CN102825396A - 含Pr、Ga、Te的Sn-Zn无铅钎料 - Google Patents
含Pr、Ga、Te的Sn-Zn无铅钎料 Download PDFInfo
- Publication number
- CN102825396A CN102825396A CN2012103465586A CN201210346558A CN102825396A CN 102825396 A CN102825396 A CN 102825396A CN 2012103465586 A CN2012103465586 A CN 2012103465586A CN 201210346558 A CN201210346558 A CN 201210346558A CN 102825396 A CN102825396 A CN 102825396A
- Authority
- CN
- China
- Prior art keywords
- lead
- solder
- filler metal
- brazing filler
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 63
- 229910052714 tellurium Inorganic materials 0.000 title claims abstract description 53
- 229910020994 Sn-Zn Inorganic materials 0.000 title claims abstract description 51
- 229910009069 Sn—Zn Inorganic materials 0.000 title claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 title abstract description 15
- 239000002184 metal Substances 0.000 title abstract description 15
- 239000000945 filler Substances 0.000 title abstract description 10
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 24
- 229910052777 Praseodymium Inorganic materials 0.000 claims abstract description 17
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 14
- 239000000126 substance Substances 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 abstract description 11
- 230000003026 anti-oxygenic effect Effects 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 10
- 238000003466 welding Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 38
- 239000011135 tin Substances 0.000 description 16
- 239000011701 zinc Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 230000004907 flux Effects 0.000 description 9
- 238000009736 wetting Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 235000006708 antioxidants Nutrition 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 4
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020888 Sn-Cu Inorganic materials 0.000 description 2
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910005642 SnTe Inorganic materials 0.000 description 2
- 229910019204 Sn—Cu Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 229910007709 ZnTe Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210346558.6A CN102825396B (zh) | 2012-09-18 | 2012-09-18 | 含Pr、Ga、Te的Sn-Zn无铅钎料 |
Applications Claiming Priority (1)
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CN201210346558.6A CN102825396B (zh) | 2012-09-18 | 2012-09-18 | 含Pr、Ga、Te的Sn-Zn无铅钎料 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102825396A true CN102825396A (zh) | 2012-12-19 |
CN102825396B CN102825396B (zh) | 2015-06-03 |
Family
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Family Applications (1)
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CN201210346558.6A Active CN102825396B (zh) | 2012-09-18 | 2012-09-18 | 含Pr、Ga、Te的Sn-Zn无铅钎料 |
Country Status (1)
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CN (1) | CN102825396B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109604860A (zh) * | 2019-01-22 | 2019-04-12 | 浙江宇光铝材有限公司 | 一种含Ga、Pr的铝合金焊丝及其制作方法和应用 |
Citations (9)
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CN1337293A (zh) * | 2001-09-05 | 2002-02-27 | 北京工业大学 | 含稀土的锡基无铅钎料及其制备方法 |
US6367683B1 (en) * | 1997-07-10 | 2002-04-09 | Materials Resources International | Solder braze alloy |
CN1390672A (zh) * | 2002-05-10 | 2003-01-15 | 大连理工大学 | 锡锌基含稀土元素的无铅钎料合金 |
CN101269446A (zh) * | 2008-05-13 | 2008-09-24 | 南京航空航天大学 | Sn-Zn-Ga-Ce无铅钎料 |
CN101417375A (zh) * | 2007-10-23 | 2009-04-29 | 北京有色金属研究总院 | 一种电子元件焊接用的无铅焊料合金 |
CN101780607A (zh) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | 一种用于电子封装组装钎焊的无铅钎料及其制备方法 |
CN101817126A (zh) * | 2009-12-23 | 2010-09-01 | 株洲冶炼集团股份有限公司 | 一种锡-锌系无铅焊料及其制备方法 |
CN101862921A (zh) * | 2010-06-25 | 2010-10-20 | 南京航空航天大学 | 含Pr、Sr和Ga的Sn-Cu-Ni无铅钎料 |
CN102581507A (zh) * | 2012-01-19 | 2012-07-18 | 广东中实金属有限公司 | 一种锡锌铋多元共晶无铅钎料及制备方法 |
-
2012
- 2012-09-18 CN CN201210346558.6A patent/CN102825396B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6367683B1 (en) * | 1997-07-10 | 2002-04-09 | Materials Resources International | Solder braze alloy |
CN1337293A (zh) * | 2001-09-05 | 2002-02-27 | 北京工业大学 | 含稀土的锡基无铅钎料及其制备方法 |
CN1390672A (zh) * | 2002-05-10 | 2003-01-15 | 大连理工大学 | 锡锌基含稀土元素的无铅钎料合金 |
CN101417375A (zh) * | 2007-10-23 | 2009-04-29 | 北京有色金属研究总院 | 一种电子元件焊接用的无铅焊料合金 |
CN101269446A (zh) * | 2008-05-13 | 2008-09-24 | 南京航空航天大学 | Sn-Zn-Ga-Ce无铅钎料 |
CN101817126A (zh) * | 2009-12-23 | 2010-09-01 | 株洲冶炼集团股份有限公司 | 一种锡-锌系无铅焊料及其制备方法 |
CN101780607A (zh) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | 一种用于电子封装组装钎焊的无铅钎料及其制备方法 |
CN101862921A (zh) * | 2010-06-25 | 2010-10-20 | 南京航空航天大学 | 含Pr、Sr和Ga的Sn-Cu-Ni无铅钎料 |
CN102581507A (zh) * | 2012-01-19 | 2012-07-18 | 广东中实金属有限公司 | 一种锡锌铋多元共晶无铅钎料及制备方法 |
Non-Patent Citations (2)
Title |
---|
李阳,薛松柏,等: "Sn-Zn-Ga-xPr钎料组织和性能", 《焊接学报》 * |
肖正香,薛松柏,等: "微量元素对Sn-Zn系钎料性能和组织性能的影响", 《焊接机》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109604860A (zh) * | 2019-01-22 | 2019-04-12 | 浙江宇光铝材有限公司 | 一种含Ga、Pr的铝合金焊丝及其制作方法和应用 |
CN109604860B (zh) * | 2019-01-22 | 2021-02-19 | 浙江宇光铝材有限公司 | 一种含Ga、Pr的铝合金焊丝及其制作方法和应用 |
Also Published As
Publication number | Publication date |
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CN102825396B (zh) | 2015-06-03 |
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GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: Sn-Zn leadless brazing filler metal containing Pr, Ga and Te Effective date of registration: 20200117 Granted publication date: 20150603 Pledgee: Bank of Jinhua Limited by Share Ltd. science and Technology Branch Pledgor: JINHUA SHUANGHUAN BRAZING ALLOYS Co.,Ltd. Registration number: Y2020330000047 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20150603 Pledgee: Bank of Jinhua Limited by Share Ltd. science and Technology Branch Pledgor: JINHUA SHUANGHUAN BRAZING ALLOYS Co.,Ltd. Registration number: Y2020330000047 |