CN101343345B - 聚氨酯树脂、含有其的热固性树脂组合物及其固化物 - Google Patents

聚氨酯树脂、含有其的热固性树脂组合物及其固化物 Download PDF

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Publication number
CN101343345B
CN101343345B CN200810130575XA CN200810130575A CN101343345B CN 101343345 B CN101343345 B CN 101343345B CN 200810130575X A CN200810130575X A CN 200810130575XA CN 200810130575 A CN200810130575 A CN 200810130575A CN 101343345 B CN101343345 B CN 101343345B
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hydroxyl group
compound
phenolic hydroxyl
thermosetting resin
resin composition
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CN200810130575XA
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Chinese (zh)
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CN101343345A (zh
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峰岸昌司
米田一善
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/54—Polycondensates of aldehydes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/247—Heating methods
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN200810130575XA 2007-07-10 2008-07-10 聚氨酯树脂、含有其的热固性树脂组合物及其固化物 Active CN101343345B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007181398A JP4709188B2 (ja) 2007-07-10 2007-07-10 ウレタン樹脂、それを含有する熱硬化性樹脂組成物及びその硬化物
JP2007-181398 2007-07-10
JP2007181398 2007-07-10

Publications (2)

Publication Number Publication Date
CN101343345A CN101343345A (zh) 2009-01-14
CN101343345B true CN101343345B (zh) 2011-11-02

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CN200810130575XA Active CN101343345B (zh) 2007-07-10 2008-07-10 聚氨酯树脂、含有其的热固性树脂组合物及其固化物

Country Status (4)

Country Link
JP (1) JP4709188B2 (enrdf_load_stackoverflow)
KR (1) KR100981814B1 (enrdf_load_stackoverflow)
CN (1) CN101343345B (enrdf_load_stackoverflow)
TW (1) TWI392694B (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5552749B2 (ja) * 2009-02-25 2014-07-16 宇部興産株式会社 硬化性樹脂組成物
JP5901141B2 (ja) * 2010-05-17 2016-04-06 昭和電工株式会社 発光素子用実装基板、発光素子用実装基板の製造方法、発光装置及び発光装置の製造方法並びに白色樹脂組成物
JP5398754B2 (ja) * 2011-02-04 2014-01-29 太陽ホールディングス株式会社 ウレタン樹脂、それを含有する熱硬化性樹脂組成物及びその硬化物
CN102352154B (zh) * 2011-10-25 2014-01-15 珠海光纬金电科技有限公司 抗静电绝缘黑色油墨
CN102675588B (zh) * 2012-05-23 2013-09-04 福建越特新材料科技有限公司 一种抗菌防霉tdi记忆聚氨酯泡沫的制备方法
JP5670533B1 (ja) * 2013-10-16 2015-02-18 台湾太陽油▲墨▼股▲分▼有限公司 熱硬化性樹脂組成物、その硬化物、及びそれを用いたディスプレイ用部材
CN104004344B (zh) * 2014-06-09 2016-05-18 天津信赛科贸有限公司 一种防水灌封材料的制备方法
WO2018101334A1 (ja) * 2016-12-01 2018-06-07 昭和電工株式会社 透明導電基板及びその製造方法
JP6948196B2 (ja) * 2017-09-14 2021-10-13 株式会社クラレ ポリウレタン、研磨層用ポリウレタン成形体及び研磨パッド
PL3892661T3 (pl) * 2020-04-07 2024-12-23 Vito Nv Termoplastyczne poliuretany pochodne monomerów ligninowych
JP7511448B2 (ja) * 2020-11-13 2024-07-05 信越化学工業株式会社 ポリウレタン、ポリウレタンの製造方法、導電性ペースト組成物、導電配線および導電配線の製造方法
KR20250106315A (ko) * 2020-11-20 2025-07-09 신에쓰 가가꾸 고교 가부시끼가이샤 페놀 화합물, 도전성 페이스트 조성물, 도전성 페이스트 조성물의 제조 방법, 도전 배선 및 그 제조 방법
JP7150962B1 (ja) * 2021-10-15 2022-10-11 信越化学工業株式会社 ポリウレタン、ポリウレタンの製造方法、導電性ペースト組成物、導電配線および導電配線の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006033439A1 (en) * 2004-09-21 2006-03-30 Showa Denko K.K. Heat-curable urethane resin composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63287947A (ja) * 1987-05-21 1988-11-25 Fuji Photo Film Co Ltd 感光性組成物
EP0307666A1 (de) * 1987-08-26 1989-03-22 Ciba-Geigy Ag Phenol-terminierte Polyurethane oder Polyharnstoffe und Epoxidharze enthaltend diese Verbindungen
JP3656771B2 (ja) * 1995-11-29 2005-06-08 日立化成工業株式会社 変性ポリアミド樹脂の製造法、その製造法により得られる変性ポリアミド樹脂、これを用いた接着剤及びフィルム
JP2003221496A (ja) * 2002-01-31 2003-08-05 Toyobo Co Ltd 粘弾性樹脂組成物およびそれを用いた複合型制振材料
JP5190976B2 (ja) 2004-09-21 2013-04-24 昭和電工株式会社 ウレタン樹脂を用いた熱硬化性樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006033439A1 (en) * 2004-09-21 2006-03-30 Showa Denko K.K. Heat-curable urethane resin composition

Also Published As

Publication number Publication date
TWI392694B (zh) 2013-04-11
JP2009019081A (ja) 2009-01-29
CN101343345A (zh) 2009-01-14
JP4709188B2 (ja) 2011-06-22
KR20090006011A (ko) 2009-01-14
TW200911867A (en) 2009-03-16
KR100981814B1 (ko) 2010-09-13

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Application publication date: 20090114

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: 2011990000116

Denomination of invention: Polyurethane resin, heat solidifying resin composition containing the same and its solidifying article

Granted publication date: 20111102

License type: Common License

Record date: 20110302

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Assignor: TAIYO HOLDINGS Co.,Ltd.

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Application publication date: 20090114

Assignee: TAIYO INK (SUZHOU) Co.,Ltd.

Assignor: TAIYO HOLDINGS Co.,Ltd.

Contract record no.: X2025990000228

Denomination of invention: Polyurethane resin, heat solidifying resin composition containing the same and its solidifying article

Granted publication date: 20111102

License type: Common License

Record date: 20250609