CN101393863A - 清洁半导体晶片的方法 - Google Patents

清洁半导体晶片的方法 Download PDF

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Publication number
CN101393863A
CN101393863A CNA2008102151227A CN200810215122A CN101393863A CN 101393863 A CN101393863 A CN 101393863A CN A2008102151227 A CNA2008102151227 A CN A2008102151227A CN 200810215122 A CN200810215122 A CN 200810215122A CN 101393863 A CN101393863 A CN 101393863A
Authority
CN
China
Prior art keywords
fluid film
semiconductor wafer
concentration
hydrogen fluoride
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008102151227A
Other languages
English (en)
Chinese (zh)
Inventor
T·布施哈尔特
C·扎皮柯
D·费若
G·施瓦布
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic AG filed Critical Siltronic AG
Publication of CN101393863A publication Critical patent/CN101393863A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CNA2008102151227A 2007-09-19 2008-09-01 清洁半导体晶片的方法 Pending CN101393863A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007044787A DE102007044787A1 (de) 2007-09-19 2007-09-19 Verfahren zum Reinigen einer Halbleiterscheibe
DE102007044787.8 2007-09-19

Publications (1)

Publication Number Publication Date
CN101393863A true CN101393863A (zh) 2009-03-25

Family

ID=40384093

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008102151227A Pending CN101393863A (zh) 2007-09-19 2008-09-01 清洁半导体晶片的方法

Country Status (7)

Country Link
US (1) US20090071507A1 (de)
JP (1) JP2009076908A (de)
KR (1) KR20090030204A (de)
CN (1) CN101393863A (de)
DE (1) DE102007044787A1 (de)
SG (1) SG151169A1 (de)
TW (1) TW200915405A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104624561A (zh) * 2013-11-13 2015-05-20 东京毅力科创株式会社 基板清洗方法、基板清洗系统
CN107675263A (zh) * 2017-09-15 2018-02-09 东方环晟光伏（江苏）有限公司 单晶硅金字塔结构绒面的优化方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2856196C (en) 2011-12-06 2020-09-01 Masco Corporation Of Indiana Ozone distribution in a faucet
WO2017112795A1 (en) 2015-12-21 2017-06-29 Delta Faucet Company Fluid delivery system including a disinfectant device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2760418B2 (ja) 1994-07-29 1998-05-28 住友シチックス株式会社 半導体ウエーハの洗浄液及びこれを用いた半導体ウエーハの洗浄方法
JP3575859B2 (ja) * 1995-03-10 2004-10-13 株式会社東芝 半導体基板の表面処理方法及び表面処理装置
US6701941B1 (en) 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
US20020064961A1 (en) 2000-06-26 2002-05-30 Applied Materials, Inc. Method and apparatus for dissolving a gas into a liquid for single wet wafer processing
DE10036691A1 (de) * 2000-07-27 2002-02-14 Wacker Siltronic Halbleitermat Verfahren zur chemischen Behandlung von Halbleiterscheiben
US6989358B2 (en) * 2002-10-31 2006-01-24 Advanced Technology Materials, Inc. Supercritical carbon dioxide/chemical formulation for removal of photoresists
JP4498893B2 (ja) * 2004-11-11 2010-07-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
US7432177B2 (en) * 2005-06-15 2008-10-07 Applied Materials, Inc. Post-ion implant cleaning for silicon on insulator substrate preparation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104624561A (zh) * 2013-11-13 2015-05-20 东京毅力科创株式会社 基板清洗方法、基板清洗系统
CN107675263A (zh) * 2017-09-15 2018-02-09 东方环晟光伏（江苏）有限公司 单晶硅金字塔结构绒面的优化方法

Also Published As

Publication number Publication date
SG151169A1 (en) 2009-04-30
TW200915405A (en) 2009-04-01
US20090071507A1 (en) 2009-03-19
DE102007044787A1 (de) 2009-04-02
KR20090030204A (ko) 2009-03-24
JP2009076908A (ja) 2009-04-09

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PB01 Publication
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AD01 Patent right deemed abandoned

Effective date of abandoning: 20090325

C20 Patent right or utility model deemed to be abandoned or is abandoned