DE3874160D1 - Verfahren zum schneiden einer membran. - Google Patents

Verfahren zum schneiden einer membran.

Info

Publication number
DE3874160D1
DE3874160D1 DE8888300898T DE3874160T DE3874160D1 DE 3874160 D1 DE3874160 D1 DE 3874160D1 DE 8888300898 T DE8888300898 T DE 8888300898T DE 3874160 T DE3874160 T DE 3874160T DE 3874160 D1 DE3874160 D1 DE 3874160D1
Authority
DE
Germany
Prior art keywords
membrane
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888300898T
Other languages
English (en)
Other versions
DE3874160T2 (de
Inventor
Toshio Kaya
Makoto Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Publication of DE3874160D1 publication Critical patent/DE3874160D1/de
Application granted granted Critical
Publication of DE3874160T2 publication Critical patent/DE3874160T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/0044—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for shaping edges or extremities
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Physical Vapour Deposition (AREA)
DE8888300898T 1987-02-03 1988-02-03 Verfahren zum schneiden einer membran. Expired - Fee Related DE3874160T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2375087A JPH0757528B2 (ja) 1987-02-03 1987-02-03 有機質の膜を切断する方法

Publications (2)

Publication Number Publication Date
DE3874160D1 true DE3874160D1 (de) 1992-10-08
DE3874160T2 DE3874160T2 (de) 1993-04-08

Family

ID=12118990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888300898T Expired - Fee Related DE3874160T2 (de) 1987-02-03 1988-02-03 Verfahren zum schneiden einer membran.

Country Status (8)

Country Link
US (1) US4797177A (de)
EP (1) EP0277820B1 (de)
JP (1) JPH0757528B2 (de)
KR (1) KR960016815B1 (de)
CN (1) CN1013837B (de)
CA (1) CA1299072C (de)
DE (1) DE3874160T2 (de)
MY (1) MY102314A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5203961A (en) * 1991-09-20 1993-04-20 Yen Yung Tsai Wet die cutter assembly and method
KR20000057324A (ko) 1996-12-16 2000-09-15 나까니시 히로유끼 펠리클의 제조 방법 및 펠리클 제조용 지그
JP4698517B2 (ja) * 2006-04-18 2011-06-08 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
JP5195082B2 (ja) * 2008-06-30 2013-05-08 セイコーエプソン株式会社 シート材の加工方法およびシート材加工装置
CN103158175B (zh) * 2013-03-15 2015-04-15 安泰（嘉兴）医疗用品有限公司 全自动灯把罩制作设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3447985A (en) * 1965-09-24 1969-06-03 Russell Seitz Method for machining fragile crystals
FR2386494A1 (fr) * 1977-04-04 1978-11-03 Saint Gobain Decoupe du verre feuillete
US4465550A (en) * 1982-06-16 1984-08-14 General Signal Corporation Method and apparatus for slicing semiconductor ingots
US4523974A (en) * 1983-02-14 1985-06-18 The Perkin-Elmer Corporation Method of fabricating a pellicle cover for projection printing system
JPS60130736A (ja) * 1983-12-19 1985-07-12 Fuji Photo Film Co Ltd ハロゲン化銀カラー反転感光材料
NL8403459A (nl) * 1984-11-13 1986-06-02 Philips Nv Werkwijze en inrichting voor het aanbrengen van een laag van fotogevoelig materiaal op een halfgeleiderschijf.

Also Published As

Publication number Publication date
KR880009777A (ko) 1988-10-05
MY102314A (en) 1992-05-28
EP0277820B1 (de) 1992-09-02
JPH0757528B2 (ja) 1995-06-21
CN88100613A (zh) 1988-08-17
JPS63191619A (ja) 1988-08-09
CA1299072C (en) 1992-04-21
EP0277820A3 (en) 1989-09-06
US4797177A (en) 1989-01-10
KR960016815B1 (ko) 1996-12-21
DE3874160T2 (de) 1993-04-08
CN1013837B (zh) 1991-09-11
EP0277820A2 (de) 1988-08-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: MITSUI CHEMICALS, INC., TOKIO/TOKYO, JP

8339 Ceased/non-payment of the annual fee