CN101297063B - 处理气体的方法 - Google Patents

处理气体的方法 Download PDF

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Publication number
CN101297063B
CN101297063B CN2006800401532A CN200680040153A CN101297063B CN 101297063 B CN101297063 B CN 101297063B CN 2006800401532 A CN2006800401532 A CN 2006800401532A CN 200680040153 A CN200680040153 A CN 200680040153A CN 101297063 B CN101297063 B CN 101297063B
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CN
China
Prior art keywords
gas
exhaust gas
pump
purge gas
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2006800401532A
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English (en)
Chinese (zh)
Other versions
CN101297063A (zh
Inventor
J·R·史密斯
M·雷多郁
S·J·科斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOC Group Ltd
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BOC Group Ltd
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Publication date
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Publication of CN101297063A publication Critical patent/CN101297063A/zh
Application granted granted Critical
Publication of CN101297063B publication Critical patent/CN101297063B/zh
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4408—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/20—Halogens or halogen compounds
    • B01D2257/204—Inorganic halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2257/00—Components to be removed
    • B01D2257/20—Halogens or halogen compounds
    • B01D2257/206—Organic halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2258/00—Sources of waste gases
    • B01D2258/02—Other waste gases
    • B01D2258/0216—Other waste gases from CVD treatment or semi-conductor manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/80—Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
    • B01D2259/818—Employing electrical discharges or the generation of a plasma
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Treating Waste Gases (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
CN2006800401532A 2005-10-27 2006-09-28 处理气体的方法 Expired - Fee Related CN101297063B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0521944.9 2005-10-27
GBGB0521944.9A GB0521944D0 (en) 2005-10-27 2005-10-27 Method of treating gas
PCT/GB2006/003597 WO2007048995A1 (en) 2005-10-27 2006-09-28 Method of treating gas

Publications (2)

Publication Number Publication Date
CN101297063A CN101297063A (zh) 2008-10-29
CN101297063B true CN101297063B (zh) 2012-07-04

Family

ID=35515848

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800401532A Expired - Fee Related CN101297063B (zh) 2005-10-27 2006-09-28 处理气体的方法

Country Status (8)

Country Link
US (1) US8480861B2 (https=)
EP (1) EP1941073B1 (https=)
JP (1) JP2009513330A (https=)
KR (1) KR20080060254A (https=)
CN (1) CN101297063B (https=)
GB (1) GB0521944D0 (https=)
TW (1) TW200719945A (https=)
WO (1) WO2007048995A1 (https=)

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FR2932059A1 (fr) * 2008-05-28 2009-12-04 Air Liquide Systeme de traitement par plasma d'un fluide ou melange de fluides
CN102089857A (zh) * 2008-07-11 2011-06-08 应用材料公司 用于减弱电子装置制造过程排出物的方法和设备
JP2011163150A (ja) * 2010-02-05 2011-08-25 Toyota Industries Corp 水素ガスの排気方法及び真空ポンプ装置
KR101597008B1 (ko) * 2010-08-05 2016-02-23 가부시키가이샤 에바라 세이사꾸쇼 배기 시스템
KR101230513B1 (ko) * 2010-12-27 2013-02-06 (주)엘오티베큠 배기 유체 처리 장치
JP5877702B2 (ja) * 2011-12-14 2016-03-08 株式会社ニューフレアテクノロジー 成膜装置および成膜方法
GB2501735B (en) * 2012-05-02 2015-07-22 Edwards Ltd Method and apparatus for warming up a vacuum pump arrangement
KR20140107758A (ko) 2013-02-28 2014-09-05 삼성전자주식회사 반응 부산물 처리기 및 반응 부산물의 처리방법과 반응 부산물 처리기를 구비하는 반도체 소자 제조설비
US9630142B2 (en) * 2013-03-14 2017-04-25 Mks Instruments, Inc. Toroidal plasma abatement apparatus and method
JP6153754B2 (ja) * 2013-03-28 2017-06-28 株式会社荏原製作所 除害機能付真空ポンプ
JP6151945B2 (ja) * 2013-03-28 2017-06-21 株式会社荏原製作所 除害機能付真空ポンプ
GB2513300B (en) * 2013-04-04 2017-10-11 Edwards Ltd Vacuum pumping and abatement system
JP6368458B2 (ja) * 2013-05-24 2018-08-01 株式会社荏原製作所 除害機能付真空ポンプ
JP6166102B2 (ja) * 2013-05-30 2017-07-19 株式会社荏原製作所 除害機能付真空ポンプ
GB2515017B (en) * 2013-06-10 2017-09-20 Edwards Ltd Process gas abatement
US20150211114A1 (en) * 2014-01-30 2015-07-30 Applied Materials, Inc. Bottom pump and purge and bottom ozone clean hardware to reduce fall-on particle defects
JP5808454B1 (ja) * 2014-04-25 2015-11-10 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、プログラムおよび記録媒体
KR20220020409A (ko) * 2014-09-12 2022-02-18 어플라이드 머티어리얼스, 인코포레이티드 반도체 프로세싱 장비 유출물의 처리를 위한 제어기
CN104480468A (zh) * 2014-12-31 2015-04-01 深圳市华星光电技术有限公司 干式蚀刻机及用于捕集气体中磁性颗粒的捕集装置
GB2535703B (en) * 2015-02-23 2019-09-18 Edwards Ltd Gas supply apparatus
JP6749090B2 (ja) * 2015-11-12 2020-09-02 東京エレクトロン株式会社 ハロゲン系ガスを用いる処理装置における処理方法
WO2017132186A1 (en) * 2016-01-27 2017-08-03 Mahawali Imad Semiconductor processing system
CN120608873A (zh) 2018-09-28 2025-09-09 朗姆研究公司 避免沉积副产物积聚的真空泵保护
WO2020172179A1 (en) * 2019-02-22 2020-08-27 Applied Materials, Inc. Reduction of br2 and cl2 in semiconductor processes
CN109821657B (zh) * 2019-03-12 2024-03-22 华南理工大学 燃煤电厂电除尘器绝缘子室的吹扫装置
CN114207839B (zh) 2019-06-06 2025-08-29 埃地沃兹真空泵有限责任公司 用于半导体工艺的气体/固体分离的液体过滤装置
CN114341399B (zh) * 2019-09-19 2024-12-17 株式会社国际电气 基板处理装置、基板处理方法、半导体装置的制造方法以及计算机可读记录介质
GB2588906A (en) * 2019-11-13 2021-05-19 Edwards Ltd Gas purged valve
JP7361640B2 (ja) * 2020-03-09 2023-10-16 エドワーズ株式会社 真空ポンプ
US12515169B2 (en) * 2020-06-26 2026-01-06 Zimmer, Inc. Vacuum generation process for deposition of biomedical implant materials
US11931682B2 (en) 2020-09-22 2024-03-19 Edwards Vacuum Llc Waste gas abatement technology for semiconductor processing
US12599860B2 (en) 2021-11-16 2026-04-14 Edwards Vacuum Llc Liquid filter apparatus with thermal shield

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EP1371750A1 (en) * 2002-06-10 2003-12-17 The Boc Group, Inc. Method of recycling fluorine using an adsorption purification process

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Also Published As

Publication number Publication date
US20100071548A1 (en) 2010-03-25
JP2009513330A (ja) 2009-04-02
GB0521944D0 (en) 2005-12-07
CN101297063A (zh) 2008-10-29
US8480861B2 (en) 2013-07-09
WO2007048995A1 (en) 2007-05-03
KR20080060254A (ko) 2008-07-01
EP1941073A1 (en) 2008-07-09
TW200719945A (en) 2007-06-01
EP1941073B1 (en) 2013-04-17

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120704

Termination date: 20130928