CN1313631C - 一种锡银铜镍铝系无铅焊料合金 - Google Patents
一种锡银铜镍铝系无铅焊料合金 Download PDFInfo
- Publication number
- CN1313631C CN1313631C CNB2005100873831A CN200510087383A CN1313631C CN 1313631 C CN1313631 C CN 1313631C CN B2005100873831 A CNB2005100873831 A CN B2005100873831A CN 200510087383 A CN200510087383 A CN 200510087383A CN 1313631 C CN1313631 C CN 1313631C
- Authority
- CN
- China
- Prior art keywords
- alloy
- solder alloy
- welding
- welding flux
- weld
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000956 alloy Substances 0.000 title claims abstract description 40
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 39
- 238000003466 welding Methods 0.000 title claims abstract description 37
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 9
- 230000004907 flux Effects 0.000 title claims description 19
- WMGRVUWRBBPOSZ-UHFFFAOYSA-N [Cu].[Ni].[Ag].[Sn] Chemical compound [Cu].[Ni].[Ag].[Sn] WMGRVUWRBBPOSZ-UHFFFAOYSA-N 0.000 title claims description 8
- 239000004411 aluminium Substances 0.000 title claims description 8
- 239000000126 substance Substances 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- 239000004615 ingredient Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 5
- 239000012535 impurity Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 229910052718 tin Inorganic materials 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 abstract description 2
- 239000012776 electronic material Substances 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 6
- 229910020988 Sn—Ag Inorganic materials 0.000 description 6
- 238000003892 spreading Methods 0.000 description 6
- 230000007480 spreading Effects 0.000 description 6
- 229910017944 Ag—Cu Inorganic materials 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 3
- 229910020922 Sn-Pb Inorganic materials 0.000 description 3
- 229910008783 Sn—Pb Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910018082 Cu3Sn Inorganic materials 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100873831A CN1313631C (zh) | 2005-08-02 | 2005-08-02 | 一种锡银铜镍铝系无铅焊料合金 |
PCT/CN2006/001943 WO2007014530A1 (fr) | 2005-08-02 | 2006-08-02 | Alliage de brasage sans plomb contenant un systeme sn-ag-cu-ni-al |
JP2008524347A JP2009502513A (ja) | 2005-08-02 | 2006-08-02 | Sn−Ag−Cu−Ni−Al系無鉛はんだ合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100873831A CN1313631C (zh) | 2005-08-02 | 2005-08-02 | 一种锡银铜镍铝系无铅焊料合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1718797A CN1718797A (zh) | 2006-01-11 |
CN1313631C true CN1313631C (zh) | 2007-05-02 |
Family
ID=35930745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100873831A Expired - Fee Related CN1313631C (zh) | 2005-08-02 | 2005-08-02 | 一种锡银铜镍铝系无铅焊料合金 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2009502513A (zh) |
CN (1) | CN1313631C (zh) |
WO (1) | WO2007014530A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1313631C (zh) * | 2005-08-02 | 2007-05-02 | 马莒生 | 一种锡银铜镍铝系无铅焊料合金 |
US9999945B2 (en) * | 2011-04-08 | 2018-06-19 | Nihon Superior Co., Ltd. | Solder alloy |
JP2017213602A (ja) * | 2016-05-31 | 2017-12-07 | 株式会社日本スペリア社 | はんだ付け方法及びはんだ継手 |
TWI820277B (zh) * | 2018-12-27 | 2023-11-01 | 美商阿爾發金屬化工公司 | 無鉛焊料組成物 |
CN111112870A (zh) * | 2019-12-20 | 2020-05-08 | 深圳市镱豪金属有限公司 | 一种环保锡条 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758407A (en) * | 1987-06-29 | 1988-07-19 | J.W. Harris Company | Pb-free, tin base solder composition |
US4778733A (en) * | 1986-07-03 | 1988-10-18 | Engelhard Corporation | Low toxicity corrosion resistant solder |
US5527628A (en) * | 1993-07-20 | 1996-06-18 | Iowa State University Research Foudation, Inc. | Pb-free Sn-Ag-Cu ternary eutectic solder |
US5863493A (en) * | 1996-12-16 | 1999-01-26 | Ford Motor Company | Lead-free solder compositions |
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
JP2002283093A (ja) * | 2001-03-27 | 2002-10-02 | Toshiba Corp | 非鉛系接合用合金 |
CN1421296A (zh) * | 2001-11-27 | 2003-06-04 | 深圳市格林美环境材料有限公司 | 一种无铅焊料及其制备方法 |
CN1443626A (zh) * | 2003-04-16 | 2003-09-24 | 浙江大学 | 一种具有优越性价比的无铅焊料 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11129091A (ja) * | 1997-10-28 | 1999-05-18 | Ngk Spark Plug Co Ltd | 半田合金 |
MY116246A (en) * | 1999-01-28 | 2003-12-31 | Murata Manufacturing Co | Lead-free solder and soldered article |
CN1313631C (zh) * | 2005-08-02 | 2007-05-02 | 马莒生 | 一种锡银铜镍铝系无铅焊料合金 |
CN100364713C (zh) * | 2005-12-12 | 2008-01-30 | 黄德欢 | 一种Ag-Al-Cu-Ni-Sn系无铅焊锡 |
-
2005
- 2005-08-02 CN CNB2005100873831A patent/CN1313631C/zh not_active Expired - Fee Related
-
2006
- 2006-08-02 JP JP2008524347A patent/JP2009502513A/ja active Pending
- 2006-08-02 WO PCT/CN2006/001943 patent/WO2007014530A1/zh active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4778733A (en) * | 1986-07-03 | 1988-10-18 | Engelhard Corporation | Low toxicity corrosion resistant solder |
US4758407A (en) * | 1987-06-29 | 1988-07-19 | J.W. Harris Company | Pb-free, tin base solder composition |
US5527628A (en) * | 1993-07-20 | 1996-06-18 | Iowa State University Research Foudation, Inc. | Pb-free Sn-Ag-Cu ternary eutectic solder |
US5863493A (en) * | 1996-12-16 | 1999-01-26 | Ford Motor Company | Lead-free solder compositions |
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
JP2002283093A (ja) * | 2001-03-27 | 2002-10-02 | Toshiba Corp | 非鉛系接合用合金 |
CN1421296A (zh) * | 2001-11-27 | 2003-06-04 | 深圳市格林美环境材料有限公司 | 一种无铅焊料及其制备方法 |
CN1443626A (zh) * | 2003-04-16 | 2003-09-24 | 浙江大学 | 一种具有优越性价比的无铅焊料 |
Non-Patent Citations (3)
Title |
---|
Sn-Zn无铅焊料的研究与发展 黎小燕,陈国海,马莒生,电子工艺技术,第25卷第4期 2004 * |
Sn-Zn无铅焊料的研究与发展 黎小燕,陈国海,马莒生,电子工艺技术,第25卷第4期 2004;无铅焊料在清华大学的研究与发展 马营生 陈国海,电子元件与材料,第23卷第11期 2004 * |
无铅焊料在清华大学的研究与发展 马营生 陈国海,电子元件与材料,第23卷第11期 2004 * |
Also Published As
Publication number | Publication date |
---|---|
CN1718797A (zh) | 2006-01-11 |
JP2009502513A (ja) | 2009-01-29 |
WO2007014530A1 (fr) | 2007-02-08 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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Owner name: BEIJING INSTITUTE OF AERONAUTICS + ASTRONAUTICS Free format text: FORMER OWNER: MA JUSHENG Effective date: 20111031 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111031 Address after: 100084 innovation building, Tsinghua Science Park, No. 1, Zhongguancun East Road, Haidian District, Beijing, B1001 Patentee after: Beijing Ada Fang aerospace materials and equipment research and Development Center Address before: 100084 room 2, unit 301, East 8, Tsinghua University, Haidian District Tsinghua Yuan, Beijing Patentee before: Ma Jusheng |
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Addressee: Beijing Ada Fang aerospace materials and equipment research and Development Center Document name: Notification to Pay the Fees |
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DD01 | Delivery of document by public notice |
Addressee: Beijing Ada Fang aerospace materials and equipment research and Development Center Document name: Notification to Pay the Fees |
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DD01 | Delivery of document by public notice |
Addressee: Beijing Ada Fang aerospace materials and equipment research and Development Center Document name: Notification of Termination of Patent Right |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070502 Termination date: 20150802 |
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EXPY | Termination of patent right or utility model |