CN101147435A - 形成有安装部件用引脚的印刷电路板 - Google Patents

形成有安装部件用引脚的印刷电路板 Download PDF

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Publication number
CN101147435A
CN101147435A CNA2006800090980A CN200680009098A CN101147435A CN 101147435 A CN101147435 A CN 101147435A CN A2006800090980 A CNA2006800090980 A CN A2006800090980A CN 200680009098 A CN200680009098 A CN 200680009098A CN 101147435 A CN101147435 A CN 101147435A
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China
Prior art keywords
pcb
circuit board
printed circuit
pin
installing component
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CNA2006800090980A
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English (en)
Inventor
苅谷隆
古谷俊树
河西猛
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Ibiden Co Ltd
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Ibiden Co Ltd
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Publication of CN101147435A publication Critical patent/CN101147435A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
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Abstract

本发明提供一种即使安装高集成化的电子部件，也可以减少发生由半导体芯片与印刷电路板(4)之间的热膨胀系数之差引起的连接不良的印刷电路板。本发明的印刷电路板具有用于与半导体芯片(10)连接的由金属线构成的安装部件用引脚(1)，半导体芯片(10)是在安装面具有电极焊盘、在倒装法方式中所使用的面安装型半导体芯片，安装部件用引脚(1)利用引线接合技术形成。

Description

形成有安装部件用引脚的印刷电路板
技术领域
本发明涉及形成有导电性的安装部件用引脚的印刷电路板。
背景技术
专利文献1：日本特开2005-183466“多层印刷电路板”(公开日：2005年7月7日)，在专利文献1的背景技术中有采用焊锡凸块等技术进行连接的倒装法方式的记载，即“在该导通孔160及导体回路158的上层形成有阻焊层70，通过该阻焊层70的开口部71，在导通孔160及导体回路158上形成有凸块76U、76D。未图示的IC芯片通过在凸块76U上进行C4(倒装法)安装而进行电连接”。
但是，没有涉及在本申请中公开的形成有安装部件用引脚的印刷电路板的记载。
另一方面，近年，半导体装置进一步向高集成化发展，因此，芯片尺寸也变得巨大化。在通过倒装法方式锡焊了巨大尺寸的电子部件(例如、半导体芯片)的电极焊盘与印刷电路板的连接盘的安装状态下的电子设备被暴露在周围温度的上升与下降之中，有时会由于电子部件与印刷电路板的热膨胀系数之差引起锡焊部位损坏。
因此，一直以来，期望开发一种印刷电路板，该印刷电路板即使安装高集成化的电子部件，也可以减少发生由电子部件与印刷电路板之间的热膨胀系数之差引起的连接不良。
发明内容
因此，本发明的目的是提供一种印刷电路板，该印刷电路板即使安装高集成化的电子部件(例如半导体芯片)，也可以减少发生由电子部件与印刷电路板之间的热膨胀系数之差引起的连接不良。
鉴于上述目的，本发明的印刷电路板具有用于连接电子部件的导电性的安装部件用引脚。
另外，在上述印刷电路板中，上述安装部件用引脚也可以由金属线构成。
另外，在上述印刷电路板上，电子部件也可以是在安装面上具有电极焊盘的面安装型的半导体芯片，该面安装型的半导体芯片在倒装法方式中所使用。
另外，在上述印刷电路板的上述安装部件用引脚也可以具有挠性、弹性、弯曲性等。
另外，在上述印刷电路板中，上述安装部件用引脚也可以由电阻低的物质构成。
另外，在上述印刷电路板中，上述安装部件用引脚也可以利用引线接合技术来形成。
另外，在上述印刷电路板中，上述安装部件用引脚也可以为由竖S字形状、横S字形状、弯曲形状、环形状、螺旋形状、弹簧形状、圆形状及椭圆形状组成的群中选择的任意形状。
另外，在上述印刷电路板中，上述安装部件用引脚也可以被保护膜覆盖。
另外，本发明的电子设备具有印刷电路板与电子部件，该印刷电路板形成有安装部件用引脚，上述安装部件用引脚压接于上述电子部件的焊盘。
另外，本发明的电子设备具有印刷电路板与电子部件，该印刷电路板形成有安装部件用引脚，上述安装部件用引脚通过焊锡凸块相对于上述电子部件的焊盘焊锡连接。
另外，在上述电子设备中，上述安装部件用引脚也可以成为通过弹性或变形可以吸收施加于半导体装置及印刷电路板的一方或者双方的机械能的机械要素。
另外，在上述电子设备中，上述印刷电路板及上述电子部件也可以相对于上述电子设备的壳体固定。
另外，在上述电子设备中，上述印刷电路板及上述电子部件也可以使用粘接剂相互固定。
另外，本发明的印刷电路板的制造方法为形成有安装部件用引脚印刷电路板的制造方法，该制造方法包含如下步骤：(a)输送金属线到被安装在适当定位装置的印刷电路板的电极连接盘的上面；(b)识别印刷电路板的连接盘的接合部位；(c)将上述金属线的前端压接并接合在上述连接盘的接合部位；(d)缠绕上述金属线；(e)切断上述金属线；(f)熔化所切断的上述金属线的前端部来形成球；(g)移动到上述印刷电路板的下一个连接盘上。
另外，在上述印刷电路板的制造方法中，也可以重复步骤(a)～(g)。
另外，在上述印刷电路板的制造方法中，步骤(c)也可以通过并用超声波与热压接方式来进行。
根据本发明，可以提供一种印刷电路板，该印刷电路板即使安装高集成化的电子部件，也可以减少发生由电子部件与印刷电路板之间的热膨胀系数之差引起的连接不良。
附图说明
图1是表示形成有安装部件用引脚的印刷电路板的结构的一部分的图。
图2A是表示印刷电路板的安装部件用引脚压接于半导体芯片的焊盘的电子设备的安装方法的图。
图2B是表示印刷电路板的安装部件用引脚通过焊锡凸块焊锡连接在半导体芯片的焊盘的电子设备的安装方法的图。
图3是表示对印刷电路板的部件安装用引脚的各种形状进行说明的图。
图4A表示是形成有安装部件用引脚的印刷电路板的制造方法中的输送步骤的图。
图4B表示是形成有安装部件用引脚的印刷电路板的制造方法中的位置识别步骤的图。
图4C表示是形成有安装部件用引脚的印刷电路板的制造方法中的向印刷电路板的连接盘接合的接合步骤的图。
图4D表示是形成有安装部件用引脚的印刷电路板的制造方法中的缠绕金属线(整形)步骤的图。
图4E表示是形成有安装部件用引脚的印刷电路板的制造方法中的切断金属线步骤的图。
图4F表示是形成有安装部件用引脚的印刷电路板的制造方法中的形成球步骤的图。
附图标记说明：
1：安装部件用引脚；2：绝缘层；4：印刷电路板；5：连接盘、电极连接盘；6：填充通路孔；10：半导体芯片；11：焊盘、电极焊盘；12：焊锡凸块；21：电焊枪；22：球；23：毛细管；24：线夹；25：金属线；26：线轴；27：气动张紧装置；28：位置确认用照相机。
具体实施方式
以下，参照附图对本发明的形成有安装部件用引脚的印刷电路板的实施方式进行详细说明。另外，对于图中的相同要素标注相同的附图标记，省略重复说明。
(形成有安装部件用引脚的印刷电路板)
图1表示是形成有安装部件用引脚的印刷电路板的结构的一部分的图。本实施方式的印刷电路板4具有用于与电子部件、例如半导体芯片(图中未示。)连接的导电性的安装部件用引脚1。该引脚例如可以利用引线接合技术来形成。
本实施方式的形成有安装部件用引脚的印刷电路板，其特征在于如下方面：预先在印刷电路板的电极连接盘上形成安装部件用引脚，用面安装方法(2维安装，在倒装法安装中改用引脚代替焊锡作为接合构件的安装)与半导体芯片的电极焊盘进行电连接。
本实施方式的形成有安装部件用引脚1的印刷电路板4，其特征在于，形成有电连接在连接盘(最外层导体)5的、导电性的安装部件用引脚1。连接盘5也可以形成在填充通路孔6的上面。关于印刷电路板4的其他结构为任意。因为本实施方式的特征在最外层导体，为了便于说明，将一块印刷电路板4分为形成有最外层导体5的绝缘层2与由规定的绝缘层与导体层构成的其他层3进行说明。另外，根据期望，也可以在绝缘层2的上表面设置阻焊层。
安装部件用引脚1的一端电连接在连接盘5，另一端从印刷电路板4立起。根据期望，安装部件用引脚1也可以覆盖导电性的保护被膜(图中未示。)。印刷电路板4利用该安装部件用引脚1与半导体装置(图中未示。)连接。
安装部件用引脚1具有挠性、弹性、弯曲性等，优选是由电阻低的物质构成。典型的是采用金属线。
图2A及图2B清晰表示了具有印刷电路板4与半导体芯片10的电子设备及安装方法，该印刷电路板4形成有安装部件用引脚1。相对于前者的安装部件用引脚1压接于半导体芯片10的焊盘11的方法，后者在安装部件用引脚1采用焊锡凸块12相对于半导体芯片10的焊盘11进行焊锡连接这一点上与前者不同。
在图2A中，印刷电路板4的安装部件用引脚1相对于形成在半导体芯片10的电极焊盘11机械接触，确保电连接。采用任意方法进行印刷电路板4与半导体芯片10相互之间的固定。虽然图中未示，例如，也可以相对于电子设备的壳体固定两者。或者，也可以采用树脂等粘接剂相互固定两者。
图2A所示的安装结构的特征在于，将连接半导体芯片10与印刷电路板4之间的连接物由以往的焊锡凸块变更为安装部件用引脚1。因为安装部件用引脚1具有挠性、弹性、弯曲性等，被压在电极焊盘11，形成可靠的电连接。另外，安装部件用引脚1成为通过弹性或变形可以吸收施加于半导体芯片10及印刷电路板4的一方或双方的力(机械能)的机械要素。因此，可以减少发生由半导体芯片10与印刷电路板4之间的热膨胀系数之差引起的连接不良。
另外，因为安装部件用引脚1的长度非常短，例如在匹配特性阻抗Z0、电信号的传送速度的高速化方面可以得到良好的电特性。同样，在安装部件用引脚1由电阻低的物质形成时，可以避免不必要的电压下降。例如，由Cu、Au、Ag或他们的任意的合金制成的安装部件用引脚，有时是用这些金属表面处理后的安装部件用引脚。
另外，由于安装部件用引脚1为立起的形状，周围被空气所包围，可以实现信号传送的高速化。另外，在利用安装部件用引脚1的反弹力进行机械接触时，可以确保半导体芯片10与印刷电路板4的良好的电连接。
另外，由于本实施方式的具有安装部件用引脚1的印刷电路板4的特征在于电连接在连接盘11的安装部件用引脚1，印刷电路板4的其他部分为任意，也可以适用于大尺寸的印刷线路板或容易发生翘曲的无芯基板等。另外，由于将半导体芯片10与印刷电路板4之间的连接不用锡焊而变更为利用安装部件用引脚1的机械接触，具有不会残留回流焊等的受热过程的优点。
图2B是表示通过锡焊连接印刷电路板4的安装部件用引脚1与半导体芯片10确保电连接的安装结构的图。根据期望，将焊锡凸块12设置在印刷电路板4的安装部件用引脚1的前端，通过在如图2A所示的与半导体芯片10机械接触的状态下进行焊锡回流焊处理，用焊锡连接安装部件用引脚1与半导体芯片10的电极焊盘11。另外，根据期望，也可以用上述的方法中进行印刷电路板4与半导体芯片10的相互固定。
图3是表示对安装部件用引脚1的各种形状进行说明的图。安装部件用引脚1具有挠性、弹性、弯曲性等，如在图2A中所示，安装部件用引脚1压接于半导体芯片10的电极焊盘11。为实现该安装结构，安装部件用引脚1的形状为如下形状。
图3(1)的安装部件用引脚1-1被整形成竖S字形的形状。图3(2)的安装部件用引脚1-2被整形成横S字形的形状。图3(3)的安装部件用引脚1-3被整形成弯曲形状。图3(4)的安装部件用引脚1-4被整形成环形状。图3(5)的安装部件用引脚1-5被整形成螺旋形状或弹簧形状。图3(6)的安装部件用引脚1-6被整形成圆形状或椭圆形状。另外，这些形状只是例示，安装部件用引脚1只要是压接于半导体芯片10的电极焊盘11的形状，可以是任意形状。
(形成有安装部件用引脚的印刷电路板的制造方法)
用图4A～图4D对形成有安装部件用引脚的印刷电路板的制造方法，一边与以往的引线接合技术进行比较，一边进行说明。
首先，以往的引线接合技术例如在钉头式接合法由以下各步骤构成：(1)将半导体芯片安装在引线架上并进行输送；(2)由图案识别机构识别半导体芯片的接合焊盘的位置；(3)进行半导体芯片侧的接合；(4)进行金属线的缠绕(整形)；(5)进行向印刷电路板的安装半导体芯片相邻区域的连接盘的接合；(6)进行金属线的切断；(7)熔化被切断的金属线的前端而形成球；(8)移动到下一个半导体芯片的接合焊盘。
本实施方式的形成有安装部件用引脚1的印刷电路板4的制造方法按以下顺序利用了上述以下步骤：(1)输送；(2)位置识别；(3)向印刷电路板的连接盘的接合；(4)金属线的缠绕(整形)；(6)金属线的切断；(7)形成球；(8)移动。
另外，将在安装部件面上形成有电极连接盘5的印刷电路板4作为被制造的印刷电路板。使用该印刷电路板4进行如下的各工序。
(a)输送(参照图4A)：
将印刷电路板4安装在适当的定位装置(图中未示。)。金属线25从线轴26通过空气张力装置27、线夹24、毛细管23中的孔，被供给到印刷电路板4的连接盘5的上面。金属线25的前端成为熔化而成的球22。
(b)位置识别(参照图4B)：
利用位置确认用照相机28，由接合器的位置识别机构测量印刷电路板4的连接盘5的位置，计算连接盘5的接合部位。
(c)向印刷电路板的连接盘的接合(参照图4C)：
用毛细管23将金属线25的球22压接于连接盘5的接合部位，通过金属的扩散进行接合。为了减少对印刷电路板4的热损伤，优选是采用并用超声波与热压接方式。
(d)金属线的缠绕(整形)(参照图4D)：
向上拉起毛细管23，进行金属线25的整形。为了整形成所期望的形状，有时也进行上下左右的换向动作。
(e)金属线的切断(参照图4E)：
毛细管23上升时，用线夹24切断金属线。
(f)形成球(参照图4F)：
通过从电焊枪21向被切断的金属线25的前端部飞溅放电而熔化前端部而形成球。在该阶段，金属线25成为安装部件用引脚1。
(g)移动(图中未示。)：
移动到下一个印刷电路板4的连接盘5的上面。
通过高速重复上述工序(a)～(g)，可以制造形成有安装部件用引脚的印刷电路板。另外，也可以去掉(f)工序。
(其他)
虽然由以上，对形成有安装部件用引脚的印刷电路板的实施方式作了说明，但是，这些只是例示，本发明不局限于此。本领域技术人员容易做到的添加、削除、变换、改进等包含在本发明的范围中。
本发明的保护范围由添附的权利要求书的记载确定。

Claims (16)

1.一种印刷电路板，具有用于与电子部件连接的导电性的安装部件用引脚。
2.根据权利要求1所述的印刷电路板，上述安装部件用引脚由金属线构成。
3.根据权利要求1所述的印刷电路板，电子部件是在安装面上具有电极焊盘的面安装型的半导体芯片，该面安装型的半导体芯片在倒装法方式中所使用。
4.根据权利要求1所述的印刷电路板，上述安装部件用引脚具有挠性、弹性、弯曲性等。
5.根据权利要求1所述的印刷电路板，上述安装部件用引脚由电阻低的物质构成。
6.根据权利要求1所述的印刷电路板，上述安装部件用引脚利用引线接合技术来形成。
7.根据权利要求1所述的印刷电路板，上述安装部件用引脚为由竖S字形状、横S字形状、弯曲形状、环形状、螺旋形状、弹簧形状、圆形状及椭圆形状组成的群中选择的任意形状。
8.根据权利要求1所述的印刷电路板，上述安装部件用引脚被保护膜覆盖。
9.一种电子设备，具有印刷电路板与电子部件，该印刷电路板形成有安装部件用引脚，上述安装部件用引脚压接于上述电子部件的焊盘。
10.一种电子设备，具有印刷电路板与电子部件，该印刷电路板形成有安装部件用引脚，上述安装部件用引脚通过焊锡凸块相对于上述电子部件的焊盘焊锡连接。
11.根据权利要求9或者10所述的电子设备，上述安装部件用引脚为通过弹性或变形可以吸收施加于半导体装置及印刷电路板的一方或者双方的机械能的机械要素。
12.根据权利要求9或者10所述的电子设备，上述印刷电路板及上述电子部件相对于上述电子设备的壳体固定。
13.根据权利要求9或者10所述的电子设备，上述印刷电路板及上述电子部件使用粘接剂被相互固定。
14.一种形成有安装部件用引脚的印刷电路板的制造方法，该制造方法包含如下步骤：
(a)输送金属线到被安装在适当定位装置的印刷电路板的电极连接盘的上面；
(b)识别印刷电路板的连接盘的接合部位；
(c)将上述金属线的前端压接并接合在上述连接盘的接合部位；
(d)缠绕上述金属线；
(e)切断上述金属线；
(f)熔化被切断的上述金属线的前端部来形成球；
(g)移动到上述印刷电路板的下一个连接盘上。
15.根据权利要求14所述的形成有安装部件用引脚的印刷电路板的制造方法，重复步骤(a)～(g)。
16.根据权利要求14所述的形成有安装部件用引脚的印刷电路板的制造方法，步骤(c)通过并用超声波与热压接方式来进行。
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US7530814B2 (en) * 2007-09-25 2009-05-12 Intel Corporation Providing variable sized contacts for coupling with a semiconductor device

Cited By (6)

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CN102667318A (zh) * 2009-10-15 2012-09-12 科锐公司 灯组件及其制造方法
CN102667318B (zh) * 2009-10-15 2015-03-11 科锐公司 灯组件及其制造方法
CN102598331A (zh) * 2009-11-09 2012-07-18 皇家飞利浦电子股份有限公司 具有顺应性电连接的弯曲超声hifu换能器
CN102598331B (zh) * 2009-11-09 2015-03-25 皇家飞利浦电子股份有限公司 具有顺应性电连接的弯曲超声hifu换能器
CN103312091A (zh) * 2012-03-07 2013-09-18 博世汽车部件(长沙)有限公司 用于电动调节车辆中的活动部件的电机以及用于制造电机的方法
CN103312091B (zh) * 2012-03-07 2017-12-19 博世汽车部件(长沙)有限公司 用于电动调节车辆中的活动部件的电机以及用于制造电机的方法

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US20090053911A1 (en) 2009-02-26
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EP1959717A4 (en) 2010-10-06
KR20070100385A (ko) 2007-10-10
US20090053910A1 (en) 2009-02-26
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TWI351244B (zh) 2011-10-21

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