CN101111933A - 倒装片安装体及其安装方法、以及凸块形成方法 - Google Patents
倒装片安装体及其安装方法、以及凸块形成方法 Download PDFInfo
- Publication number
- CN101111933A CN101111933A CNA200680003919XA CN200680003919A CN101111933A CN 101111933 A CN101111933 A CN 101111933A CN A200680003919X A CNA200680003919X A CN A200680003919XA CN 200680003919 A CN200680003919 A CN 200680003919A CN 101111933 A CN101111933 A CN 101111933A
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- conducting powder
- circuit board
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Images
Classifications
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- H—ELECTRICITY
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- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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Abstract
倒装片安装体,在与具有多个连接端子(11)的布线基板(10)对置而配设具有多个电极端子(21)的半导体芯片(20)、将上述连接端子(11)与上述电极端子(21)电连接,其中,使含有导电粉(12)的树脂(13)存在于上述连接端子(11)与上述电极端子(21)之间,将上述导电粉(12)与上述树脂(13)加热熔融,施加振动而使其流动;通过使上述熔融导电粉(12)自己集合到上述连接端子(11)与上述电极端子(21)之间,形成将两者电连接的连接体(22)。树脂中的熔融导电粉与接触端子或电极端子接触的概率提高,由此,通过熔融导电粉自己集合到浸润性较高的电极端子与连接端子之间,能够均匀地形成将两端子间电连接的连接体。
Description
技术领域
本发明涉及将半导体芯片装载到布线基板上的倒装片安装方法、以及在基板的电极上形成凸块的凸块形成方法。特别涉及对于窄节距化的半导体芯片也能够对应的、生产性较高的倒装片安装体及其安装方法、以及向窄节距化的基板电极上的凸块形成方法。
背景技术
近年来,随着在电子设备中使用的半导体集成电路(LSI)的高密度、高集成化,LSI芯片的电极端子的多引脚、窄节距化急速地发展。在这些LSI芯片向布线基板的安装中,为了减少布线延迟,广泛使用倒装片安装。并且,在该倒装片安装中,一般在LSI芯片的电极端子上形成焊料凸块,经由该焊料凸块一起接合在形成于布线基板上的连接端子上。
但是,为了将电极端子数超过5000那样的下一代LSI安装到布线基板上,需要形成对应于100μm以下的窄节距的凸块,但通过目前的焊料凸块形成技术难以适应于此。此外,由于需要形成对应于电极端子数的多个凸块,所以为了实现低成本化,还要求每个芯片的装载节拍的缩短带来的较高的生产性。
同样,半导体集成电路因电极端子的增大而从外围(peripheral)电极端子变化为面式(area)配置的电极端子。此外,预想因高密度化、高集成化的要求,半导体工艺会从90nm向65nm、45nm发展。结果,通过布线的细微化进一步发展、布线间的容量增大,高速化、消耗电力损失的问题变得深刻,布线层间的绝缘膜的低介电常数化(Low-K)的要求进一步提高。由于这样的绝缘膜的Low-K化的实现是通过绝缘层材料的多孔质化(疏松化)而得到的,所以机械强度较弱,成为半导体的薄型化的障碍。此外,如上所述,在构成面式配置的电极端子的情况下,由于在Low-K化带来的多孔质膜上的强度上有问题,所以在面式配置电极上形成凸块、以及倒装片安装本身变得困难。因而,要求适合于与今后的半导体工艺的发展相对应的薄型高密度半导体的低负荷倒装片安装法。
以往,作为凸块的形成技术,开发了镀覆法及丝网印刷法等。镀覆法虽然适合于窄节距,但在工序变得复杂的方面,在生产性上有问题,此外,丝网印刷法虽然在生产性上较好,但在使用掩模的方面对于窄节距化并不适合。
这样,在最近,开发了一些在LSI芯片或布线基板的电极上有选择地形成焊料凸块的技术。这些技术不仅适合于细微凸块的形成,而且能够实现凸块的一起形成,所以在生产性上也较好,作为能够适用于向下一代LSI的布线基板的安装的技术受到关注。
其中之一,有称作焊料膏(solder paste)法的技术(参照例如专利文献1)。该技术是将导电粉与助熔剂的混合物的焊料膏全面涂敷于在表面上形成有电极的基板上、通过将基板加热而使导电粉熔融,在浸润性较高的电极上有选择地形成焊料凸块的技术。
此外,超级焊料(super solder)法的技术(参照例如专利文献2)是将以有机酸铅盐和金属锡为主要成分的膏状组成物(化学反应析出型焊料)全面涂敷在形成有电极的基板上、通过将基板加热而引起Pb与Sn的置换反应,使Pb/Sn的合金有选择地析出到基板的电极上的技术。
但是,焊料膏法及超级焊料法都是将膏状的组成物通过涂敷在基板上而供给,所以会产生局部的厚度及浓度的不均匀,因此,各电极的焊料析出量不同,不能得到高度均匀的凸块。此外,这些方法由于是通过在表面上形成有电极的有凹凸的布线基板上,涂敷膏状组成物来供给,所以在作为凸部的电极上不能供给足够的焊料量,难以得到在倒装片安装中需要的期望的凸块高度。
使用以往的凸块形成技术的倒装片安装在将半导体芯片装载到形成有凸块的布线基板上之后,为了将半导体芯片固定在布线基板上,还需要将称作基底填料的树脂注入到半导体芯片与布线基板之间的工序。
所以,作为同时进行半导体芯片与布线基板的对置的电极端子间的电连接、和半导体芯片向布线基板的固定的方法,开发了使用各向异性导电材料的倒装片安装技术(参照例如专利文献3)。这是通过对布线基板与半导体芯片之间供给含有导电粒子的热硬化性树脂、通过在将半导体芯片加压的同时将热硬化性树脂加热、来同时实现半导体芯片与布线基板的电极端子间的电连接和半导体芯片向布线基板的固定的技术,并不特别需要以往的凸块形成。
上述使用各向异性导电材料的倒装片安装由于不需要凸块形成、能够同时实现半导体芯片与布线基板的电连接和物理固定,所以可以说生产性良好,但通过经由导电粒子的机械接触而得到电极间的电导通,难以得到稳定的导通状态。
此外,被对置电极夹着的导电粒子通过树脂的热硬化的凝聚力来维持,所以需要使热硬化性树脂的弹性率及热膨胀率等特性、以及导电粒子的粒径分布等特性一致,有工艺控制较困难的问题。
即,使用各向异性导电材料的倒装片安装为了适用于连接端子数超过5000那样的下一代LSI芯片,在可靠性方面还留有许多要解决的问题。
专利文献1:(日本)特开2000-94179号公报
专利文献2:(日本)特开平1-157796号公报
专利文献3:(日本)特开2000-332055号公报
发明内容
本发明是鉴于这一点而做出的,提供一种能够适用于下一代LSI的倒装片安装的、生产性及可靠性较高的倒装片安装体及其安装方法、以及应用了本技术的凸块形成方法。
本发明的倒装片安装体,是与具有多个连接端子的布线基板对置而配设具有多个电极端子的半导体芯片、将上述布线基板的上述连接端子与上述半导体芯片的上述电极端子电连接的倒装片安装体,其特征在于,
使含有导电粉的树脂存在于上述布线基板的上述连接端子与上述半导体芯片的上述电极端子之间,将上述导电粉与上述树脂加热熔融,对上述熔融导电粉与上述熔融树脂施加振动而使其流动;
通过使上述熔融导电粉自己集合到上述布线基板的连接端子与上述半导体芯片的电极端子之间,形成了将上述连接端子与上述电极端子电连接的连接体。
本发明的倒装片安装方法,是与具有多个连接端子的布线基板对置而配设具有多个电极端子的半导体芯片、将上述布线基板的上述连接端子与上述半导体芯片的上述电极端子电连接的倒装片安装方法,其特征在于,包括:
第1工序,对上述布线基板上供给含有导电粉的树脂;
第2工序,将上述半导体芯片以规定的间隔配置在上述树脂表面上;及
第3工序,将含有上述导电粉的树脂加热,将上述导电粉及上述树脂熔融;
在上述第3工序中,对上述熔融树脂施加振动而使其流动,通过使上述导电粉自己集合到上述布线基板的连接端子与上述半导体芯片的电极端子之间,形成将上述连接端子与上述电极端子电连接的连接体。
本发明的凸块形成方法,是在形成于基板上的多个电极上形成凸块的凸块形成方法,其特征在于,包括:
第1工序,对上述基板上供给含有导电粉的树脂;及
第2工序,将含有上述导电粉的树脂加热,将上述导电粉熔融;
上述第2工序是从外部对上述树脂施加振动的同时进行的;
上述熔融的导电粉通过施加给上述树脂的振动而在上述树脂中强制地移动的同时自己集合到上述基板的电极上,从而在上述电极上形成凸块。
附图说明
图1A~图1C是表示本发明的一实施方式的倒装片安装方法的工序剖视图。
图2是示意地说明本发明的一实施方式的在树脂内产生的剪切应力的剖视图。
图3是本发明的一实施方式的使可动台沿水平方向振动而对树脂施加振动的方法的剖视图。
图4是表示本发明的一实施方式的可动台的结构的平面图。
图5是表示本发明的一实施方式的使可动台沿垂直方向振动而对树脂施加振动的方法的剖视图。
图6是表示本发明的一实施方式的使用振子对树脂施加振动的方法的剖视图。
图7是表示本发明的一实施方式的使用模具对树脂施加振动的方法的剖视图。
图8A~图8C是说明本发明的一实施方式的通过超声波振动产生的气穴(cavitation)的状况的剖视图。
图9A~图9D是表示本发明的另一实施方式的凸块形成方法的工序剖视图。
具体实施方式
本发明提出了能够使熔融的导电粉有效地自己集合到端子间的新的倒装片安装方法。
本发明的特征在于发现,如果使含有导电粉的树脂存在于对置的电极或金属间、将导电粉与树脂一起加热熔融、施加振动而使其流动化,则熔融的导电粉会集合到容易浸润的电极或金属表面上,并且熔融导电粉彼此自己集合而成为较大的块,能够形成电连接体或金属凸块。
有关本发明的倒装片安装方法通过对被供给到布线基板与半导体芯片之间的含有导电粉的树脂从外部施加振动而使树脂强制地流动,由此,能够使分散在树脂中的熔融导电粉强制地与布线基板的电极端子或半导体芯片的连接端子接触。结果,树脂中的熔融导电粉与接触端子或电极端子接触的概略提高,由此,通过熔融的导电粉自己集合到浸润性较高的电极端子和连接端子间,能够均匀地形成将两端子间电连接的连接体。进而,通过使被供给到布线基板与半导体芯片间的树脂硬化,能够同时进行端子间的电连接和半导体芯片向布线基板的固定,能够实现生产性较高的倒装片安装体。
此外,通过使树脂强制地振动,能够使分散在树脂中的熔融导电粉可靠地自己集合到端子间,所以能够将在树脂中含有的导电粉保留为所需最小限度的量。结果,在端子间形成连接体后,能够减少残留在树脂中的不需要的导电粉的量,能够提高连接体间的绝缘耐性,实现可靠性较高的倒装片安装体。
进而,即使在电极端子或连接端子不均匀地排列的情况下,通过树脂的强制的流动也能够使熔融导电粉自己集合到端子间,所以能够实现不受端子排列限制的通用性较高的倒装片安装体。
此外,通过对树脂施加超声波振动,在树脂中引起气穴(发泡现象),通过产生的气穴能够使树脂强制地流动,所以能够进一步促进导电粉向端子间的自己集合。由此,能够使向端子间的导电粉的自己集合变得更可靠。
在本发明中,上述导电粉优选地是焊料金属粉。
优选的是,上述树脂由热硬化性树脂构成、上述树脂通过加热而固化,或者上述树脂由热塑性树脂构成、上述树脂通过冷却而固化。
此外,也可以在上述连接体形成后的树脂中也以非导通状态存在着导电粉。
在本发明的制造方法中,优选的是,对上述树脂施加的振动带来的该树脂的强制性的流动包括上述树脂相对于上述布线基板及半导体芯片相对地位移。
上述树脂既可以由膏状树脂构成,也可以由片状树脂构成。在任一种状态下,上述主旨都是通过加热而具有流动性。
此外,也可以在上述第3工序中形成上述连接体后,还包括使上述树脂硬化,而将上述半导体芯片固定在上述布线基板上的第4工序。
此外,上述树脂由热硬化性树脂构成;在上述第4工序中,通过加热将上述树脂硬化。
此外,上述树脂由热塑性树脂构成;在上述第4工序中,通过冷却将上述树脂硬化。
在某一优选的实施方式中,在上述第3工序中,将上述布线基板或半导体芯片的至少一个固定在可动台上,通过使该可动台沿水平方向或垂直方向振动,对上述树脂施加振动。
在某一优选的实施方式中,在上述第3工序中,对上述树脂施加的振动包括超声波振动。
在某一优选的实施方式中,在上述第3工序中,通过由对上述树脂施加的超声波振动产生的气穴,使上述熔融的导电粉强制地在上述树脂中移动。
在某一优选的实施方式中,在上述第3工序中,通过对上述树脂施加的振动,使上述导电粉在上述树脂中移动。
在某一优选的实施方式中,在第2工序中在多个电极上形成凸块后,还包括将上述树脂除去的第4工序。
作为在本发明中使用的导电粉,可以使用例如焊料粉。只要是焊料粉就可以,可以选择使用任意的材料。可以举出例如下表1中所示的材料。作为一例而举出的表1所示的材料既可以单独使用,也可以适当组合而使用。另外,如果使用导电性粒子的熔点比热硬化性树脂的硬化温度低的材料,则使树脂流动而自己集合后,进而将树脂加热而硬化,在能够进行电连接与树脂的密封的方面是优选的。
[表1]
导电性粉(焊料粉)的组成 | 熔点(固相线)(℃) |
Sn-58Bi | 139 |
Sn-37Pb | 183 |
Sn-9Zn | 199 |
Sn-3.0Ag-0.5Cu | 217 |
Sn-3.5Ag | 221 |
Sn-0.7Cu | 228 |
12Sn-2.0Ag-10Sb-Pb | 240 |
导电性粉(焊料粉)的优选的熔点是120~260℃,更优选为表1所示那样是139~240℃。在熔点不到120℃的情况下,有在耐久性方面产生问题的倾向。如果熔点超过260℃,则树脂的选择变得困难。
导电性粉(焊料粉)的优选的平均粒子直径是1~30μm的范围,更优选为5~20μm的范围。在平均粒子直径不到1μm的情况下,因导电性粉(焊料粉)的表面氧化而使熔融变得困难,并且有为了形成电连接体而过于耗费时间的倾向。如果平均粒子直径超过30μm,则因沉降而难以得到电连接体。另外,平均粒子直径可以通过市售的粒度分布计测量。
接着,对树脂进行说明。作为树脂,只要是在从室温到导电性粒子的熔融温度的范围内具有可流动的程度的粘性的树脂就可以,此外,还包括可流动的粘性因加热而降低的树脂。作为代表性的例子,可以使用环氧树脂、酚醛树脂、硅胶树脂、邻苯二甲酸二丙稀树脂、呋喃树脂、三聚氰氨树脂等热硬化性树脂、聚酯弹性体、氟树脂、聚亚酰胺树脂、聚酰胺树脂、芳香族聚酰胺树脂等热塑性树脂、或者光(紫外线)硬化树脂等、或者将它们组合后的材料。除了树脂以外,还可以使用高沸点溶剂、油等。
优选导电粉与树脂的配合比例是,导电粉∶树脂(重量比)=70~30∶30~70的范围,更优选为导电粉∶树脂(重量比)=60~40∶40~60。导电粉与树脂优选地在均匀混合后使用。例如,使焊料粉为50重量%、环氧树脂为50重量%,在搅拌机中成为均匀混合状态来使用。另外,焊料粉既可以保持着分散状态而做成膏状,也可以使用形成为片状的树脂。
接着,在本发明中,在将导电粉与树脂熔融后、或者与熔融同时使其振动,优选为频率240次/分(4Hz)以上、超声波区域的80kHz以下的范围。如果频率不到240次/分(4Hz)、以及超过80kHz,则熔融的导电粉的凝聚作用变低。
进而,在本发明的优选例中,作为导电粉,可以使用例如无铅且熔点200~230℃的焊料合金粒子。此外,在树脂为热硬化性树脂的情况下,优选为树脂的硬化温度比焊料的熔点高。如果这样,则能够在形成电连接体、或者形成金属凸块的工序中使树脂硬化,能够缩短作业工序。
以下,参照附图对本发明的实施方式进行说明。在以下的附图中,为了说明的简单化,将实质上具有相同的功能的结构要素用相同的标号表示。另外,本发明并不限于以下的实施方式。
(实施方式1)
图1A~图1C是表示本发明的实施方式的倒装片安装方法的工序剖视图,是表示本发明的倒装片安装方法的基本的工序的图。
首先,如图1A所示,在具有多个连接端子11的布线基板10上,通过分配器装置供给配合有导电粉12(例如熔点217℃,组成Sn-3.0Ag-0.5Cu,平均粒子直径12μm)的树脂13(例如环氧树脂,树脂与导电粉的配合比例为树脂50重量部、导电粉50重量部)。布线基板10的面积为1cm2,树脂与导电粉混合物的供给量为2mg。
接着,如图1B所示,使布线基板10的连接端子11对置于树脂13的表面,配置具有多个电极端子21的半导体芯片20,以使连接端子11与电极端子21的间隙为40μm。然后,将含有导电粉12的树脂13加热到230℃,将导电粉12熔融。在该工序中,对树脂13从箭头所示那样的外部施加振动,通过施加的振动使树脂13强制地流动。在该例中,施加超声波振动(频率40kHz)。通过熔融的导电粉12由树脂13的强制的流动而自己集合到布线基板10的连接端子11与半导体芯片20的电极端子21之间,如图1C所示,形成将连接端子11与电极端子21电连接的连接体22。连接端子11与电极端子21的间隔节距是200μm,连接端子11与电极端子21的尺寸都是直径100μm。此外,连接体22的高度是40μm。另外,半导体芯片20是10mm方传感器,电极端子21利用在半导体芯片的表面上呈网格状以200μm节距存在的电极端子。以网格(grid)状形成的电极端子21的总数是1600引脚。
根据本发明的方法,通过从外部对供给到布线基板10与半导体芯片20之间的树脂13施加振动,使树脂13强制地流动,由此,使分散在树脂13中的熔融导电粉12强制地与布线基板10的连接端子11或半导体芯片20的电极端子21接触,能够凝聚化。结果,树脂13中的熔融导电粉12与连接端子11或电极端子21接触的概率提高,由此,熔融导电粉12能够自己集合到浸润性较高的连接端子11与电极端子21之间而形成均匀的连接体22。
此外,通过使树脂13强制地振动,能够使分散在树脂13中的熔融导电粉12可靠地自己集合到端子11、21之间,所以能够将在树脂13中含有的导电粉12保留所需的最小限度的量。结果,在端子11、21间形成连接体22后,能够降低残留在树脂13中的不需要的导电粉12的量,能够提高连接体22之间的绝缘耐性,能够实现可靠性较高的倒装片安装体。
进而,在连接端子11或电极端子21不均匀地排列的情况下,也能够通过树脂13的强制的流动使熔融导电粉12均匀地自己集中到端子11、21之间,所以能够实现不受端子排列限制的通用性较高的倒装片安装体。
此外,由于没有使用溶剂,所以在图3C所示的连接体22的部分中,还是在树脂13的部分中都看不到起因于溶剂挥发的空孔(void)等的产生。
另外,这里,对树脂13的振动的施加不仅是树脂13自身振动的情况,只要是树脂13相对于布线基板10及半导体芯片20相对地流动就可以,振动的施加方法并没有限制。
图2是示意地说明本发明的在树脂内产生的剪切应力的剖视图,是除了上述效果以外,还通过树脂13的强制的流动、如图2所示那样沿着布线基板10的连接端子11的面(同样、半导体芯片20的电极端子21的面),在树脂13内产生剪切应力30的例子。通过该剪切应力30,将树脂13中的熔融导电粉12强制地推压到连接端子11(或电极端子21)上,结果,除了导电粉12自身的浸润性带来的自己集合以外,还能够通过剪切应力30的较强的接触力促进熔融导电粉12的自己集合,能够使向端子间的连接体22的形成变得更可靠。
此外,与此同时,通过产生的剪切应力,能够将在导电粉12的表面上形成、且成为导电粉12的结合的阻碍原因的氧化膜除去,所以能够在端子11、21之间形成更均匀的连接体22。
这里,树脂13优选地由膏状树脂构成。在此情况下,树脂13向布线基板10的供给可以通过旋转涂敷、丝网印刷、或者直接滴下等方法进行。作为膏状树脂,可以举出例如环氧类树脂、硅类树脂、酚醛类树脂等热硬化性树脂。
此外,树脂13也可以由片状树脂构成。但是,在将树脂13加热而将导电粉12熔融的工序中需要具有流动性的树脂。在此情况下,树脂13向布线基板10的供给可以通过直接配置片状树脂或转印等方法进行。作为片状树脂,可以举出氯乙烯类树脂、醋酸乙烯类树脂等热塑性树脂。
另外,在图1C的工序中,可以在形成连接体22后,通过使树脂13硬化而将半导体芯片20固定在布线基板10上。由此,能够同时进行端子11、21间的电连接和半导体芯片20向布线基板10的固定,能够实现生产性较高的倒装片安装体。
树脂13的硬化,在热硬化树脂的情况下可以通过将树脂13进一步加热到高温、此外在热塑性树脂的情况下可以通过将树脂13冷却来分别进行。此外,也可以使用光硬化性树脂。
接着,参照图3及图4,以下对通过对树脂13从外部施加振动而使树脂13相对于布线基板10及半导体芯片20相对地流动的方法的一例进行说明。
图3是使本发明的可动台沿水平方向振动而对树脂施加振动的方法的剖视图,图4是表示本发明的可动台的结构的平面图。
如图3所示,在对布线基板10与半导体芯片20之间供给树脂13的状态下,将布线基板10固定在可动台41上,将半导体芯片20固定在固定台42上。可动台41为图4所示那样的结构,在水平方向上振动。可动台41设置为沿着轨道(未图示)在一定方向(纸面的左右方向)上水平移动,在可动台41的端部上经由凸轮43连结有旋转体44。并且,通过使旋转体44旋转,使连结在凸轮43上的可动台41沿水平方向振动。作为一例,振幅幅度为0.5mm,频率为240次/分。
通过可动台41的振动,布线基板10相对于固定在固定台42上的半导体芯片20相对地位移。由此,具有粘性及表面张力的树脂13实效地沿图3所示的箭头方向振动。对树脂13施加的振动的周期及振幅也因树脂13的流动性(粘性)而变化,但能够通过改变旋转体42的半径、旋转速度、凸轮43的长度等来调节。
此外,图5是表示使本发明的可动台沿垂直方向振动而对树脂施加振动的方法的剖视图,如图5所示,使固定在布线基板10上的可动台41沿垂直方向振动也同样能够对树脂13施加实效的振动。在此情况下,通过反复进行对树脂13的压缩,树脂13实效地沿图5所示的箭头方向振动。
另外,在图3及图5中,表示了将布线基板10固定在可动台41上、将半导体芯片20固定在固定台42上的例子,但也可以相反。此外,将台42做成了固定台,但也可以向与可动台41不同的方向振动。例如,如使台42向与台41相反方向振动的情况、或使台41沿水平方向振动而使台42沿垂直方向振动的情况那样,通过分别向不同的方向振动,能够对树脂13施加多个不同的振动,能够得到同样或其以上的振动效果。
上述例子是通过使布线基板10与半导体芯片20相对地位移来对树脂13施加实效的振动的例子,而接着参照图6及图7说明对树脂13自身施加振动的例子。
图6是表示本发明的使用振子对树脂施加振动的方法的剖视图,图7是表示本发明的使用模具对树脂施加振动的方法的剖视图。
图6所示的例子是在布线基板10(或者半导体芯片20)的表面上安装多个振子50、通过对其施加电压而使振子50产生振动、使该振动经由布线基板10传递到树脂13中的例子。由此,通过树脂13自身强制地流动,能够使树脂13相对于布线基板10及半导体芯片20相对地位移。
此外,图7所示的例子是将布线基板10与半导体芯片20分别设置在上模60及下模61中后、使两模具60、61咬合、从吸入口62将树脂13注入到模具60、61的空间部中、对布线基板10与半导体芯片20之间供给树脂13的例子。在上模60(或者/以及下模61)的内侧安装有多个振子50,通过对其施加电压而使振子50产生振动,使振动传播到树脂13中。该方法由于能够对树脂13直接施加振动,所以能够有效地使树脂13流动。
本发明具有通过从外部对树脂13施加振动而使树脂13强制地振动的特征,进而,通过对树脂13施加超声波振动,能够对树脂13施加从20kHz到超过1MHz的超声波域中的很高频率下的反复振动,图2中示意表示的、沿着布线基板10的连接端子11的面或半导体芯片20的电极端子21的面的、树脂13中的剪切应力30带来的熔融导电粉12的较强的摩擦力及接触力以很高的反复频率发生,能够促进熔融导电粉12的自己集合。
进而,在对树脂13施加的振动加上了超声波振动的情况下,能够在树脂中引起气穴(发泡现象),能够更强力地使树脂13流动。
图8A~图8C是说明通过本发明的超声波振动产生的气穴的状况的剖视图,图8示意地表示通过对树脂13施加超声波振动而产生气穴的状况。如图8A所示,在布线基板10(或者半导体芯片20)的表面上安装有多个超声波振子50’,通过对其施加电压,使超声波振动经由布线基板10传播到树脂13中。
通过传播到树脂13中的超声波振动,如图8B所示,在树脂13中产生多个气穴,通过成长的气穴70将气穴70周边的树脂13向箭头所示的方向强制地推出。并且,如图8C所示,在气穴70消失时,这次相反地将树脂13向气穴70曾存在的地方推回。这样,通过气穴70的产生及消失的反复,树脂13变为与实效地施加了振动的状态相等,能够进一步促进树脂13中的导电粉的自己集合。
(实施方式2)
本发明的倒装片安装方法的特征性的技术也能够应用在凸块(bump)形成方法中。以下,参照图9A~图9D,对本发明的凸块形成方法进行说明。
图9是表示本发明的实施方式的凸块形成方法的工序剖视图。
如图9A所示,对形成有多个电极11’的基板10’上供给含有导电粉12的树脂13。接着,如图9B所示,在将平板14以规定的间隔(例如40μm)配置在树脂13的表面上的状态下,将含有导电粉12的树脂13加热而使导电粉12熔融。该工序是一边从外部对树脂13施加振动、通过该振动使树脂13强制地流动一边执行的。熔融的导电粉12通过树脂13的强制性的流动而自己集合到基板10’的电极11’上,由此,如图9C所示,在电极11’上形成凸块15。然后,如图9D所示,通过将平板14及树脂13除去,完成在电极11’上形成有凸块的基板10’。
根据本发明的方法,通过对被供给到基板10’上的树脂13从外部施加振动,使树脂13强制地流动,由此,能够使分散在树脂13中的熔融导电粉12强制地接触在基板10’的电极11’上。结果,树脂13中的熔融导电粉12与电极11’接触的概率提高,由此,熔融导电粉12能够自己集合到浸润性较高的电极11’上而形成均匀的凸块15。
这里,基板10’只要是在布线基板、半导体芯片及其他表面上形成有电极11’的基板就可以,此外,对树脂13施加振动的方法可以提供与在上述倒装片安装方法中使用的同样的方法。
以上,通过优选的实施方式说明了本发明,但这样的记述并不是限定事项,当然能够进行各种改变。例如,对树脂13施加的振动并不限于直线振动,也可以是圆振动、椭圆振动及其他各种模式的振动,此外,也可以是横振动、纵振动的任一种振动。此外,通过对树脂13施加的振动也产生使导电粉12自身强制地在树脂13中移动的效果,通过该效果,进一步促进了导电粉12向端子间的自己集合。
工业实用性
根据本发明,能够提供能够适用于下一代LSI的倒装片安装、生产性及可靠性较高的倒装片安装方法、以及凸块形成方法。
权利要求书(按照条约第19条的修改)
1、(删除)
2、(删除)
3、(删除)
4、(删除)
5、(删除)
6、一种倒装片安装方法,与具有多个连接端子的布线基板对置而配设具有多个电极端子的半导体芯片,将上述布线基板的上述连接端子与上述半导体芯片的上述电极端子电连接,其特征在于,包括:
第1工序,对上述布线基板上供给含有导电粉的树脂;
第2工序,将上述半导体芯片以规定的间隔配置在上述树脂表面上;及
第3工序,将含有上述导电粉的树脂加热,将上述导电粉及上述树脂熔融;
Claims (19)
1.一种倒装片安装体,与具有多个连接端子的布线基板对置而配设具有多个电极端子的半导体芯片,将上述布线基板的上述连接端子与上述半导体芯片的上述电极端子电连接,其特征在于,
使含有导电粉的树脂存在于上述布线基板的上述连接端子与上述半导体芯片的上述电极端子之间,将上述导电粉与上述树脂加热熔融,对上述熔融导电粉与上述熔融树脂施加振动而使其流动;
通过使上述熔融导电粉自己集合到上述布线基板的连接端子与上述半导体芯片的电极端子之间,形成了将上述连接端子与上述电极端子电连接的连接体。
2.如权利要求1所述的倒装片安装体,上述导电粉是焊料金属粉。
3.如权利要求1所述的倒装片安装体,上述树脂由热硬化性树脂构成,上述树脂通过加热而硬化。
4.如权利要求1所述的倒装片安装体,上述树脂由热塑性树脂构成,上述树脂通过冷却而固化。
5.如权利要求1所述的倒装片安装体,在上述连接体形成后的树脂中也以非导通状态存在着导电粉。
6.一种倒装片安装方法,与具有多个连接端子的布线基板对置而配设具有多个电极端子的半导体芯片,将上述布线基板的上述连接端子与上述半导体芯片的上述电极端子电连接,其特征在于,包括:
第1工序,对上述布线基板上供给含有导电粉的树脂;
第2工序,将上述半导体芯片以规定的间隔配置在上述树脂表面上;及
第3工序,将含有上述导电粉的树脂加热,将上述导电粉及上述树脂熔融;
在上述第3工序中,对上述熔融树脂施加振动而使其流动,通过使上述导电粉自己集合到上述布线基板的连接端子与上述半导体芯片的电极端子之间,形成将上述连接端子与上述电极端子电连接的连接体。
7.如权利要求6所述的倒装片安装方法,在上述第3工序中,对上述树脂施加的振动带来的该树脂的强制性的流动包括上述树脂相对于上述布线基板及半导体芯片相对地位移。
8.如权利要求6所述的倒装片安装方法,上述树脂由膏状树脂构成。
9.如权利要求6所述的倒装片安装方法,
上述树脂由片状树脂构成;
在上述第3工序中,通过将上述薄片树脂加热而使其流动。
10.如权利要求6所述的倒装片安装方法,
在上述第3工序中形成上述连接体后,
还包括使上述树脂硬化或固化,而将上述半导体芯片固定在上述布线基板上的第4工序。
11.如权利要求10所述的倒装片安装方法,
上述树脂由热硬化性树脂构成;
在上述第4工序中,通过加热将上述树脂硬化。
12.如权利要求10所述的倒装片安装方法,
上述树脂由热塑性树脂构成;
在上述第4工序中,通过冷却将上述树脂硬化。
13.如权利要求6所述的倒装片安装方法,在上述第3工序中,将上述布线基板或半导体芯片的至少一个固定在可动台上,通过使该可动台沿水平方向或垂直方向振动,对上述树脂施加振动。
14.如权利要求6所述的倒装片安装方法,在上述第3工序中,对上述树脂施加的振动包括超声波振动。
15.如权利要求14所述的倒装片安装方法,在上述第3工序中,通过由对上述树脂施加的超声波振动产生的气穴,使上述熔融的导电粉在上述树脂中移动。
16.如权利要求6所述的倒装片安装方法,在上述第3工序中,通过对上述树脂施加的振动,使上述导电粉在上述树脂中移动。
17.一种凸块形成方法,在形成于基板上的多个电极上形成凸块,其特征在于,包括:
第1工序,对上述基板上供给含有导电粉的树脂;及
第2工序,将含有上述导电粉的树脂加热,将上述导电粉熔融;
上述第2工序是从外部对上述树脂施加振动的同时进行的;
上述熔融的导电粉通过施加给上述树脂的振动而在上述树脂中强制地移动的同时自己集合到上述基板的电极上,从而在上述电极上形成凸块。
18.如权利要求17所述的凸块形成方法,在第2工序中在多个电极上形成凸块后,还包括将上述树脂除去的第4工序。
19.如权利要求17所述的凸块形成方法,在第1工序之后、第2工序之前,将平板置于含有导电粉的树脂之上,在电极上形成凸块后将上述平板除去。
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CN105493207A (zh) * | 2014-02-24 | 2016-04-13 | 积水化学工业株式会社 | 连接结构体的制造方法 |
CN107148653A (zh) * | 2014-12-04 | 2017-09-08 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
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JP2008300808A (ja) * | 2007-06-04 | 2008-12-11 | Tamura Seisakusho Co Ltd | はんだバンプ形成装置およびはんだバンプの形成方法 |
JP5168221B2 (ja) * | 2009-04-21 | 2013-03-21 | 日本電気株式会社 | 半導体装置製造方法 |
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CN105493207A (zh) * | 2014-02-24 | 2016-04-13 | 积水化学工业株式会社 | 连接结构体的制造方法 |
CN105493207B (zh) * | 2014-02-24 | 2018-05-25 | 积水化学工业株式会社 | 连接结构体的制造方法 |
CN107148653A (zh) * | 2014-12-04 | 2017-09-08 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
CN107148653B (zh) * | 2014-12-04 | 2019-03-29 | 积水化学工业株式会社 | 导电糊剂、连接结构体及连接结构体的制造方法 |
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