CN101189650B - 膜切断剥离用刃具和膜切断剥离装置 - Google Patents
膜切断剥离用刃具和膜切断剥离装置 Download PDFInfo
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- CN101189650B CN101189650B CN200680019307XA CN200680019307A CN101189650B CN 101189650 B CN101189650 B CN 101189650B CN 200680019307X A CN200680019307X A CN 200680019307XA CN 200680019307 A CN200680019307 A CN 200680019307A CN 101189650 B CN101189650 B CN 101189650B
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- 238000005520 cutting process Methods 0.000 title abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 description 48
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- 239000004973 liquid crystal related substance Substances 0.000 description 36
- 239000000203 mixture Substances 0.000 description 9
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/06—Grooving involving removal of material from the surface of the work
- B26D3/065—On sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/006—Cutting members therefor the cutting blade having a special shape, e.g. a special outline, serrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005162927 | 2005-06-02 | ||
JP162927/2005 | 2005-06-02 | ||
PCT/JP2006/310984 WO2006129752A1 (ja) | 2005-06-02 | 2006-06-01 | フィルム切断剥離用刃物およびフィルム切断剥離装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101189650A CN101189650A (zh) | 2008-05-28 |
CN101189650B true CN101189650B (zh) | 2011-06-01 |
Family
ID=37481680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200680019307XA Expired - Fee Related CN101189650B (zh) | 2005-06-02 | 2006-06-01 | 膜切断剥离用刃具和膜切断剥离装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4744517B2 (zh) |
KR (1) | KR101191485B1 (zh) |
CN (1) | CN101189650B (zh) |
WO (1) | WO2006129752A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101869930B1 (ko) * | 2011-11-29 | 2018-06-22 | 삼성디스플레이 주식회사 | 디라미네이션 장치 및 이를 포함하는 인라인 열전사 시스템 |
KR101436806B1 (ko) * | 2012-03-08 | 2014-09-03 | 엘지디스플레이 주식회사 | 디스플레이 장치 및 그의 제조 방법 |
KR20130141208A (ko) * | 2012-06-15 | 2013-12-26 | 삼성전기주식회사 | 캐리어 동박 제거 장치 및 방법 |
CN104932042B (zh) * | 2015-06-16 | 2017-01-25 | 友达光电(厦门)有限公司 | 背光模块及其光学膜片的保护膜 |
KR101987602B1 (ko) * | 2018-11-22 | 2019-06-10 | 원용대 | 자동 박피 장치용 칼날 |
KR102197516B1 (ko) | 2019-04-04 | 2020-12-31 | 최진 | 필름 절단 설비 |
CN114571535B (zh) * | 2020-11-30 | 2024-02-09 | 上海昊佰智造精密电子股份有限公司 | 一种防剥离不良的pet模切件制作用模切装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0288103A (ja) * | 1988-09-21 | 1990-03-28 | Nec Corp | 微細溝の加工方法 |
JP3497492B2 (ja) * | 2001-11-02 | 2004-02-16 | 東邦エンジニアリング株式会社 | 半導体デバイス加工用硬質発泡樹脂溝付パッド及びそのパッド旋削溝加工用工具 |
US7553390B2 (en) * | 2001-11-08 | 2009-06-30 | Sharp Kabushiki Kaisha | Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device |
JP4093891B2 (ja) * | 2002-04-02 | 2008-06-04 | シャープ株式会社 | 液晶パネル、液晶パネルの製造方法および液晶パネル製造装置 |
JP4118153B2 (ja) * | 2003-01-29 | 2008-07-16 | シチズンセイミツ株式会社 | 被膜切除カッター |
-
2006
- 2006-06-01 JP JP2007519060A patent/JP4744517B2/ja not_active Expired - Fee Related
- 2006-06-01 CN CN200680019307XA patent/CN101189650B/zh not_active Expired - Fee Related
- 2006-06-01 KR KR1020077027961A patent/KR101191485B1/ko not_active IP Right Cessation
- 2006-06-01 WO PCT/JP2006/310984 patent/WO2006129752A1/ja active Search and Examination
Also Published As
Publication number | Publication date |
---|---|
KR101191485B1 (ko) | 2012-10-15 |
KR20080006000A (ko) | 2008-01-15 |
CN101189650A (zh) | 2008-05-28 |
WO2006129752A1 (ja) | 2006-12-07 |
JP4744517B2 (ja) | 2011-08-10 |
JPWO2006129752A1 (ja) | 2009-01-08 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: CITIZEN SEIMITSU CO., LTD. Effective date: 20130201 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130201 Address after: Osaka Japan Patentee after: Sharp Corporation Address before: Osaka Japan Patentee before: Sharp Corporation Patentee before: Citizen Seimitsu Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20210601 |