CN101317277A - 电子零件封装 - Google Patents

电子零件封装 Download PDF

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Publication number
CN101317277A
CN101317277A CNA2006800427636A CN200680042763A CN101317277A CN 101317277 A CN101317277 A CN 101317277A CN A2006800427636 A CNA2006800427636 A CN A2006800427636A CN 200680042763 A CN200680042763 A CN 200680042763A CN 101317277 A CN101317277 A CN 101317277A
Authority
CN
China
Prior art keywords
electrode
led device
ceramic bases
led
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800427636A
Other languages
English (en)
Chinese (zh)
Inventor
李永一
朴淙远
赵允旻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amosense Co Ltd
Original Assignee
Amosense Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amosense Co Ltd filed Critical Amosense Co Ltd
Publication of CN101317277A publication Critical patent/CN101317277A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Led Device Packages (AREA)
CNA2006800427636A 2005-11-18 2006-10-27 电子零件封装 Pending CN101317277A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020050110938A KR100658536B1 (ko) 2005-11-18 2005-11-18 어레이형 반도체 패키지
KR1020050110938 2005-11-18
KR1020050122771 2005-12-13

Publications (1)

Publication Number Publication Date
CN101317277A true CN101317277A (zh) 2008-12-03

Family

ID=37733570

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800427636A Pending CN101317277A (zh) 2005-11-18 2006-10-27 电子零件封装

Country Status (2)

Country Link
KR (1) KR100658536B1 (ko)
CN (1) CN101317277A (ko)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101764191A (zh) * 2010-01-23 2010-06-30 吴锏国 一种led光源的封装基板
CN101847684A (zh) * 2010-04-06 2010-09-29 南昌大学 加强散热的封装电路板及其制造方法
CN102280569A (zh) * 2011-08-22 2011-12-14 佛山市国星光电股份有限公司 高导热基板及led器件及led组件
CN102544310A (zh) * 2010-12-30 2012-07-04 株式会社元素电子 安装基板及其制造方法
CN102779934A (zh) * 2011-05-09 2012-11-14 绿弥利奇株式会社 发光二极管元件
WO2013149411A1 (zh) * 2012-04-01 2013-10-10 深圳市华星光电技术有限公司 带静电防护功能的led灯及用该led灯的背光模组
CN104115567A (zh) * 2011-12-15 2014-10-22 法雷奥电机控制系统公司 至少一个电子部件和完全或部分金属散热器之间的导热且电绝缘链接
CN111446353A (zh) * 2019-01-16 2020-07-24 株式会社辉元 陶瓷发光二极管封装及其制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100967451B1 (ko) * 2008-05-16 2010-07-01 주식회사 이츠웰 고휘도 칩형 발광다이오드 패키지를 이용한 백라이트유니트
KR101015735B1 (ko) 2009-07-02 2011-02-22 삼성전기주식회사 세라믹 적층체 모듈 및 그 제조방법
CN102339933B (zh) * 2011-10-08 2013-04-03 滨州市甘德电子科技有限公司 基于金刚石微观图形结构散热的led

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101764191A (zh) * 2010-01-23 2010-06-30 吴锏国 一种led光源的封装基板
CN101847684A (zh) * 2010-04-06 2010-09-29 南昌大学 加强散热的封装电路板及其制造方法
CN101847684B (zh) * 2010-04-06 2013-07-31 南昌大学 加强散热的封装电路板及其制造方法
CN102544310A (zh) * 2010-12-30 2012-07-04 株式会社元素电子 安装基板及其制造方法
CN102544310B (zh) * 2010-12-30 2015-03-18 株式会社元素电子 安装基板及其制造方法
CN102779934A (zh) * 2011-05-09 2012-11-14 绿弥利奇株式会社 发光二极管元件
CN102280569A (zh) * 2011-08-22 2011-12-14 佛山市国星光电股份有限公司 高导热基板及led器件及led组件
CN102280569B (zh) * 2011-08-22 2013-10-30 佛山市国星光电股份有限公司 高导热基板及led器件及led组件
CN104115567A (zh) * 2011-12-15 2014-10-22 法雷奥电机控制系统公司 至少一个电子部件和完全或部分金属散热器之间的导热且电绝缘链接
WO2013149411A1 (zh) * 2012-04-01 2013-10-10 深圳市华星光电技术有限公司 带静电防护功能的led灯及用该led灯的背光模组
CN111446353A (zh) * 2019-01-16 2020-07-24 株式会社辉元 陶瓷发光二极管封装及其制造方法

Also Published As

Publication number Publication date
KR100658536B1 (ko) 2006-12-15

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SE01 Entry into force of request for substantive examination
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Open date: 20081203