CN101183212B - 光工具以及阻焊图案的形成方法 - Google Patents

光工具以及阻焊图案的形成方法 Download PDF

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Publication number
CN101183212B
CN101183212B CN 200710187256 CN200710187256A CN101183212B CN 101183212 B CN101183212 B CN 101183212B CN 200710187256 CN200710187256 CN 200710187256 CN 200710187256 A CN200710187256 A CN 200710187256A CN 101183212 B CN101183212 B CN 101183212B
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China
Prior art keywords
film
group
solder resist
carbon atoms
resist pattern
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CN 200710187256
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Chinese (zh)
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CN101183212A (zh
Inventor
柴崎阳子
加藤贤治
有马圣夫
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Taiyo Holdings Co Ltd
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Taiyo Ink Mfg Co Ltd
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Priority claimed from JP2006309101A external-priority patent/JP2008122845A/ja
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Publication of CN101183212A publication Critical patent/CN101183212A/zh
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  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN 200710187256 2006-11-15 2007-11-15 光工具以及阻焊图案的形成方法 Active CN101183212B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2006-309100 2006-11-15
JP2006-309101 2006-11-15
JP2006309100 2006-11-15
JP2006309101A JP2008122845A (ja) 2006-11-15 2006-11-15 ソルダーレジストパターンの形成方法
JP2006309101 2006-11-15
JP2006309100A JP5079310B2 (ja) 2006-11-15 2006-11-15 ソルダーレジスト露光用フォトツール及びそれを用いて露光処理されるソルダーレジストパターンの形成方法

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CN101183212A CN101183212A (zh) 2008-05-21
CN101183212B true CN101183212B (zh) 2010-12-08

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CN (1) CN101183212B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012043001A1 (ja) 2010-09-29 2012-04-05 株式会社カネカ 新規な感光性樹脂組成物作製キット及びその利用
CN103901722B (zh) * 2014-04-28 2017-02-22 无锡德贝尔光电材料有限公司 一种碱性显像型感光树脂组合物及其制备方法
KR20200015487A (ko) * 2017-06-06 2020-02-12 닛뽄 가야쿠 가부시키가이샤 광경화성 조성물 및 전자 부품용 접착제
JP7039229B2 (ja) * 2017-09-28 2022-03-22 富士フイルム株式会社 転写フィルムの製造方法、レジストパターンの形成方法、及び、導電性配線パターンの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1309527A (zh) * 1999-12-16 2001-08-22 松下电器产业株式会社 可去除薄膜,带薄膜的衬底,该膜形成方法和电路板制造方法
CN1717428A (zh) * 2002-11-28 2006-01-04 太阳油墨制造株式会社 光固化性和热固化性树脂组合物以及使用该组合物的印刷电路板
CN1779568A (zh) * 2003-11-27 2006-05-31 太阳油墨制造株式会社 固化性树脂组合物、其固化物以及印刷电路板
EP1594005A3 (en) * 2004-03-05 2007-03-14 E.I. Du Pont De Nemours And Company Process for preparing a flexographic printing plate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0717737B2 (ja) * 1987-11-30 1995-03-01 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物及びソルダーレジストパターン形成方法
JP3574524B2 (ja) * 1996-02-23 2004-10-06 積水化学工業株式会社 フォトマスク保護用粘着フィルムの製造方法
JP2001296666A (ja) * 2000-04-12 2001-10-26 Orc Mfg Co Ltd 基板露光方法および露光装置
JP2003029417A (ja) * 2001-07-12 2003-01-29 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
JP3876991B2 (ja) * 2002-08-07 2007-02-07 三菱化学株式会社 青紫色レーザー感光性レジスト材層を有する画像形成材及びそのレジスト画像形成方法
JP4852225B2 (ja) * 2003-10-20 2012-01-11 大日本印刷株式会社 露光装置および露光方法
TWI403761B (zh) * 2005-02-15 2013-08-01 Fujifilm Corp 透光性導電性膜之製法
JP2008122845A (ja) * 2006-11-15 2008-05-29 Taiyo Ink Mfg Ltd ソルダーレジストパターンの形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1309527A (zh) * 1999-12-16 2001-08-22 松下电器产业株式会社 可去除薄膜,带薄膜的衬底,该膜形成方法和电路板制造方法
CN1717428A (zh) * 2002-11-28 2006-01-04 太阳油墨制造株式会社 光固化性和热固化性树脂组合物以及使用该组合物的印刷电路板
CN1779568A (zh) * 2003-11-27 2006-05-31 太阳油墨制造株式会社 固化性树脂组合物、其固化物以及印刷电路板
EP1594005A3 (en) * 2004-03-05 2007-03-14 E.I. Du Pont De Nemours And Company Process for preparing a flexographic printing plate

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JP2008122844A (ja) 2008-05-29
JP5079310B2 (ja) 2012-11-21
CN101183212A (zh) 2008-05-21

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Application publication date: 20080521

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Denomination of invention: Optical tool and method for forming soldering-resistant pattern

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