CN1013837B - 切割有机膜的方法 - Google Patents
切割有机膜的方法Info
- Publication number
- CN1013837B CN1013837B CN88100613A CN88100613A CN1013837B CN 1013837 B CN1013837 B CN 1013837B CN 88100613 A CN88100613 A CN 88100613A CN 88100613 A CN88100613 A CN 88100613A CN 1013837 B CN1013837 B CN 1013837B
- Authority
- CN
- China
- Prior art keywords
- film
- organic
- framework
- needle tubing
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/0044—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for shaping edges or extremities
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
一片有机膜被展平在,或粘附于一框架或一基片上,而薄膜伸出框架或基片外那部分用使一注射用的注射管状针管接触或逼近框架或基片的侧面端表面,同时将针管沿着该侧面端表面移动并从针管喷射出一种有机溶剂来沿着框架或基片侧面端表面溶解该膜的方法切除。用此方法,有机膜可以被切割而且不产生诸如切屑这类的异物。
Description
本发明涉及一种切割有机膜的方法,具体来说是涉及一种将有机膜粘附或紧密地粘附(对简单“粘附”而言)到一个框架或基片上然后将伸出框架或基片(对有时称为框架或其类而言)外的有机膜的那部份沿着框架或其类的边沿切割而不产生诸如切屑那样的异物。
一个粘附有机膜到一个框架或其类的例子是用作光掩膜或标线片的防尘罩的薄膜。一般来说,薄膜是从一个临时框架拿起一片薄的硝化纤维素或乙基纤维素的薄皮,这薄皮例如用旋转涂布法(或离心涂布法)或是用拉延法(从一个溶液里拉起)形成在一块玻璃板上,然后将这薄皮展平在一个薄膜框架上,并将伸出框架外的那部份薄皮沿框架边沿切割掉。通常是用刀来完成,但是有时候可用激光来做。无论如何,用刀切割避免不了有切屑,用激光切割避免不了有烧渣。这些屑末,即使是非常小,在半导体器件的制造过程中就要出现问题,尤其是在对防尘有严格要求的范畴内,例如在保护膜或抗蚀膜感光的步骤里。如果切屑粘附在薄膜上,很可能就会在将薄膜装到标线片上时掉落在其上而粘附在电路图形上。这就使制造出的器件不合格。
本发明的一个目的是要提供一个在对防尘有严格要求的场合里使用的方法,用这个方法,对在生产过程中带有有机膜的器件,该膜粘附在一个框架或其类上,就能将伸出该框架或其类外的那部份膜沿着框架或其类边沿切除而不产生诸如切屑那类的异物。
本发明提供一种用一种能够溶解该有机膜的有机溶剂来切割有机膜的方法。本发明的方法是一种在制造有有机膜粘附或紧贴在框架或基片上的器件时用于切割有机膜的方法,这方法的特点在于,将一个
注射针管状的针在离开框架侧端面的位置上从有机膜的上面插穿,所述离开的位置是指上述针与框架或基片的侧端面之间应有一个使有机溶剂在这个间隙利用毛细管现象形成液膜的细小的间隙,由针将溶解有机膜的有机溶剂注射出来,通过毛细管现象使溶剂沿着针上升到达有机膜的表面,将针沿着上述框架的侧端面移动就可顺着框架把上述有机膜切断。
按本发明的方法,粘附在框架或其类的有机膜的那部份伸出框架或其类外的部份是用针管沿着框架或其类之侧面端表面移动时从针管喷射出来的有机溶剂切下来的。因此,诸如切屑这类的异物在切割过程中不会出现,本发明的方法适用于对灰尘有严格控制的场合,例如在半导体器件生产过程中的保护膜或抗蚀膜的感光的一工序中。
图1示出本发明方法的第一个实施例,其中一根针管1从上面刺透一片薄膜2,或是在从针管针尖滴出一种有机溶剂穿透了薄膜后针管通过薄膜,然后针管沿着薄膜框架侧面端表面与之保持一个合适的间隙使产生一个毛细管现象,藉着移动针管,薄膜2就由于从针管喷射出的有机溶剂的作用沿框架被切下。
图2示出第二个实施例,其中针管1是斜放穿过薄膜2,并沿着框架的侧面端表面移动,同时针管针尖逼近框架的侧面端表面,与之保持一个合适的间隙,或与之接触,从而沿着框架切割薄膜2。
图3示出第三个实施例,其中针管1从薄膜框架3跟薄膜2接触处斜放穿过薄膜2,并且斜着以框架3为支点移动从而沿着框架切割薄膜2。
本发明所用的有机溶剂最好具有不大于4厘泊的低粘度,使它很够很快地到达薄膜的表面。
有机溶剂可以按所切割的有机膜来选用。例如,如有机膜是由硝化纤维素所组成,有机溶剂就可以用例如丙酮、甲基异丁基甲酮
(MIBK)与醋酸丁酯。如有机膜是由乙基纤维素所组成,就适用具有约40℃至150℃沸点的溶剂,诸如甲苯,来避免溶剂在到达有机膜表面前在室温下挥发掉。使用高沸点有机溶剂容易导致溶剂保留在有机膜里并产生有害的作用。
一些对在生产过程中带有薄膜的器件切割其薄膜的方法的例子将参照附图进行描述。
在图1所示的第一个例子中,针管1从上面穿过薄膜2,或在从针管针尖滴下的有机溶剂穿透了薄膜后针管通过薄膜。针管沿着薄膜框架侧面端表面与之保持一个合适的间隙使产生一个毛细管现象。藉着这毛细管现象,从针管针尖或从针管上一个合适的部位喷射出来的有机溶剂被引致沿着间隙上升并跟膜表面接触。当膜是这样被溶剂溶解时,针管1被移动沿着框架的侧面端表面,同时上述间隙保持在跟图1的薄膜片的表面成90°的方向。结果,薄膜被沿着框架切割。
在图2所示的第二实施例中,针管1像在图1所示的实施例那样通过薄膜2,只是斜着通过。当针管针尖跟框架侧面端表面接触或逼近这表面带有一个合适的间隙,针管被移动以切割薄膜的方法跟第一例一样。
在图3所示的第三实施例中,针管1从薄膜框架3跟薄膜2接触处斜放穿过薄膜2,跟第二实施例的方式一样。薄膜用跟第二实施例里一样的方法移动针管来切割,只是针管用框架3作为支点而倾斜着。在这实施例里,从针管喷射出来的有机溶剂由于毛细管现象而上升,并不沿着框架的侧面端表面往下掉落。即使针管在移动时发生偏移,溶剂撒开,撒开到框架上的溶剂易于附着到在针管针尖跟框架侧面端表面之间的小空间里,并且弥散到薄膜上。由于针管被框架引导着移动,薄膜可以容易地及畅通地被切割。
在上面描述的任一个实施例里,针管是穿过溶解了的薄膜移动
的。如移动速度太快,就会在溶剂切割前发生机械切割,就会产生切屑。如移动太慢,就会有大量的溶剂供应到针管跟框架之间的空间,形成液体蓄积,虽然这决定于所供应的溶剂的量。这可能导致切去薄膜上不需要切去的部份,得不到整洁的切割表面。因此,针管的移动速度需要调整到一个合适的数值。例如,切割0.8到3微米厚的硝化纤维素薄膜,针管的移动速度通常调在1到100mm/秒,最好是45到10mm/秒。
如果供应给针管的溶剂量太大,就有可能将薄膜不需要溶解的部份也溶解掉。如果剂量小,薄膜就不能用溶解方法切割。供应针管的溶剂的合适份量通常是约1×10-4ml/分到约1×10-1ml/分,最好约为5×10-4ml/分到约5×10-2ml/分。
Claims (3)
1、一种在制造有有机膜粘附或紧贴在框架或基片上的器件时用于切割有机膜的方法,其特征在于,将一个注射针管状的针在离开框架侧端面的位置上从有机膜的上面插穿,所述离开的位置是指上述针与框架或基片的侧端面之间应有一个使有机溶剂在这个间隙利用毛细管现象形成液膜的细小的间隙,由针将溶解有机膜的有机溶剂注射出来,通过毛细管现象使溶剂沿着针上升到达有机膜的表面,将针沿着上述框架的侧端面移动就可顺着框架把上述有机膜切断。
2、按权利要求1的方法,其特征在于该有机膜是一层薄膜。
3、按权利要求2的方法,其特征在于该薄膜是硝化纤维素膜或乙基纤维素膜。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2375087A JPH0757528B2 (ja) | 1987-02-03 | 1987-02-03 | 有機質の膜を切断する方法 |
JP23750/87 | 1987-02-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN88100613A CN88100613A (zh) | 1988-08-17 |
CN1013837B true CN1013837B (zh) | 1991-09-11 |
Family
ID=12118990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN88100613A Expired CN1013837B (zh) | 1987-02-03 | 1988-02-03 | 切割有机膜的方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US4797177A (zh) |
EP (1) | EP0277820B1 (zh) |
JP (1) | JPH0757528B2 (zh) |
KR (1) | KR960016815B1 (zh) |
CN (1) | CN1013837B (zh) |
CA (1) | CA1299072C (zh) |
DE (1) | DE3874160T2 (zh) |
MY (1) | MY102314A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5203961A (en) * | 1991-09-20 | 1993-04-20 | Yen Yung Tsai | Wet die cutter assembly and method |
CA2274972A1 (en) | 1996-12-16 | 1998-06-25 | Mitsui Chemicals, Incorporated | Method of manufacturing pellicle and pellicle manufacturing jig |
JP4698517B2 (ja) * | 2006-04-18 | 2011-06-08 | 日東電工株式会社 | 保護テープ剥離方法およびこれを用いた装置 |
JP5195082B2 (ja) * | 2008-06-30 | 2013-05-08 | セイコーエプソン株式会社 | シート材の加工方法およびシート材加工装置 |
CN103158175B (zh) * | 2013-03-15 | 2015-04-15 | 安泰(嘉兴)医疗用品有限公司 | 全自动灯把罩制作设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3447985A (en) * | 1965-09-24 | 1969-06-03 | Russell Seitz | Method for machining fragile crystals |
FR2386494A1 (fr) * | 1977-04-04 | 1978-11-03 | Saint Gobain | Decoupe du verre feuillete |
US4465550A (en) * | 1982-06-16 | 1984-08-14 | General Signal Corporation | Method and apparatus for slicing semiconductor ingots |
US4523974A (en) * | 1983-02-14 | 1985-06-18 | The Perkin-Elmer Corporation | Method of fabricating a pellicle cover for projection printing system |
JPS60130736A (ja) * | 1983-12-19 | 1985-07-12 | Fuji Photo Film Co Ltd | ハロゲン化銀カラー反転感光材料 |
NL8403459A (nl) * | 1984-11-13 | 1986-06-02 | Philips Nv | Werkwijze en inrichting voor het aanbrengen van een laag van fotogevoelig materiaal op een halfgeleiderschijf. |
-
1987
- 1987-02-03 JP JP2375087A patent/JPH0757528B2/ja not_active Expired - Lifetime
-
1988
- 1988-01-30 MY MYPI88000085A patent/MY102314A/en unknown
- 1988-02-01 US US07/151,204 patent/US4797177A/en not_active Expired - Lifetime
- 1988-02-02 CA CA000557977A patent/CA1299072C/en not_active Expired - Fee Related
- 1988-02-03 EP EP88300898A patent/EP0277820B1/en not_active Expired - Lifetime
- 1988-02-03 DE DE8888300898T patent/DE3874160T2/de not_active Expired - Fee Related
- 1988-02-03 KR KR1019880000959A patent/KR960016815B1/ko not_active IP Right Cessation
- 1988-02-03 CN CN88100613A patent/CN1013837B/zh not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CN88100613A (zh) | 1988-08-17 |
EP0277820A3 (en) | 1989-09-06 |
EP0277820A2 (en) | 1988-08-10 |
US4797177A (en) | 1989-01-10 |
KR960016815B1 (ko) | 1996-12-21 |
EP0277820B1 (en) | 1992-09-02 |
DE3874160D1 (de) | 1992-10-08 |
JPS63191619A (ja) | 1988-08-09 |
MY102314A (en) | 1992-05-28 |
CA1299072C (en) | 1992-04-21 |
JPH0757528B2 (ja) | 1995-06-21 |
DE3874160T2 (de) | 1993-04-08 |
KR880009777A (ko) | 1988-10-05 |
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