CN101361164A - 用于盘状衬底除气的装置 - Google Patents
用于盘状衬底除气的装置 Download PDFInfo
- Publication number
- CN101361164A CN101361164A CNA2006800512535A CN200680051253A CN101361164A CN 101361164 A CN101361164 A CN 101361164A CN A2006800512535 A CNA2006800512535 A CN A2006800512535A CN 200680051253 A CN200680051253 A CN 200680051253A CN 101361164 A CN101361164 A CN 101361164A
- Authority
- CN
- China
- Prior art keywords
- substrate
- flow
- gas
- air
- intermediate cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 101
- 238000007872 degassing Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 claims description 38
- 238000012545 processing Methods 0.000 claims description 14
- 230000008520 organization Effects 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000013078 crystal Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000005485 electric heating Methods 0.000 claims 4
- 238000005086 pumping Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 45
- 230000008569 process Effects 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000003344 environmental pollutant Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 231100000719 pollutant Toxicity 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000009489 vacuum treatment Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Solid Materials (AREA)
- Degasification And Air Bubble Elimination (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH702006 | 2006-01-18 | ||
CH70/06 | 2006-01-18 | ||
PCT/CH2006/000681 WO2007082396A1 (de) | 2006-01-18 | 2006-12-04 | Vorrichtung zur entgasung eines scheibenförmigen substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101361164A true CN101361164A (zh) | 2009-02-04 |
CN101361164B CN101361164B (zh) | 2011-04-20 |
Family
ID=36096097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800512535A Active CN101361164B (zh) | 2006-01-18 | 2006-12-04 | 用于盘状衬底除气的装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070163143A1 (zh) |
EP (1) | EP1979930B1 (zh) |
JP (1) | JP5448456B2 (zh) |
KR (1) | KR20080091804A (zh) |
CN (1) | CN101361164B (zh) |
TW (1) | TWI399800B (zh) |
WO (1) | WO2007082396A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104746008A (zh) * | 2013-12-30 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 去气腔室 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180258519A1 (en) * | 2015-10-25 | 2018-09-13 | Applied Materials, Inc. | Apparatus for vacuum deposition on a substrate and method for masking the substrate during vacuum deposition |
KR20180098448A (ko) | 2017-02-24 | 2018-09-04 | 삼성전자주식회사 | 잔류 가스 제거 장치 및 이를 포함하는 기판 처리 설비 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6276072B1 (en) * | 1997-07-10 | 2001-08-21 | Applied Materials, Inc. | Method and apparatus for heating and cooling substrates |
US6113698A (en) * | 1997-07-10 | 2000-09-05 | Applied Materials, Inc. | Degassing method and apparatus |
US6098568A (en) * | 1997-12-01 | 2000-08-08 | Applied Materials, Inc. | Mixed frequency CVD apparatus |
US6096135A (en) * | 1998-07-21 | 2000-08-01 | Applied Materials, Inc. | Method and apparatus for reducing contamination of a substrate in a substrate processing system |
US6977014B1 (en) * | 2000-06-02 | 2005-12-20 | Novellus Systems, Inc. | Architecture for high throughput semiconductor processing applications |
JP4294893B2 (ja) * | 2001-08-02 | 2009-07-15 | 東京エレクトロン株式会社 | 基板熱処理装置及びその整流機構並びに整流方法 |
JP4133209B2 (ja) * | 2002-10-22 | 2008-08-13 | 株式会社神戸製鋼所 | 高圧処理装置 |
US6952889B2 (en) * | 2002-11-05 | 2005-10-11 | Wafermasters, Inc. | Forced convection assisted rapid thermal furnace |
US20050011459A1 (en) * | 2003-07-15 | 2005-01-20 | Heng Liu | Chemical vapor deposition reactor |
JP4467266B2 (ja) * | 2003-08-13 | 2010-05-26 | 大日本スクリーン製造株式会社 | 基板加熱装置および基板加熱方法 |
JP2006005287A (ja) * | 2004-06-21 | 2006-01-05 | Hitachi Kokusai Electric Inc | 基板処理方法 |
-
2006
- 2006-12-04 WO PCT/CH2006/000681 patent/WO2007082396A1/de active Application Filing
- 2006-12-04 KR KR1020087019598A patent/KR20080091804A/ko not_active Application Discontinuation
- 2006-12-04 CN CN2006800512535A patent/CN101361164B/zh active Active
- 2006-12-04 EP EP06817733.6A patent/EP1979930B1/de active Active
- 2006-12-04 JP JP2008550601A patent/JP5448456B2/ja active Active
- 2006-12-27 US US11/646,139 patent/US20070163143A1/en not_active Abandoned
-
2007
- 2007-01-04 TW TW096100292A patent/TWI399800B/zh active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104746008A (zh) * | 2013-12-30 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 去气腔室 |
CN104746008B (zh) * | 2013-12-30 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 去气腔室 |
Also Published As
Publication number | Publication date |
---|---|
EP1979930A1 (de) | 2008-10-15 |
EP1979930B1 (de) | 2015-08-19 |
TW200733212A (en) | 2007-09-01 |
TWI399800B (zh) | 2013-06-21 |
JP5448456B2 (ja) | 2014-03-19 |
US20070163143A1 (en) | 2007-07-19 |
WO2007082396A9 (de) | 2008-08-14 |
KR20080091804A (ko) | 2008-10-14 |
CN101361164B (zh) | 2011-04-20 |
WO2007082396A1 (de) | 2007-07-26 |
JP2009524222A (ja) | 2009-06-25 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: OERLIKON ADVANCED TECHNOLOGIES AG Free format text: FORMER OWNER: OC OERLIKON BALZERS AG Effective date: 20140724 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140724 Address after: Liechtenstein Barr Che J Patentee after: OC OERLIKON BALZERS AG Address before: Liechtenstein Barr Che J Patentee before: OC Oerlikon Balzers AG |
|
CP01 | Change in the name or title of a patent holder |
Address after: Liechtenstein Barr Che J Patentee after: AIFA advanced technology Co.,Ltd. Address before: Liechtenstein Barr Che J Patentee before: OC OERLIKON BALZERS AG |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200303 Address after: Swiss Te Lui Bach Patentee after: EVATEC AG Address before: Liechtenstein Barr Che J Patentee before: AIFA advanced technology Co.,Ltd. |