CN101345143A - Cu/Ti3SiC2 electric contact material and preparation technique - Google Patents
Cu/Ti3SiC2 electric contact material and preparation technique Download PDFInfo
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- CN101345143A CN101345143A CNA2008101369982A CN200810136998A CN101345143A CN 101345143 A CN101345143 A CN 101345143A CN A2008101369982 A CNA2008101369982 A CN A2008101369982A CN 200810136998 A CN200810136998 A CN 200810136998A CN 101345143 A CN101345143 A CN 101345143A
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Abstract
The invention aims at providing an electric contact material Ti3SiC2 and a preparation method used for the electric contact material Cu/Ti3SiC2, wherein, the electric contact material Cu/Ti3SiC2 is provided with self-lubrication performance and has the advantages of high-strength, high conductivity, high thermal conductivity, oxidation resistance and electric arc burning resistance and long service life. The electric contact material Cu/Ti3SiC2 is prepared by pure copper powder or copper alloy powder and 0.01 to 80.0 percent (weight percentage) of Ti3SiC2 powder by adopting a powder metallurgical process. The invention provides the electric contact material Ti3SiC2 which has excellent performances of both metal and ceramic such as high strength, good conductivity, good thermal conductivity, good melt welding resistance, good electric arc burning resistance, good corrosion resistance, good thermal-vibration resistance, good oxidation resistance and particularly good high-temperature oxidation resistance, etc. More especially, the ultra-low friction coefficient and the self-lubrication performance of the electric contact material Cu/Ti3SiC2 are one of the essential characteristics of the electric contact material; therefore, the electric contact material Cu/Ti3SiC2 can be widely applied to the electric contact material such as contact material used for high-voltage or low-voltage electric apparatus, electric brushes, pantograph sliding plates, etc.
Description
(1) technical field
The present invention relates to powder alloy material, is exactly a kind of Cu/Ti3SiC2 contact material and preparation technology thereof specifically.
(2) background technology
In present disclosed patent family and the contact material used, a class is to be the Ag-based electrical contact material of principal component with silver, and another kind of is to be the copper-based electrical contact material of principal component with copper.The Ag-based electrical contact material electrical property that with silver is principal component is fine, and cost is very high, but can not satisfy some specific (special) requirements of electric equipment products fully.With copper be the copper-based electrical contact of principal component the cost of material is low, though electrical property can satisfy instructions for use, but still have much room for improvement.Simultaneously, contact materials such as traditional brush, pantograph pan owing to easy to wear, be subject to reasons such as life-span that arc erosion, shortcoming such as perishable cause is short, also the correlated performance of this class material is had higher requirement.
(3) summary of the invention
The object of the present invention is to provide a kind of high strength, high conduction, high heat conduction, resistance to oxidation, anti-melting welding, anti-electrical arc erosion and electric life that grow and Cu/Ti3SiC2 contact material and preparation technology thereof that have the self-lubricating ability.
The object of the present invention is achieved like this: described Cu/Ti3SiC2 contact material is to be 0.01～80.0% Ti3SiC2 powder by pure copper powder or copper alloy powder and percentage by weight, by the preparation of powder metallurgical technique method.
The present invention also has following technical characterictic:
(1) a kind of Cu/Ti3SiC2 contact material of the present invention and preparation technology thereof, described Ti3SiC2 powder purity greater than 93%, particle size 0.01～50 μ m.
(2) a kind of Cu/Ti3SiC2 contact material of the present invention and preparation technology thereof, described pure copper powder granularity is-200 orders.
(3) a kind of Cu/Ti3SiC2 contact material of the present invention and preparation technology thereof, it is a kind of or wherein several mixing in 0.01～50% diamond, graphite, silver, lanthanum, cerium, dysprosium, samarium, yttrium, ytterbium, zirconium, aluminium, chromium, niobium, tin, zinc, tungsten, vanadium, tin oxide, cadmium oxide, the indium oxide that described copper alloy powder contains percentage by weight, and granularity is-200 orders.
A kind of Cu/Ti3SiC2 contact material of the present invention, its preparation technology is as follows:
(1) with Ti3SiC2 powder and pure copper powder or copper alloy powder under protective atmosphere, ball milling 6～12h obtains mixed-powder on high energy ball mill;
(2) mixed-powder that is obtained is put into graphite jig and made the bulk sample of diameter 50mm, be referred to as stock by the method for hot pressing.Concrete hot pressing system is: under the protective atmosphere, and 850～950 ℃ of hot pressing temperatures, temperature retention time 30～60min, hot pressing pressure is 40～200MPa;
(3) stock after the hot pressing is referred to as extrudate at 700～900 ℃ of following hot extrusion moldings;
(4) extrudate carries out Ageing Treatment under vacuum or protective atmosphere, 500～800 ℃ of treatment temperatures, 1～5 hour processing time;
(5) will carry out machining by product size through after the section rolling of Ageing Treatment or the drawing processing.
A kind of Cu/Ti3SiC2 contact material of the present invention, have the premium properties of metal and pottery concurrently, intensity height not only, and possess good electrical conductivity, thermal conductivity, good characteristic such as anti-melting welding, arc ablation resistance, corrosion-resistant, anti-thermal shock, anti-oxidant especially high-temperature oxidation resistance.Particularly the ultralow coefficient of friction and the self lubricity of this material are one of indispensable characteristics of contact material.Can be widely used in contact material, as high and low voltage electrical equipment contact material, brush, pantograph pan etc.
(4) embodiment
Below the invention will be further described.
A kind of Cu/Ti3SiC2 contact material of the present invention be by pure copper powder or copper alloy powder and percentage by weight be 0.01～80.0%, particle size is at the Ti3SiC2 powder of 0.01～50 μ m, by the preparation of powder metallurgical technique method.Ti3SiC2 belongs to hexagonal crystallographic texture, and the Si layer that the TiC octahedron of common rib is formed by the Si atom is separated, and forms special nanoscale layer laminated structure.This structure is given its image-stone China ink and is equally had lubrification and machinability, combines many premium properties of metal and pottery.The Ti3SiC2 fusing point has fabulous conductivity, thermal conductivity up to 3000 ℃, and its conductivity and simple metal are suitable, and conductance reaches 4.7 * 10 in the time of 25 ℃
6Sm
-1, thermal conductivity reaches 33.5Wm
-1K
-1In addition, the high strength that Ti3SiC2 possessed, anti-thermal shock, corrosion-resistant, anti-oxidant, especially high temperature oxidation resistance and anti-cyclic oxidation ability and characteristics such as self lubricity and ultralow coefficient of friction, the needed key characteristic of contact material especially.
Adopt the copper-based electric contact material of Ti3SiC2 preparation, more can embody high-strength, characteristics such as height is led, high-ductility, self-lubricating.Adopt powder metallurgy process in the copper matrix, to add the Ti3SiC2 powder, not only can play dispersion-strengthened action, very little to the material electric conductivity influence simultaneously.Can play good anti-melting welding, arc resistant ablation, anti-oxidant particularly resistance to high temperature oxidation as high and low voltage electrical equipment with the contact use, improve resistance to wear, improve contact resistance, reduce effects such as temperature rise, raising electric life.Simultaneously, the Ti3SiC2 cermet is as the hard particle, and the easier oxide layer stripping that contact surface is formed comes off.Therefore be more suitable for being applied on various circuit breakers and the A.C. contactor.Use also can be played and reduce wearing and tearing, inhibition arc erosion and corrosion, the effect that increases the service life as contact materials such as pantograph pan, brushes.
Diamond is the highest material of occurring in nature thermal conductivity, and thermal conductivity reaches 138.16Wm
-1K
-1Have performances such as fusing point height (about 3700 ℃), hardness be big, wear-resistant simultaneously, adopt powder metallurgy process in copper, to add tiny diamond particles, not only can play dispersion-strengthened action, improve hardness and resistance to wear, also the heat that electric arc is produced conducts to crane span structure, reduces the contact surface temperature.The diamond particles of what is more important contact surface is burnt when beating arc, does not produce the deposit that causes resistance to increase in contact surface.Under the high-temperature electric arc effect, it is metallic copper or cuprous oxide that the carbon monoxide that the diamond burning produces can make the copper oxide reduction of contact surface simultaneously.Therefore, under the oxidized situation of contact surface, can change the structure of oxide layer by diamond and cuprous oxide.Cuprous oxide is the powdery film, helps guaranteeing that contact has sufficient rectified action.
Add a spot of silver in the copper and, can improve its intensity, hardness, increase that electricity is led, thermal conductance and corrosion resistance, improve mobile and wettability is also improved the cold and hot working performance through excessive deformation process.An amount of alloying element that adds lanthanum, cerium, dysprosium, samarium, ytterbium, yttrium as copper in copper can improve the oxidation resistance of acid bronze alloy low temperature and high temperature, improves the intensity and the recrystallization temperature of acid bronze alloy, and conductivity is slightly improved.In copper, add zirconium, chromium, aluminium in right amount and can improve the medium and high temperature oxidation resistance of copper-based material, anti-ablation property and decay resistance.Aluminium, tin, zinc can reduce contact temperature and have the arc extinguishing effect as contact material the time by its vaporization.Chromium, niobium, tungsten, vanadium solid solubility in the copper matrix is extremely low, and the adding of these elements has certain effect to antioxygenic property, intensity and the anti-ablation property tool that improves matrix.The adding of such alloy also can improve recrystallization temperature.Can increase simultaneously the viscosity of contact surface formed metal bath under arcing, reduce the material damage of contact material, thereby increase the electric life of contact.
The effect that adds cadmium oxide, tin oxide and indium oxide in the copper matrix is: cadmium oxide, tin oxide and indium oxide flash to gas under arcing, play the arc extinguishing effect, and reduce the contact surface temperature.Can also increase simultaneously the viscosity of contact surface metal bath, reduce bath splash tendency, thereby reduce the material damage of contact surface, increase the contact life-span.
Based on above analysis, this Cu/Ti3SiC2 contact material provided by the invention, visual application working condition suitably adopts a kind of or wherein several mixing in diamond, graphite, silver, lanthanum, cerium, dysprosium, samarium, yttrium, ytterbium, zirconium, aluminium, chromium, niobium, tin, zinc, tungsten, vanadium, tin oxide, cadmium oxide, the indium oxide, to improve correlated performance.
Because the wettability of Ti3SiC2 particle and copper is bad, be difficult to form firm interface and combine with the copper matrix, cause its excellent performance to be not in full use.Therefore take following technology, to guarantee giving full play to of its excellent properties.
A kind of its preparation technology of Cu/Ti3SiC2 contact material of the present invention is as follows:
(1) with Ti3SiC2 powder and pure copper powder or copper alloy powder under protective atmosphere, ball milling 6～12h obtains mixed-powder on high energy ball mill;
(2) mixed-powder that is obtained is put into graphite jig and made the bulk sample of diameter 50mm, be referred to as stock by the method for hot pressing.Concrete hot pressing system is: under the protective atmosphere, and 850～950 ℃ of hot pressing temperatures, temperature retention time 30～60min, hot pressing pressure is 40～200MPa;
(3) stock after the hot pressing is referred to as extrudate at 700～900 ℃ of following hot extrusion moldings;
(4) extrudate carries out Ageing Treatment under vacuum or protective atmosphere, 500～800 ℃ of treatment temperatures, 1～5 hour processing time;
(5) will carry out machining by product size through after the section rolling of Ageing Treatment or the drawing processing.
Embodiment 1
Form proportioning, percentage by weight:
Ti3SiC2 powder (particle mean size 5 μ m): 0.8%;
Copper: surplus.
Performance:
Resistivity: 1.98 μ Ω cm;
Density: 8.60/cm
3
Hardness: HB 500～650MPa.
Embodiment 2
Form proportioning, percentage by weight:
Ti3SiC2 powder (particle mean size 5 μ m): 1.0%;
Bortz powder: (particle mean size 1 μ m): 0.6%
Copper: surplus.
Performance:
Resistivity: 2.15 μ Ω cm;
Density: 8.65/cm
3
Hardness: HB 500～650MPa.
Embodiment 3
Form proportioning, percentage by weight:
Ti3SiC2 (particle mean size 6 μ m): 1.2%;
Silver: 0.18%;
Copper: surplus.
Performance:
Resistivity: 2.05 μ Ω cm;
Density: 8.55/cm
3
Hardness: HB 600～750MPa.
Embodiment 4
Form proportioning, percentage by weight:
Ti3SiC2 powder (particle mean size 7 μ m): 20.0%;
Lanthanum: 1.84%;
Copper: surplus.
Performance:
Resistivity: 3.15 μ Ω cm;
Density: 8.52/cm
3
Hardness: HB 750～900MPa.
Embodiment 5
Form proportioning, percentage by weight:
Ti3SiC2 powder (particle mean size 8 μ m): 1.0%;
Lanthanum: 0.14%;
Zirconium: 0.025%;
Aluminium: 0.12%;
Copper: surplus.
Performance:
Resistivity: 2.10 μ Ω cm;
Density: 8.58/cm
3
Hardness: HB 750～1000MPa.
Embodiment 6
Form proportioning, percentage by weight:
Ti3SiC2 powder (particle mean size 9 μ m): 2.0%;
Tin oxide: 8.0%;
Copper: surplus.
Performance:
Resistivity: 2.55 μ Ω cm;
Density: 8.48/cm
3
Hardness: HB 750～1000MPa.
Embodiment 7
Form proportioning, percentage by weight:
Ti3SiC2 powder (particle mean size 10 μ m): 0.18%;
Niobium: 1.56%;
Copper: surplus.
Performance:
Resistivity: 2.20 μ Ω cm;
Density: 8.6/cm
3
Hardness: HB 650～800MPa.
Embodiment 8
With embodiment 1 is example, and its preparation technology is:
(1) with 0.8kgTi3SiC2 powder and 99.2kg pure copper powder under protective atmosphere, ball milling 12h obtains mixed-powder on high energy ball mill;
(2) mixed-powder that is obtained is put into graphite jig and made the bulk sample of diameter 50mm, be referred to as stock by the method for hot pressing.Concrete hot pressing system is: under protective atmosphere, and 900 ℃ of hot pressing temperatures, temperature retention time 60min, hot pressing pressure is 40MPa;
(3) stock after the hot pressing is referred to as extrudate at 850 ℃ of following hot extrusion moldings;
(4) extrudate carries out Ageing Treatment under vacuum condition, 800 ℃ of treatment temperatures, 2 hours processing times;
(5) will become sheet material through the section rolling of Ageing Treatment, carry out machining by product size.
Claims (5)
1. a Cu/Ti3SiC2 contact material is to be 0.01～80.0% Ti3SiC2 powder by pure copper powder or copper alloy powder and percentage by weight, by the preparation of powder metallurgical technique method.
2. a kind of Cu/Ti3SiC2 contact material according to claim 1 is characterized in that: described Ti3SiC2 powder purity greater than 93%, particle size 0.01～50 μ m.
3. a kind of Cu/Ti3SiC2 contact material according to claim 1 is characterized in that: described pure copper powder granularity is-200 orders.
4. a kind of Cu/Ti3SiC2 contact material according to claim 1, it is characterized in that: it is a kind of or wherein several mixing in 0.01～50% diamond, graphite, silver, lanthanum, cerium, dysprosium, samarium, yttrium, ytterbium, zirconium, aluminium, chromium, niobium, tin, zinc, tungsten, vanadium, tin oxide, cadmium oxide, the indium oxide that described copper alloy powder contains percentage by weight, and granularity is-200 orders.
5. Cu/Ti3SiC2 contact material, its preparation technology is as follows:
(1) with Ti3SiC2 powder and pure copper powder or copper alloy powder under protective atmosphere, ball milling 6～12h obtains mixed-powder on high energy ball mill;
(2) mixed-powder that is obtained is put into graphite jig and made the bulk sample of diameter 50mm, be referred to as stock by the method for hot pressing; Concrete hot pressing system is: under the protective atmosphere, and 850～950 ℃ of hot pressing temperatures, temperature retention time 30～60min, hot pressing pressure is 40～200MPa;
(3) stock after the hot pressing is referred to as extrudate at 700～900 ℃ of following hot extrusion moldings;
(4) extrudate carries out Ageing Treatment under vacuum or protective atmosphere, 500～800 ℃ of treatment temperatures, 1～5 hour processing time;
(5) will carry out machining by product size through after the section rolling of Ageing Treatment or the drawing processing.
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| CN103100715B (en) * | 2013-01-18 | 2017-06-06 | 中南大学 | A kind of processing method of Beryllium copper plate strip for secondary electronic emission |
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| CN104282448A (en) * | 2013-08-11 | 2015-01-14 | 济南大学 | Arc ablation resistance copper-based electrical contact composite material |
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