiring plate
- conductive parts
- circuit board
- functional block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP142149/2006 | 2006-05-22 | ||
JP2006142149 | 2006-05-22 | ||
PCT/JP2007/059830 WO2007135879A1 (ja) | 2006-05-22 | 2007-05-14 | 回路基板装置、配線基板間接続方法及び回路基板モジュール装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101455131A true CN101455131A (zh) | 2009-06-10 |
CN101455131B CN101455131B (zh) | 2011-04-06 |
Family
ID=38723191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200780019088XA Expired - Fee Related CN101455131B (zh) | 2006-05-22 | 2007-05-14 | 电路板设备、布线板连接方法和电路板模块设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8130511B2 (zh) |
JP (1) | JP4998465B2 (zh) |
CN (1) | CN101455131B (zh) |
WO (1) | WO2007135879A1 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104619132A (zh) * | 2013-11-04 | 2015-05-13 | 深圳崇达多层线路板有限公司 | 挠性印刷电路板的加工方法 |
CN104852172A (zh) * | 2014-02-19 | 2015-08-19 | 联想(北京)有限公司 | 一种电子设备和电路板连接方法 |
CN107076593A (zh) * | 2014-11-06 | 2017-08-18 | 日立汽车系统株式会社 | 热式空气流量计 |
CN108811368A (zh) * | 2018-05-31 | 2018-11-13 | 联想(北京)有限公司 | 连接元件和基于该连接元件的pcb板的组装方法 |
CN110999549A (zh) * | 2018-06-19 | 2020-04-10 | 一般财团法人生产技术研究奖励会 | 电气装置 |
CN114025479A (zh) * | 2021-12-03 | 2022-02-08 | 中国电子科技集团公司第二十六研究所 | 电路板之间的垂直互连结构、封装器件、微系统及其方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4543115B1 (ja) * | 2009-03-06 | 2010-09-15 | 株式会社東芝 | 電子機器及びフレキシブルプリント配線板 |
US8535623B2 (en) * | 2009-04-21 | 2013-09-17 | Hitachi Chemical Company, Ltd. | Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder |
US8062040B2 (en) * | 2009-04-30 | 2011-11-22 | General Electric Company | Apparatus and method for electrical connection clamping |
JP5455034B2 (ja) * | 2009-12-09 | 2014-03-26 | ホシデン株式会社 | フレキシブル配線基板 |
US8963568B2 (en) * | 2010-03-31 | 2015-02-24 | Tektronix, Inc. | Resistive probing tip system for logic analyzer probing system |
EP2473012A1 (en) * | 2010-12-30 | 2012-07-04 | Research In Motion Limited | Combining printed circuit boards |
CN203225947U (zh) * | 2013-03-28 | 2013-10-02 | 富士康(昆山)电脑接插件有限公司 | 印刷电路板组件 |
JP6378265B2 (ja) * | 2016-08-04 | 2018-08-22 | Necスペーステクノロジー株式会社 | プリント基板接続構造 |
JPWO2018138753A1 (ja) * | 2017-01-24 | 2019-03-22 | 一般財団法人生産技術研究奨励会 | 電気装置 |
CN110783727A (zh) * | 2018-11-09 | 2020-02-11 | 广州方邦电子股份有限公司 | 一种连接器及制作方法 |
US11444400B2 (en) * | 2020-12-21 | 2022-09-13 | Dell Products L.P. | Information handling system with a printed circuit board having an embedded interconnect |
CN113573468B (zh) * | 2021-09-22 | 2021-12-07 | 四川英创力电子科技股份有限公司 | 一种多层电路板及生产方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57168184A (en) | 1981-04-10 | 1982-10-16 | Ricoh Elemex Corp | Wrist watch equipped with biological information detector |
JPS57168184U (zh) * | 1981-04-20 | 1982-10-22 | ||
JPS59189269A (ja) | 1983-04-08 | 1984-10-26 | 三菱電機株式会社 | 連続凍結装置 |
JPS59189269U (ja) * | 1983-06-01 | 1984-12-15 | 株式会社東芝 | 印刷配線基板の接続構造 |
JPH0630277B2 (ja) * | 1986-09-29 | 1994-04-20 | 株式会社日立製作所 | プリント基板間接続法 |
JPH0276477A (ja) | 1988-09-13 | 1990-03-15 | Yokogawa Electric Corp | 画像処理ランレングスコード化回路 |
JPH067578Y2 (ja) * | 1988-11-30 | 1994-02-23 | 横河電機株式会社 | 電気機器 |
US4913656A (en) * | 1989-04-07 | 1990-04-03 | Rogers Corporation | Electrical connector |
JP2846751B2 (ja) * | 1991-07-03 | 1999-01-13 | ローム株式会社 | 回路基板に対するフレキシブルケーブルの接続装置 |
US5165984A (en) * | 1991-07-30 | 1992-11-24 | At&T Bell Laboratories | Stepped multilayer interconnection apparatus and method of making the same |
US5334029A (en) * | 1993-05-11 | 1994-08-02 | At&T Bell Laboratories | High density connector for stacked circuit boards |
JPH0855648A (ja) * | 1994-08-12 | 1996-02-27 | Shinano Polymer Kk | エラストマーコネクター |
JPH0896870A (ja) | 1994-09-27 | 1996-04-12 | Canon Inc | プリント基板の接続構造 |
WO1996025839A1 (en) * | 1995-02-16 | 1996-08-22 | Micromodule Systems, Inc. | Multiple chip module mounting assembly and computer using same |
JPH08307030A (ja) | 1995-05-10 | 1996-11-22 | Canon Inc | 回路基板の接続構造 |
US5662163A (en) * | 1995-11-29 | 1997-09-02 | Silicon Graphics, Inc. | Readily removable heat sink assembly |
US5917709A (en) * | 1997-06-16 | 1999-06-29 | Eastman Kodak Company | Multiple circuit board assembly having an interconnect mechanism that includes a flex connector |
EP0889678B1 (en) | 1997-07-04 | 2006-02-15 | Agilent Technologies, Inc. (a Delaware corporation) | Compressible elastomeric contact and mechanical assembly therewith |
JP2001244592A (ja) | 2000-02-29 | 2001-09-07 | Fuji Photo Optical Co Ltd | フレキシブル回路基板の圧接方法 |
JP4236367B2 (ja) | 2000-06-21 | 2009-03-11 | 信越ポリマー株式会社 | 半導体ソケット及びその製造方法 |
JP3616031B2 (ja) * | 2001-05-10 | 2005-02-02 | 富士通株式会社 | 異方導電性シート、その製造方法、電子装置及び動作試験用検査装置 |
JP2003077559A (ja) | 2001-08-31 | 2003-03-14 | Jsr Corp | 異方導電性コネクターおよびその製造方法並びにその応用製品 |
JP2005347558A (ja) * | 2004-06-03 | 2005-12-15 | Shin Etsu Polymer Co Ltd | 固定治具及び導通体の接続構造 |
-
2007
- 2007-05-14 WO PCT/JP2007/059830 patent/WO2007135879A1/ja active Application Filing
- 2007-05-14 CN CN200780019088XA patent/CN101455131B/zh not_active Expired - Fee Related
- 2007-05-14 US US12/227,059 patent/US8130511B2/en not_active Expired - Fee Related
- 2007-05-14 JP JP2008516602A patent/JP4998465B2/ja not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104619132A (zh) * | 2013-11-04 | 2015-05-13 | 深圳崇达多层线路板有限公司 | 挠性印刷电路板的加工方法 |
CN104619132B (zh) * | 2013-11-04 | 2017-11-07 | 深圳崇达多层线路板有限公司 | 挠性印刷电路板的加工方法 |
CN104852172A (zh) * | 2014-02-19 | 2015-08-19 | 联想(北京)有限公司 | 一种电子设备和电路板连接方法 |
CN104852172B (zh) * | 2014-02-19 | 2017-12-29 | 联想(北京)有限公司 | 一种电子设备和电路板连接方法 |
CN107076593A (zh) * | 2014-11-06 | 2017-08-18 | 日立汽车系统株式会社 | 热式空气流量计 |
CN108811368A (zh) * | 2018-05-31 | 2018-11-13 | 联想(北京)有限公司 | 连接元件和基于该连接元件的pcb板的组装方法 |
CN110999549A (zh) * | 2018-06-19 | 2020-04-10 | 一般财团法人生产技术研究奖励会 | 电气装置 |
CN110999549B (zh) * | 2018-06-19 | 2022-12-30 | 一般财团法人生产技术研究奖励会 | 电气装置 |
CN114025479A (zh) * | 2021-12-03 | 2022-02-08 | 中国电子科技集团公司第二十六研究所 | 电路板之间的垂直互连结构、封装器件、微系统及其方法 |
Also Published As
Publication number | Publication date |
---|---|
US8130511B2 (en) | 2012-03-06 |
JPWO2007135879A1 (ja) | 2009-10-01 |
JP4998465B2 (ja) | 2012-08-15 |
WO2007135879A1 (ja) | 2007-11-29 |
CN101455131B (zh) | 2011-04-06 |
US20090161331A1 (en) | 2009-06-25 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LENOVO INNOVATION CO., LTD. (HONGKONG) Free format text: FORMER OWNER: NEC CORP. Effective date: 20141128 |
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C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; TO: HONG KONG, CHINA |
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TR01 | Transfer of patent right |
Effective date of registration: 20141128 Address after: Hongkong, China Patentee after: LENOVO INNOVATIONS Co.,Ltd.(HONG KONG) Address before: Tokyo, Japan Patentee before: NEC Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110406 Termination date: 20170514 |