CN101137270A - 一种挠性多层线路板及其制造方法 - Google Patents
一种挠性多层线路板及其制造方法 Download PDFInfo
- Publication number
- CN101137270A CN101137270A CNA2006100624000A CN200610062400A CN101137270A CN 101137270 A CN101137270 A CN 101137270A CN A2006100624000 A CNA2006100624000 A CN A2006100624000A CN 200610062400 A CN200610062400 A CN 200610062400A CN 101137270 A CN101137270 A CN 101137270A
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- CN
- China
- Prior art keywords
- layer
- wiring board
- layers
- hole
- layer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims description 13
- 238000007731 hot pressing Methods 0.000 claims description 10
- 238000005553 drilling Methods 0.000 claims description 5
- 241001074085 Scophthalmus aquosus Species 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 88
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610062400A CN100589678C (zh) | 2006-08-31 | 2006-08-31 | 一种挠性多层线路板的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200610062400A CN100589678C (zh) | 2006-08-31 | 2006-08-31 | 一种挠性多层线路板的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101137270A true CN101137270A (zh) | 2008-03-05 |
CN100589678C CN100589678C (zh) | 2010-02-10 |
Family
ID=39161023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200610062400A Expired - Fee Related CN100589678C (zh) | 2006-08-31 | 2006-08-31 | 一种挠性多层线路板的制造方法 |
Country Status (1)
Country | Link |
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CN (1) | CN100589678C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102523702A (zh) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | 一种线路板背钻盲孔电镀制作工艺 |
CN102548225A (zh) * | 2012-02-13 | 2012-07-04 | 东莞森玛仕格里菲电路有限公司 | 一种pcb板的制作方法 |
CN104470211A (zh) * | 2013-09-24 | 2015-03-25 | 深南电路有限公司 | Pcb板加工方法及pcb板 |
WO2018149249A1 (zh) * | 2017-02-20 | 2018-08-23 | 宁波华远电子科技有限公司 | 下沉式高密度互连板的制作方法 |
-
2006
- 2006-08-31 CN CN200610062400A patent/CN100589678C/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102523702A (zh) * | 2011-12-19 | 2012-06-27 | 深圳崇达多层线路板有限公司 | 一种线路板背钻盲孔电镀制作工艺 |
CN102523702B (zh) * | 2011-12-19 | 2014-11-26 | 深圳崇达多层线路板有限公司 | 一种线路板背钻盲孔电镀制作工艺 |
CN102548225A (zh) * | 2012-02-13 | 2012-07-04 | 东莞森玛仕格里菲电路有限公司 | 一种pcb板的制作方法 |
CN104470211A (zh) * | 2013-09-24 | 2015-03-25 | 深南电路有限公司 | Pcb板加工方法及pcb板 |
CN104470211B (zh) * | 2013-09-24 | 2018-02-27 | 深南电路股份有限公司 | Pcb板加工方法及pcb板 |
WO2018149249A1 (zh) * | 2017-02-20 | 2018-08-23 | 宁波华远电子科技有限公司 | 下沉式高密度互连板的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100589678C (zh) | 2010-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: Flexible multi-layer circuit board and its producing method License type: Exclusive license Record date: 20080504 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150901 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150901 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: Biyadi Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100210 Termination date: 20190831 |
|
CF01 | Termination of patent right due to non-payment of annual fee |