CN101345142B - Electrical contact material with Ti3SiC2 multi-layer compound structure and preparation technique - Google Patents
Electrical contact material with Ti3SiC2 multi-layer compound structure and preparation technique Download PDFInfo
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- CN101345142B CN101345142B CN2008101369978A CN200810136997A CN101345142B CN 101345142 B CN101345142 B CN 101345142B CN 2008101369978 A CN2008101369978 A CN 2008101369978A CN 200810136997 A CN200810136997 A CN 200810136997A CN 101345142 B CN101345142 B CN 101345142B
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- silver
- ti3sic2
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- layer
- acid bronze
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- 229910009817 Ti3SiC2 Inorganic materials 0.000 title claims abstract description 67
- 239000000463 material Substances 0.000 title claims abstract description 65
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 150000001875 compounds Chemical group 0.000 title claims description 24
- 238000000034 method Methods 0.000 title claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 55
- 229910052802 copper Inorganic materials 0.000 claims abstract description 54
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 51
- 239000000956 alloy Substances 0.000 claims abstract description 51
- 239000002131 composite material Substances 0.000 claims abstract description 40
- 229910052709 silver Inorganic materials 0.000 claims abstract description 40
- 239000004332 silver Substances 0.000 claims abstract description 40
- 229910000679 solder Inorganic materials 0.000 claims abstract description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910000906 Bronze Inorganic materials 0.000 claims description 46
- 239000002253 acid Substances 0.000 claims description 46
- 239000000843 powder Substances 0.000 claims description 14
- 229910003460 diamond Inorganic materials 0.000 claims description 13
- 239000010432 diamond Substances 0.000 claims description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 10
- 239000011135 tin Substances 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 229910003437 indium oxide Inorganic materials 0.000 claims description 7
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 7
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 7
- 229910001887 tin oxide Inorganic materials 0.000 claims description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 claims description 6
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 claims description 6
- 229910052746 lanthanum Inorganic materials 0.000 claims description 6
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000003723 Smelting Methods 0.000 claims description 4
- 230000032683 aging Effects 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000005554 pickling Methods 0.000 claims description 4
- 238000007750 plasma spraying Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 230000003746 surface roughness Effects 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 3
- 229910052772 Samarium Inorganic materials 0.000 claims description 3
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 3
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims description 3
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 claims description 3
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims 1
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 238000010891 electric arc Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 abstract 12
- 239000002344 surface layer Substances 0.000 abstract 2
- 238000005461 lubrication Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000011159 matrix material Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002679 ablation Methods 0.000 description 3
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 3
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 3
- 229940112669 cuprous oxide Drugs 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 235000006708 antioxidants Nutrition 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000003026 anti-oxygenic effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 238000004663 powder metallurgy Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Abstract
The invention aims at providing an electric contact material Ti3SiC2 and a preparation method used for the electric contact material Ti3SiC2, wherein, the electric contact material Ti3SiC2 is provided with a multi-layer composite structure with self-lubrication performance and has the advantages of high-strength, high conductivity, high thermal conductivity, melt welding resistance and electric arc burning resistance. The electric contact material Ti3SiC2 with the multi-layer composite structure is composed of four layers as follows: the first layer (surface layer) is Ti3SiC2 of 3 to 1000 microns thick, the second layer (auxiliary layer) is a silver-based alloy of 1 to 500 microns thick, the third layer (substrate) is a copper-based alloy and the fourth layer (welding layer) is solder of 0.03 to 0.10mm thick. The invention discloses the electric contact material Ti3SiC2 with the multi-layer composite structure, which adopts reasonable configuration of multi-layers of the Ti3SiC2/ silver-based alloy /copper based alloy/ solder, takes the TiSiC2 layer as the surface layer, and has the excellent characteristics such as high strength, good conductivity, good thermal conductivity, goodmelt welding resistance, good electric arc burning resistance, good corrosion resistance, good thermal-vibration resistance, good oxidation resistance and particularly good high-temperature oxidationresistance, etc.
Description
(1) technical field
The present invention relates to powdered metallurgical material, is exactly a kind of Ti3SiC2 multi-layer compound structure electrical contact material and preparation technology thereof specifically.
(2) background technology
In recent years, constantly release the novel mold cased circuit breaker and the small-sized high score circuit breaker of various series both at home and abroad, these novel circuit breaker volumes are littler, and breaking capacity but increases substantially.Novel breaker is except adopting a series of new current limiting techniques to improve the breaking capacity, and to the anti-melting welding of used electrical contact, anti-electrical arc erosion and electric life are all had higher requirement.
In present disclosed patent and the contact material used, a class is to be the Ag-based electrical contact material of principal component with silver, and another kind of is to be the copper-based electrical contact material of principal component with copper.With silver is the Ag-based electrical contact material good electrical property of principal component, the cost height, and performance can not satisfy the specific (special) requirements of high-grade novel electric equipment products under some working condition.With copper be the copper-based electrical contact of principal component the cost of material is low, though electrical property can satisfy instructions for use, but still have much room for improvement.
(3) summary of the invention
The object of the present invention is to provide a kind of high-strength, high conduction, high heat conduction, resistance to oxidation, anti-melting welding, anti-electrical arc erosion, have the Ti3SiC2 multi-layer compound structure electrical contact material and the preparation technology thereof of self-lubricating property.
The object of the present invention is achieved like this: described Ti3SiC2 multi-layer compound structure electrical contact material is made of following four layers of material:
Ground floor is the Ti3SiC2 of thickness 3～1000 μ m;
The second layer is silver or the silver-base alloy of thickness 1～500 μ m;
The 3rd layer is copper or acid bronze alloy;
The 4th layer is thickness 0.03～0.10mm solder;
The preparation method of described Ti3SiC2 multi-layer compound structure electrical contact material is as follows:
(1) described copper or acid bronze alloy, silver or silver-base alloy are by powder metallurgic method, through mixing powder, compacting, sintering, pushing, be rolled into the sheet material of required specification;
(2) solder with smelting process, be rolled into the band that thickness is 0.05～0.15mm;
(3) copper or acid bronze alloy sheet material, silver or silver-base alloy sheet material are carried out surface treatment, making surface roughness is 2.5～13 μ m Ra;
(4) adopt the hot pressing composite algorithm to carry out compound copper or acid bronze alloy sheet material, silver or silver-base alloy sheet material;
(5) under protective atmosphere, in 700～900 ℃, sintering 1～3 hour gets composite board;
(6) adopt brush to cover or plasma spraying sprays to the Ti3SiC2 powder on the silver or the silver-base alloy surface of composite board;
(7) above-mentioned composite board is in 100Pa～10 * 10
-4Pa, temperature are to be incubated 10～90min under 800～900 ℃ of conditions, obtain Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy composite board;
(8) with above-mentioned Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy composite board after pickling, adopt hot application that the copper of composite board or acid bronze alloy face and solder band is compound, obtain Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy/solder composite board;
(9) Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy/solder composite board carries out Ageing Treatment under vacuum or protective atmosphere, 400～500 ℃ of treatment temperatures, 1～5 hour processing time;
(10) Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy/solder composite board is rolling to given size, and carries out machining by the contact size.
Ti3SiC2 multi-layer compound structure electrical contact material of the present invention also has following technical characterictic:
(1) described Ti3SiC2 is made greater than 93% Ti3SiC2 powder by purity, and the Ti3SiC2 particle size is 0.01～50 μ m.
(2) described silver-base alloy contains that to account for whole silver-base alloy percentage by weight be one or more mixing in 0.01～50% tungsten, molybdenum, copper, nickel, cadmium oxide, zinc oxide, tin oxide, indium oxide, tungsten carbide, diamond, the graphite.
(3) described acid bronze alloy contains that to account for whole acid bronze alloy percentage by weight be a kind of or wherein several mixing in 0.01～50% diamond, graphite, silver, lanthanum, cerium, dysprosium, samarium, yttrium, ytterbium, zirconium, aluminium, chromium, niobium, tin, zinc, tungsten, vanadium, tin oxide, cadmium oxide, the indium oxide.
(4) described solder contains that to account for whole solder percentage by weight be that 3.5～4.5% tin, 0～31% silver, 1.5～17% zinc, 0～5.2% phosphorus, surplus are copper.
A kind of Ti3SiC2 multi-layer compound structure of the present invention electrical contact material, the reasonable disposition of Ti3SiC2/ silver-base alloy/acid bronze alloy/solder sandwich construction, with Ti3SiC2 is the top layer, intensity height not only, and possess good electrical conductivity, thermal conductivity, good characteristic such as anti-melting welding, arc ablation resistance, corrosion-resistant, anti-thermal shock, anti-oxidant especially high-temperature oxidation resistance.Particularly the ultralow coefficient of friction and the self lubricity of this material are one of indispensable characteristics of contact material.Can be widely used in the low-voltage electrical apparatus contact material, as circuit breaker and probe of contactor.
(4) embodiment
Below the invention will be further described.
A kind of Ti3SiC2 multi-layer compound structure of the present invention electrical contact material is made of following four layers of material:
Ground floor (top layer) is the Ti3SiC2 of thickness 3～1000 μ m;
The second layer (auxiliary layer) is the silver-base alloy of thickness 1～500 μ m;
The 3rd layer (matrix) is copper base base alloy;
The 4th layer (weld layer) is thickness 0.03～0.10mm solder.
Ti3SiC2 belongs to hexagonal crystallographic texture, and the Si layer that the TiC octahedron of common rib is formed by the Si atom is separated, and forms special nanoscale layer laminated structure.This structure is given its image-stone China ink and is equally had lubrification and machinability, combines many premium properties of metal and pottery.The Ti3SiC2 fusing point has fabulous conductivity, thermal conductivity up to 3000 ℃, and its conductivity and simple metal are suitable, and conductance reaches 4.7 * 10 in the time of 25 ℃
6Sm
-1, thermal conductivity reaches 33.5Wm
-1K
-1In addition, the high strength that Ti3SiC2 possessed, anti-thermal shock, corrosion-resistant, anti-oxidant, especially high temperature oxidation resistance and anti-cyclic oxidation ability and characteristics such as self lubricity and ultralow coefficient of friction are the ideal material of low-voltage electrical apparatus with contact, therefore elect the top layer as.
Diamond is the highest material of occurring in nature thermal conductivity, and thermal conductivity reaches 138.16Wm
-1K
-1Have performances such as fusing point height (about 3700 ℃), hardness be big, wear-resistant simultaneously, adopt powder metallurgy process in silver, to add tiny diamond particles, not only can play dispersion-strengthened action, improve the effect of hardness and resistance to wear, also the heat that electric arc is produced conducts to crane span structure, reduces the contact surface temperature.The diamond particles of what is more important contact surface is burnt when beating arc, does not produce the deposit that causes resistance to increase in contact surface.
Other silver-base alloy of the present invention, can guarantee still can guarantee the contact operate as normal under the excessive situation of top layer loss as auxiliary layer for being in the silver based contact material of application state.
Add adamantine effect in the copper and be equal to and add diamond in the silver, can also function as follows simultaneously: under the high-temperature electric arc effect, it is metallic copper or cuprous oxide that the carbon monoxide that the diamond burning produces can make the copper oxide reduction of contact surface.Therefore, under the oxidized situation of contact surface, can change the structure of oxide layer by diamond and cuprous oxide.Cuprous oxide is the powdery film, helps guaranteeing that contact has sufficient rectified action.Add a spot of silver in the copper and, can improve its intensity, hardness, increase that electricity is led, thermal conductance and corrosion resistance, improve mobile and wettability is also improved the cold and hot working performance through excessive deformation process.An amount of alloying element that adds lanthanum, cerium, dysprosium, samarium, ytterbium, yttrium as copper in copper can improve the oxidation resistance of acid bronze alloy low temperature and high temperature, improves the intensity and the recrystallization temperature of acid bronze alloy, and conductivity is slightly improved.In copper, add zirconium, chromium, aluminium in right amount and can improve the medium and high temperature oxidation resistance of copper-based material, anti-ablation property and decay resistance.Aluminium, tin, zinc can reduce contact temperature and have the arc extinguishing effect as contact material the time by its vaporization.Chromium, niobium, tungsten, vanadium solid solubility in the copper matrix is extremely low, and the adding of these elements has certain effect to antioxygenic property, intensity and the anti-ablation property tool that improves matrix.The adding of such alloy also can improve recrystallization temperature.Can increase simultaneously the viscosity of contact surface formed metal bath under arcing, reduce the material damage of contact material, thereby increase the electric life of contact.
The effect that adds cadmium oxide, tin oxide and indium oxide in the copper matrix is: cadmium oxide, tin oxide and indium oxide flash to gas under arcing, play the arc extinguishing effect, and reduce the contact surface temperature.Can also increase simultaneously the viscosity of contact surface metal bath, reduce bath splash tendency, thereby reduce the material damage of contact surface, increase the contact life-span.
Based on above analysis, acid bronze alloy is as basis material, can guarantee that contact still can operate as normal under the excessive situation of top layer and auxiliary layer loss.
Weld layer can improve the contact welding efficiency, reduces cost of labor.
The preparation technology of a kind of Ti3SiC2 multi-layer compound structure of the present invention electrical contact material is as follows:
(1) described acid bronze alloy and silver-base alloy are by powder metallurgic method, through mixing powder, compacting, sintering, pushing, be rolled into the sheet material of required specification;
(2) solder with smelting process, be rolled into the band that thickness is 0.05～0.15mm;
(3) acid bronze alloy sheet material and silver-base alloy sheet material are carried out surface treatment, making surface roughness is 2.5～13 μ m Ra;
(4) adopt the hot pressing composite algorithm to carry out compound acid bronze alloy sheet material and silver-base alloy sheet material;
(5) under protective atmosphere,, sintering 1-3 hour, obtain the silver-bearing copper composite board in 700-900 ℃;
(6) adopt brush to cover or plasma spraying sprays to the Ti3SiC2 powder on the money base surface of silver-bearing copper composite board;
(7) above-mentioned sheet material is 100～10 * 10
-4Pa, temperature are to be incubated 10～90min under 800～900 ℃ of conditions, obtain Ti3SiC2/ silver-base alloy/acid bronze alloy composite board;
(8) with above-mentioned Ti3SiC2/ silver-base alloy/acid bronze alloy composite board after pickling, adopt hot application that the copper basal plane and the solder band of composite board is compound, obtain Ti3SiC2/ silver-base alloy/acid bronze alloy/solder composite board;
(9) Ti3SiC2/ silver-base alloy/acid bronze alloy/solder composite board carries out Ageing Treatment under vacuum or protective atmosphere, 400～500 ℃ of treatment temperatures, 1～5 hour processing time;
(10) Ti3SiC2/ silver-base alloy/acid bronze alloy/solder composite board is rolling to given size, and carries out machining by the contact size.
Embodiment 1
Top layer: Ti3SiC2, thickness 120 μ m;
Auxiliary layer: diamond 0.8%, silver-colored surplus, thickness 200 μ m;
Matrix: fine copper, thickness 1.4mm;
Weld layer: tin 3.5%, silver 5.0%, zinc 2.0%, phosphorus 4.3%, copper surplus, thickness 0.1mm.
Embodiment 2
Top layer: Ti 3SiC2, thickness 400 μ m;
Auxiliary layer: zinc oxide 8.0%, silver-colored surplus, thickness 400 μ m;
Matrix: lanthanum 2%, copper surplus, thickness 1.1mm;
Weld layer: tin 4.0%, silver 5.0%, zinc 2.2%, phosphorus 4.5%, copper surplus, thickness 0.1mm.
Embodiment 3
Top layer: Ti3SiC2, thickness 200 μ m;
Auxiliary layer: tin oxide 8.0%, indium oxide 4.0%, silver-colored surplus, thickness 250 μ m;
Matrix: diamond 1.3%, lanthanum 0.5%, copper surplus, thickness 1.1mm;
Weld layer: tin 4.5%, silver 5.2%, zinc 2.0%, phosphorus 5.0%, copper surplus, thickness 0.1mm.
Embodiment 4
Top layer: Ti3SiC2, thickness 150 μ m;
Auxiliary layer: zinc oxide 10.0%, silver-colored surplus, thickness 50 μ m;
Matrix: aluminium 0.12%, lanthanum 0.34%, zirconium 0.05, copper surplus, thickness 1.1mm;
Weld layer: tin 4.5%, silver 5.2%, zinc 2.0%, phosphorus 5.0%, copper surplus, thickness 0.1mm.
Embodiment 5
Top layer: Ti3SiC2, thickness 270 μ m;
Auxiliary layer: 0.8% diamond, silver-colored surplus, thickness 360 μ m;
Matrix: niobium 1.5%, zirconium 0.05%, copper surplus, thickness 1.08mm;
Weld layer: tin 4.5%, silver 30%, zinc 1 5%, copper surplus, thickness 0.09mm.
Embodiment 6
With embodiment 5 is example, and its preparation technology is as follows:
(1) acid bronze alloy and silver-base alloy are pressed powder metallurgic method,, be rolled into the sheet material that thickness is 1.2mm and 0.40mm respectively through mixing powder, compacting, sintering, extruding.
(2) solder with smelting process, be rolled into the band that thickness is 0.10mm.
(3) acid bronze alloy and silver-base alloy sheet material are carried out surface treatment, making surface roughness is 5 μ m Ra.
(4) it is compound acid bronze alloy sheet material and silver-base alloy sheet material to be carried out hot pressing, obtains the silver-bearing copper composite board.
(5) under argon shield, in 900 ℃, sintering 3 hours.
(6) adopt plasma spraying that Ti3SiC2 cermet powder is sprayed to above-mentioned sheet material money base surface, thickness is 300 μ m, obtains Ti3SiC2/ silver-base alloy/acid bronze alloy composite board.
(7) with above-mentioned Ti3SiC2/ silver-base alloy/acid bronze alloy composite board 100 * 10
-4Pa, temperature are to be incubated 90min under 850 ℃ of conditions.
(8) with the Ti3SiC2/ silver-base alloy/acid bronze alloy composite board of above-mentioned processing after pickling, adopt hot application that the copper basal plane and the solder band of Ti3SiC2/ silver-base alloy/acid bronze alloy composite board is compound, obtain Ti3SiC2/ silver-base alloy/acid bronze alloy/solder composite sheet material.
(9) Ti3SiC2/ silver-base alloy/acid bronze alloy/solder composite sheet material carries out Ageing Treatment under vacuum, 450 ℃ of treatment temperatures, 2 hours processing times.
(10) with Ti3SiC2/ silver-base alloy/acid bronze alloy/solder composite plate rolling to 1.80mm, and carry out machining by the contact size.
Claims (5)
1. Ti3SiC2 multi-layer compound structure electrical contact material is made of following four layers of material:
Ground floor is the Ti3SiC2 of thickness 3～1000 μ m;
The second layer is silver or the silver-base alloy of thickness 1～500 μ m;
The 3rd layer is copper or acid bronze alloy;
The 4th layer is thickness 0.03～0.10mm solder;
The preparation method of described Ti3SiC2 multi-layer compound structure electrical contact material is as follows:
(1) described copper or acid bronze alloy, silver or silver-base alloy are by powder metallurgic method, through mixing powder, compacting, sintering, pushing, be rolled into the sheet material of required specification;
(2) solder with smelting process, be rolled into the band that thickness is 0.05～0.15mm;
(3) copper or acid bronze alloy sheet material, silver or silver-base alloy sheet material are carried out surface treatment, making surface roughness is 2.5～13 μ m Ra;
(4) adopt the hot pressing composite algorithm to carry out compound copper or acid bronze alloy sheet material, silver or silver-base alloy sheet material;
(5) under protective atmosphere, in 700～900 ℃, sintering 1～3 hour gets composite board;
(6) adopt brush to cover or plasma spraying sprays to the Ti3SiC2 powder on the silver or the silver-base alloy surface of composite board;
(7) above-mentioned composite board is in 100Pa～10 * 10
-4Pa, temperature are to be incubated 10～90min under 800～900 ℃ of conditions, obtain Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy composite board;
(8) with above-mentioned Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy composite board after pickling, adopt hot application that the copper of composite board or acid bronze alloy face and solder band is compound, obtain Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy/solder composite board;
(9) Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy/solder composite board carries out Ageing Treatment under vacuum or protective atmosphere, 400～500 ℃ of treatment temperatures, 1～5 hour processing time;
(10) Ti3SiC2/ silver or silver-base alloy/copper or acid bronze alloy/solder composite board is rolling to given size, and carries out machining by the contact size.
2. Ti3SiC2 multi-layer compound structure electrical contact material according to claim 1 is characterized in that: described Ti3SiC2 is made greater than 93% Ti3SiC2 powder by purity, and the Ti3SiC2 particle size is 0.01～50 μ m.
3. Ti3SiC2 multi-layer compound structure electrical contact material according to claim 1 is characterized in that: described silver-base alloy contains that to account for whole silver-base alloy percentage by weight be one or more mixing in 0.01～50% tungsten, molybdenum, copper, nickel, cadmium oxide, zinc oxide, tin oxide, indium oxide, tungsten carbide, diamond, the graphite.
4. Ti3SiC2 multi-layer compound structure electrical contact material according to claim 1 is characterized in that: described acid bronze alloy contains that to account for whole acid bronze alloy percentage by weight be a kind of or wherein several mixing in 0.01～50% diamond, graphite, silver, lanthanum, cerium, dysprosium, samarium, yttrium, ytterbium, zirconium, aluminium, chromium, niobium, tin, zinc, tungsten, vanadium, tin oxide, cadmium oxide, the indium oxide.
5. Ti3SiC2 multi-layer compound structure electrical contact material according to claim 1 is characterized in that: described solder contains that to account for whole solder percentage by weight be that 3.5～4.5% tin, 0～31% silver, 1.5～17% zinc, 0～5.2% phosphorus, surplus are copper.
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