CN101426333B - 多层混压印刷电路板及其制造方法、装置 - Google Patents

多层混压印刷电路板及其制造方法、装置 Download PDF

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Publication number
CN101426333B
CN101426333B CN2008101792159A CN200810179215A CN101426333B CN 101426333 B CN101426333 B CN 101426333B CN 2008101792159 A CN2008101792159 A CN 2008101792159A CN 200810179215 A CN200810179215 A CN 200810179215A CN 101426333 B CN101426333 B CN 101426333B
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CN
China
Prior art keywords
sheet material
layer
circuit board
printed circuit
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101792159A
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English (en)
Chinese (zh)
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CN101426333A (zh
Inventor
唐瑞波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to CN2008101792159A priority Critical patent/CN101426333B/zh
Publication of CN101426333A publication Critical patent/CN101426333A/zh
Priority to PCT/CN2009/074099 priority patent/WO2010063194A1/fr
Application granted granted Critical
Publication of CN101426333B publication Critical patent/CN101426333B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
CN2008101792159A 2008-12-01 2008-12-01 多层混压印刷电路板及其制造方法、装置 Expired - Fee Related CN101426333B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008101792159A CN101426333B (zh) 2008-12-01 2008-12-01 多层混压印刷电路板及其制造方法、装置
PCT/CN2009/074099 WO2010063194A1 (fr) 2008-12-01 2009-09-22 Carte de circuit imprimé à compression mixte multicouche et son procédé de fabrication et dispositif de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008101792159A CN101426333B (zh) 2008-12-01 2008-12-01 多层混压印刷电路板及其制造方法、装置

Publications (2)

Publication Number Publication Date
CN101426333A CN101426333A (zh) 2009-05-06
CN101426333B true CN101426333B (zh) 2011-04-06

Family

ID=40616601

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101792159A Expired - Fee Related CN101426333B (zh) 2008-12-01 2008-12-01 多层混压印刷电路板及其制造方法、装置

Country Status (2)

Country Link
CN (1) CN101426333B (fr)
WO (1) WO2010063194A1 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101426333B (zh) * 2008-12-01 2011-04-06 中兴通讯股份有限公司 多层混压印刷电路板及其制造方法、装置
CN101815404A (zh) * 2010-04-08 2010-08-25 梅州五洲电路板有限公司 印刷电路板高频混压工艺
US8716603B2 (en) * 2010-11-24 2014-05-06 Nokia Corporation Printed wiring board with dielectric material sections having different dissipation factors
CN103188890B (zh) * 2011-12-30 2016-03-16 北大方正集团有限公司 一种pcb板的制作方法及一种pcb板
DE102012201367B4 (de) * 2012-01-31 2020-04-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Millimeterwellen-Radar
CN103296382A (zh) * 2012-03-01 2013-09-11 深圳光启创新技术有限公司 基于复合材料的线路板及其应用的电子设备
CN102928842A (zh) * 2012-12-04 2013-02-13 上海无线电设备研究所 一种用于车载防撞雷达系统的小型频综信号源
CN102933026A (zh) * 2012-12-06 2013-02-13 上海无线电设备研究所 一种用于频率发生器的电路板及其制作方法
EP3366092B1 (fr) * 2015-10-22 2023-05-03 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Utilisation d'un corps de support de composant partiellement non durci pour la fabrication de support de composant
CN105307428A (zh) * 2015-11-24 2016-02-03 悦虎电路(苏州)有限公司 Pcb混合板材制作方法
CN106888549A (zh) * 2017-04-12 2017-06-23 广东冠锋科技股份有限公司 一种复合高频电路板及其生产方法
CN108430174B (zh) * 2018-03-26 2019-07-23 生益电子股份有限公司 一种混压pcb的制作方法及混压pcb
CN108282969B (zh) * 2018-03-26 2019-07-23 生益电子股份有限公司 一种实现内层连通的pcb制作方法及pcb
CN109696206B (zh) * 2018-06-26 2021-04-13 上海嘉捷通电路科技股份有限公司 一种自制埋电阻板材及其测试方法
CN109348617A (zh) * 2018-11-28 2019-02-15 吉安市满坤科技有限公司 一种陶瓷混压印制电路板及其制备工艺
CN111137023A (zh) * 2020-02-26 2020-05-12 山东华菱电子股份有限公司 一种拼接式热敏打印头
CN113873746B (zh) * 2021-09-18 2023-07-18 苏州浪潮智能科技有限公司 一种印刷电路板和印刷电路板的设计方法
CN114585152A (zh) * 2022-03-30 2022-06-03 生益电子股份有限公司 一种印制电路板及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936513A (ja) * 1995-07-20 1997-02-07 Japan Aviation Electron Ind Ltd プリント回路装置
US5790384A (en) * 1997-06-26 1998-08-04 International Business Machines Corporation Bare die multiple dies for direct attach
JP2000165007A (ja) * 1998-11-27 2000-06-16 Nec Corp プリント配線板、電子部品及び電子部品の実装方法
CN101014224A (zh) * 2007-02-13 2007-08-08 上海杰盛无线通讯设备有限公司 微波通信中的射频电路板层结构
CN100571484C (zh) * 2008-08-13 2009-12-16 东莞生益电子有限公司 半加成法制作局部区域高频电路印制线路板的方法
CN101426333B (zh) * 2008-12-01 2011-04-06 中兴通讯股份有限公司 多层混压印刷电路板及其制造方法、装置

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Publication number Publication date
WO2010063194A1 (fr) 2010-06-10
CN101426333A (zh) 2009-05-06

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