CN101359184B - 反力处理装置 - Google Patents

反力处理装置 Download PDF

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Publication number
CN101359184B
CN101359184B CN2008101311515A CN200810131151A CN101359184B CN 101359184 B CN101359184 B CN 101359184B CN 2008101311515 A CN2008101311515 A CN 2008101311515A CN 200810131151 A CN200810131151 A CN 200810131151A CN 101359184 B CN101359184 B CN 101359184B
Authority
CN
China
Prior art keywords
mentioned
reaction force
processing device
force processing
price fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101311515A
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English (en)
Chinese (zh)
Other versions
CN101359184A (zh
Inventor
细畠拓也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Publication of CN101359184A publication Critical patent/CN101359184A/zh
Application granted granted Critical
Publication of CN101359184B publication Critical patent/CN101359184B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H10P72/57—
    • H10P72/7624—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S248/00—Supports
    • Y10S248/913—Two axis article engaging means, e.g. x - y device

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN2008101311515A 2007-07-30 2008-07-30 反力处理装置 Expired - Fee Related CN101359184B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP197912/2007 2007-07-30
JP2007197912A JP4485550B2 (ja) 2007-07-30 2007-07-30 反力処理装置

Publications (2)

Publication Number Publication Date
CN101359184A CN101359184A (zh) 2009-02-04
CN101359184B true CN101359184B (zh) 2010-09-22

Family

ID=40331656

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101311515A Expired - Fee Related CN101359184B (zh) 2007-07-30 2008-07-30 反力处理装置

Country Status (5)

Country Link
US (1) US7948198B2 (enExample)
JP (1) JP4485550B2 (enExample)
KR (1) KR100981604B1 (enExample)
CN (1) CN101359184B (enExample)
TW (1) TW200925815A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009033058A (ja) * 2007-07-30 2009-02-12 Sumitomo Heavy Ind Ltd 反力処理装置
JP5674316B2 (ja) * 2010-01-06 2015-02-25 オークマ株式会社 構造体のたわみ抑制方法
JP5941705B2 (ja) * 2012-02-29 2016-06-29 ファスフォードテクノロジ株式会社 ２軸駆動機構及びダイボンダ
CN104111669B (zh) * 2013-04-18 2018-05-18 陈明灯 一种载物可变重量悬垂定点位移受力平衡调控装置
JP2014220265A (ja) * 2013-04-30 2014-11-20 キヤノン株式会社 ステージ装置、リソグラフィ装置、および物品の製造方法
JP6333653B2 (ja) * 2014-07-23 2018-05-30 住友重機械工業株式会社 射出成形機
WO2020177949A1 (en) * 2019-03-01 2020-09-10 Asml Netherlands B.V. Object positioner device and device manufacturing method
JP2024039768A (ja) * 2022-09-12 2024-03-25 キヤノン株式会社 ステージ装置、パターン形成装置、及び物品の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3506158B2 (ja) * 1995-04-14 2004-03-15 株式会社ニコン 露光装置及び走査型露光装置、並びに走査露光方法
TW448487B (en) * 1997-11-22 2001-08-01 Nippon Kogaku Kk Exposure apparatus, exposure method and manufacturing method of device
US5959427A (en) * 1998-03-04 1999-09-28 Nikon Corporation Method and apparatus for compensating for reaction forces in a stage assembly
JP3554186B2 (ja) * 1998-04-08 2004-08-18 キヤノン株式会社 露光装置、デバイス製造方法および反力受け方法
JP2000170827A (ja) * 1998-12-08 2000-06-23 Fujita Corp アクティブ型除振装置
JP4146952B2 (ja) * 1999-01-11 2008-09-10 キヤノン株式会社 露光装置およびデバイス製造方法
TW466542B (en) * 1999-02-26 2001-12-01 Nippon Kogaku Kk A stage device and a method of manufacturing same, a position controlling method, an exposure device and a method of manufacturing same, and a device and a method of manufacturing same
JP2001148341A (ja) * 1999-11-19 2001-05-29 Nikon Corp 露光装置
JP2001160530A (ja) * 1999-12-01 2001-06-12 Nikon Corp ステージ装置及び露光装置
JP3814453B2 (ja) * 2000-01-11 2006-08-30 キヤノン株式会社 位置決め装置、半導体露光装置およびデバイス製造方法
JP2001257143A (ja) * 2000-03-09 2001-09-21 Nikon Corp ステージ装置及び露光装置、並びにデバイス製造方法
US6788385B2 (en) * 2001-06-21 2004-09-07 Nikon Corporation Stage device, exposure apparatus and method
US6844694B2 (en) * 2001-08-10 2005-01-18 Nikon Corporation Stage assembly and exposure apparatus including the same
US6621241B2 (en) * 2001-12-20 2003-09-16 Dac International, Inc. System and method for reducing oscillating tool-induced reaction forces
JP3679776B2 (ja) * 2002-04-22 2005-08-03 キヤノン株式会社 駆動装置、露光装置及びデバイス製造方法
JP3940388B2 (ja) * 2003-08-04 2007-07-04 住友重機械工業株式会社 ステージ装置用の反力処理システム

Also Published As

Publication number Publication date
US7948198B2 (en) 2011-05-24
CN101359184A (zh) 2009-02-04
KR100981604B1 (ko) 2010-09-10
KR20090013103A (ko) 2009-02-04
US20090278411A1 (en) 2009-11-12
TW200925815A (en) 2009-06-16
TWI378331B (enExample) 2012-12-01
JP4485550B2 (ja) 2010-06-23
JP2009033056A (ja) 2009-02-12

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Granted publication date: 20100922

Termination date: 20150730

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