CN113714677A - 一种可实现CSP器件高强度互连的Sn基钎料 - Google Patents
一种可实现CSP器件高强度互连的Sn基钎料 Download PDFInfo
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- CN113714677A CN113714677A CN202111004674.5A CN202111004674A CN113714677A CN 113714677 A CN113714677 A CN 113714677A CN 202111004674 A CN202111004674 A CN 202111004674A CN 113714677 A CN113714677 A CN 113714677A
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- content
- nanowires
- csp
- submicron particles
- filler metal
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- 238000005219 brazing Methods 0.000 title claims abstract description 44
- 239000000945 filler Substances 0.000 title claims abstract description 44
- 239000002184 metal Substances 0.000 title claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 44
- 239000002070 nanowire Substances 0.000 claims abstract description 66
- 239000002245 particle Substances 0.000 claims abstract description 57
- 229910000679 solder Inorganic materials 0.000 claims abstract description 52
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000002105 nanoparticle Substances 0.000 claims description 4
- 238000003723 Smelting Methods 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 32
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 18
- 229910018471 Cu6Sn5 Inorganic materials 0.000 abstract description 7
- 238000010168 coupling process Methods 0.000 abstract description 4
- 238000005859 coupling reaction Methods 0.000 abstract description 4
- 239000013078 crystal Substances 0.000 abstract description 4
- 238000005728 strengthening Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 8
- 229910017944 Ag—Cu Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910052779 Neodymium Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000001808 coupling effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
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CN202111004674.5A CN113714677B (zh) | 2021-08-30 | 2021-08-30 | 一种可实现CSP器件高强度互连的Sn基钎料 |
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CN202111004674.5A CN113714677B (zh) | 2021-08-30 | 2021-08-30 | 一种可实现CSP器件高强度互连的Sn基钎料 |
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CN113714677A true CN113714677A (zh) | 2021-11-30 |
CN113714677B CN113714677B (zh) | 2023-03-14 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114273816A (zh) * | 2022-01-13 | 2022-04-05 | 郑州机械研究所有限公司 | 一种钎料及其制备方法 |
CN114273814A (zh) * | 2022-01-13 | 2022-04-05 | 郑州机械研究所有限公司 | 一种钎料及其制备方法 |
CN114850729A (zh) * | 2022-03-25 | 2022-08-05 | 郑州机械研究所有限公司 | 一种无镉银钎焊材料 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101269446A (zh) * | 2008-05-13 | 2008-09-24 | 南京航空航天大学 | Sn-Zn-Ga-Ce无铅钎料 |
CN101348875A (zh) * | 2008-06-04 | 2009-01-21 | 厦门市及时雨焊料有限公司 | 一种锡铋铜型低温无铅焊料合金 |
JP2010046700A (ja) * | 2008-08-22 | 2010-03-04 | Toyota Central R&D Labs Inc | 接合体およびその製造方法 |
CN101817127A (zh) * | 2010-05-10 | 2010-09-01 | 哈尔滨工业大学 | 碳纳米管强化Sn-58Bi无铅钎料及其制备方法 |
CN101914735A (zh) * | 2010-07-20 | 2010-12-15 | 南昌大学 | 超声波焊接制备碳纳米管增强铝基复合材料 |
CN105522295A (zh) * | 2016-02-16 | 2016-04-27 | 江苏师范大学 | 一种用于mems器件互连的无铅钎料 |
CN106271183A (zh) * | 2016-08-26 | 2017-01-04 | 江苏师范大学 | Mems器件三维封装互连材料 |
CN108807628A (zh) * | 2018-05-03 | 2018-11-13 | 五邑大学 | 基于晶体Ag纳米线网格的Al掺杂ZnO薄膜及其制备方法 |
CN108927609A (zh) * | 2018-08-13 | 2018-12-04 | 深圳市亿铖达工业有限公司 | 一种复合无铅锡膏的制备方法 |
-
2021
- 2021-08-30 CN CN202111004674.5A patent/CN113714677B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101269446A (zh) * | 2008-05-13 | 2008-09-24 | 南京航空航天大学 | Sn-Zn-Ga-Ce无铅钎料 |
CN101348875A (zh) * | 2008-06-04 | 2009-01-21 | 厦门市及时雨焊料有限公司 | 一种锡铋铜型低温无铅焊料合金 |
JP2010046700A (ja) * | 2008-08-22 | 2010-03-04 | Toyota Central R&D Labs Inc | 接合体およびその製造方法 |
CN101817127A (zh) * | 2010-05-10 | 2010-09-01 | 哈尔滨工业大学 | 碳纳米管强化Sn-58Bi无铅钎料及其制备方法 |
CN101914735A (zh) * | 2010-07-20 | 2010-12-15 | 南昌大学 | 超声波焊接制备碳纳米管增强铝基复合材料 |
CN105522295A (zh) * | 2016-02-16 | 2016-04-27 | 江苏师范大学 | 一种用于mems器件互连的无铅钎料 |
CN106271183A (zh) * | 2016-08-26 | 2017-01-04 | 江苏师范大学 | Mems器件三维封装互连材料 |
CN108807628A (zh) * | 2018-05-03 | 2018-11-13 | 五邑大学 | 基于晶体Ag纳米线网格的Al掺杂ZnO薄膜及其制备方法 |
CN108927609A (zh) * | 2018-08-13 | 2018-12-04 | 深圳市亿铖达工业有限公司 | 一种复合无铅锡膏的制备方法 |
Non-Patent Citations (2)
Title |
---|
MU-LAN LI等: "《Influences of silicon carbide nanowires addition on IMC growth behavior of pure Sn solder during solid-liquid diffusion》", 《RESEARCH SQUARE》 * |
李木兰等: "《纳米颗粒对无铅钎料改性的研究进展》", 《材料导报》 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114273816A (zh) * | 2022-01-13 | 2022-04-05 | 郑州机械研究所有限公司 | 一种钎料及其制备方法 |
CN114273814A (zh) * | 2022-01-13 | 2022-04-05 | 郑州机械研究所有限公司 | 一种钎料及其制备方法 |
CN114273816B (zh) * | 2022-01-13 | 2023-12-01 | 郑州机械研究所有限公司 | 一种钎料及其制备方法 |
CN114850729A (zh) * | 2022-03-25 | 2022-08-05 | 郑州机械研究所有限公司 | 一种无镉银钎焊材料 |
CN114850729B (zh) * | 2022-03-25 | 2023-09-26 | 郑州机械研究所有限公司 | 一种无镉银钎焊材料 |
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CN113714677B (zh) | 2023-03-14 |
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Effective date of registration: 20240511 Address after: Building 5, 5th Floor, Hongxing Erke Group (Xiang'an) Industrial Park, No. 3868-3900 Min'an Avenue, Neicuo Town, Xiang'an District, Xiamen City, Fujian Province, 361000 Patentee after: XIAMEN JISSYU SOLDER Co.,Ltd. Country or region after: China Address before: 221116 No. 101, Shanghai Road, Copper Mt. New District, Jiangsu, Xuzhou Patentee before: Jiangsu Normal University Country or region before: China |
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