CN101269446A - Sn-Zn-Ga-Ce无铅钎料 - Google Patents
Sn-Zn-Ga-Ce无铅钎料 Download PDFInfo
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- CN101269446A CN101269446A CNA2008101007977A CN200810100797A CN101269446A CN 101269446 A CN101269446 A CN 101269446A CN A2008101007977 A CNA2008101007977 A CN A2008101007977A CN 200810100797 A CN200810100797 A CN 200810100797A CN 101269446 A CN101269446 A CN 101269446A
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- solder
- percent
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- alloy
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- 238000005219 brazing Methods 0.000 title claims abstract description 64
- 229910052751 metal Inorganic materials 0.000 title abstract description 14
- 239000002184 metal Substances 0.000 title abstract description 14
- 239000000945 filler Substances 0.000 title abstract description 10
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 22
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 21
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910052709 silver Inorganic materials 0.000 claims abstract description 19
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 18
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000004332 silver Substances 0.000 claims abstract description 16
- 239000004411 aluminium Substances 0.000 claims description 16
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 14
- 239000000203 mixture Substances 0.000 abstract description 17
- 238000005476 soldering Methods 0.000 abstract description 10
- 238000003466 welding Methods 0.000 abstract description 10
- 239000000843 powder Substances 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 8
- 239000011701 zinc Substances 0.000 abstract description 7
- 238000003723 Smelting Methods 0.000 abstract description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 239000007769 metal material Substances 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000005266 casting Methods 0.000 abstract 1
- 238000005457 optimization Methods 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 68
- 229910045601 alloy Inorganic materials 0.000 description 40
- 239000000956 alloy Substances 0.000 description 40
- 238000009736 wetting Methods 0.000 description 25
- 230000004907 flux Effects 0.000 description 16
- 229910020994 Sn-Zn Inorganic materials 0.000 description 15
- 229910009069 Sn—Zn Inorganic materials 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 230000003647 oxidation Effects 0.000 description 8
- 238000007254 oxidation reaction Methods 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 229910017944 Ag—Cu Inorganic materials 0.000 description 7
- 230000003026 anti-oxygenic effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- 150000002910 rare earth metals Chemical class 0.000 description 4
- 229910020816 Sn Pb Inorganic materials 0.000 description 3
- 229910020888 Sn-Cu Inorganic materials 0.000 description 3
- 229910020922 Sn-Pb Inorganic materials 0.000 description 3
- 229910019204 Sn—Cu Inorganic materials 0.000 description 3
- 229910008783 Sn—Pb Inorganic materials 0.000 description 3
- 238000005275 alloying Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020935 Sn-Sb Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910018956 Sn—In Inorganic materials 0.000 description 1
- 229910008757 Sn—Sb Inorganic materials 0.000 description 1
- 229910009070 Sn—Zn—Ag Inorganic materials 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- 229910009078 Sn—Zn—In Inorganic materials 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 229910007570 Zn-Al Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
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Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2008101007977A CN100566913C (zh) | 2008-05-13 | 2008-05-13 | Sn-Zn-Ga-Ce无铅钎料 |
Applications Claiming Priority (1)
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CNB2008101007977A CN100566913C (zh) | 2008-05-13 | 2008-05-13 | Sn-Zn-Ga-Ce无铅钎料 |
Publications (2)
Publication Number | Publication Date |
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CN101269446A true CN101269446A (zh) | 2008-09-24 |
CN100566913C CN100566913C (zh) | 2009-12-09 |
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CNB2008101007977A Expired - Fee Related CN100566913C (zh) | 2008-05-13 | 2008-05-13 | Sn-Zn-Ga-Ce无铅钎料 |
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Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102825396A (zh) * | 2012-09-18 | 2012-12-19 | 金华市双环钎焊材料有限公司 | 含Pr、Ga、Te的Sn-Zn无铅钎料 |
CN102862000A (zh) * | 2012-09-18 | 2013-01-09 | 常熟市华银焊料有限公司 | 含Nd、Ga和Te的Sn-Zn无铅钎料 |
CN103231180A (zh) * | 2013-05-15 | 2013-08-07 | 郑州机械研究所 | 铝合金低温钎焊钎料及其制备方法 |
CN103249519A (zh) * | 2010-12-08 | 2013-08-14 | 住友金属矿山株式会社 | 以Zn为主成分的无Pb焊料合金 |
CN104191101A (zh) * | 2014-08-15 | 2014-12-10 | 郑州机械研究所 | 一种含钯的少缺欠洁净Sn-Zn钎料及其制备方法 |
TWI485027B (zh) * | 2012-11-30 | 2015-05-21 | Hua Eng Wire & Cable Co Ltd | 無鉛錫銀合金鍍層之組合物 |
CN104690441A (zh) * | 2015-02-09 | 2015-06-10 | 深圳市兴鸿泰锡业有限公司 | 焊锡丝及焊锡丝的制备方法 |
CN104690442A (zh) * | 2015-03-17 | 2015-06-10 | 湖南新瑞化工有限公司 | 一种低熔点无铅焊料合金及其制作方法 |
CN105479030A (zh) * | 2016-01-07 | 2016-04-13 | 哈尔滨工业大学 | 活性耐腐蚀SnZn基钎料及其制备方法与低温超声钎焊陶瓷和/或复合材料及铝、镁合金方法 |
CN106141196A (zh) * | 2015-04-20 | 2016-11-23 | 上海亚尔光源有限公司 | 一种锡球颗粒及其制备方法和应用 |
CN112404791A (zh) * | 2020-11-18 | 2021-02-26 | 昆明理工大学 | 一种锡锌系无铅焊料合金及其制备方法 |
CN113714677A (zh) * | 2021-08-30 | 2021-11-30 | 江苏师范大学 | 一种可实现CSP器件高强度互连的Sn基钎料 |
CN113857714A (zh) * | 2021-10-22 | 2021-12-31 | 南京航空航天大学 | 环氧树脂复合Sn-Ag-Cu无铅焊膏 |
CN114871628A (zh) * | 2022-05-31 | 2022-08-09 | 杭州华光焊接新材料股份有限公司 | 一种低银高强度无铅锡基钎料及其制备方法 |
-
2008
- 2008-05-13 CN CNB2008101007977A patent/CN100566913C/zh not_active Expired - Fee Related
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103249519A (zh) * | 2010-12-08 | 2013-08-14 | 住友金属矿山株式会社 | 以Zn为主成分的无Pb焊料合金 |
CN103249519B (zh) * | 2010-12-08 | 2015-04-29 | 住友金属矿山株式会社 | 以Zn为主成分的无Pb焊料合金 |
CN102862000A (zh) * | 2012-09-18 | 2013-01-09 | 常熟市华银焊料有限公司 | 含Nd、Ga和Te的Sn-Zn无铅钎料 |
CN102862000B (zh) * | 2012-09-18 | 2014-12-03 | 常熟市华银焊料有限公司 | 含Nd、Ga和Te的Sn-Zn无铅钎料 |
CN102825396B (zh) * | 2012-09-18 | 2015-06-03 | 金华市双环钎焊材料有限公司 | 含Pr、Ga、Te的Sn-Zn无铅钎料 |
CN102825396A (zh) * | 2012-09-18 | 2012-12-19 | 金华市双环钎焊材料有限公司 | 含Pr、Ga、Te的Sn-Zn无铅钎料 |
TWI485027B (zh) * | 2012-11-30 | 2015-05-21 | Hua Eng Wire & Cable Co Ltd | 無鉛錫銀合金鍍層之組合物 |
CN103231180A (zh) * | 2013-05-15 | 2013-08-07 | 郑州机械研究所 | 铝合金低温钎焊钎料及其制备方法 |
CN103231180B (zh) * | 2013-05-15 | 2015-04-22 | 郑州机械研究所 | 铝合金低温钎焊钎料的制备方法 |
CN104191101B (zh) * | 2014-08-15 | 2016-03-23 | 郑州机械研究所 | 一种含钯的少缺欠洁净Sn-Zn钎料及其制备方法 |
CN104191101A (zh) * | 2014-08-15 | 2014-12-10 | 郑州机械研究所 | 一种含钯的少缺欠洁净Sn-Zn钎料及其制备方法 |
CN104690441A (zh) * | 2015-02-09 | 2015-06-10 | 深圳市兴鸿泰锡业有限公司 | 焊锡丝及焊锡丝的制备方法 |
CN104690442A (zh) * | 2015-03-17 | 2015-06-10 | 湖南新瑞化工有限公司 | 一种低熔点无铅焊料合金及其制作方法 |
CN106141196A (zh) * | 2015-04-20 | 2016-11-23 | 上海亚尔光源有限公司 | 一种锡球颗粒及其制备方法和应用 |
CN105479030A (zh) * | 2016-01-07 | 2016-04-13 | 哈尔滨工业大学 | 活性耐腐蚀SnZn基钎料及其制备方法与低温超声钎焊陶瓷和/或复合材料及铝、镁合金方法 |
CN112404791A (zh) * | 2020-11-18 | 2021-02-26 | 昆明理工大学 | 一种锡锌系无铅焊料合金及其制备方法 |
CN113714677A (zh) * | 2021-08-30 | 2021-11-30 | 江苏师范大学 | 一种可实现CSP器件高强度互连的Sn基钎料 |
CN113714677B (zh) * | 2021-08-30 | 2023-03-14 | 江苏师范大学 | 一种可实现CSP器件高强度互连的Sn基钎料 |
CN113857714A (zh) * | 2021-10-22 | 2021-12-31 | 南京航空航天大学 | 环氧树脂复合Sn-Ag-Cu无铅焊膏 |
CN114871628A (zh) * | 2022-05-31 | 2022-08-09 | 杭州华光焊接新材料股份有限公司 | 一种低银高强度无铅锡基钎料及其制备方法 |
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Publication number | Publication date |
---|---|
CN100566913C (zh) | 2009-12-09 |
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Application publication date: 20080924 Assignee: Jiangsu Photovoltaic Technology Co.,Ltd. Assignor: Nanjing University of Aeronautics and Astronautics Contract record no.: 2014320000119 Denomination of invention: Sn-Zn-Ga-Ce leadless soldering material Granted publication date: 20091209 License type: Exclusive License Record date: 20140303 |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20091209 Termination date: 20180513 |