CN101107687A - 封装型电子部件的引线端子的切断方法 - Google Patents

封装型电子部件的引线端子的切断方法 Download PDF

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Publication number
CN101107687A
CN101107687A CNA2006800028104A CN200680002810A CN101107687A CN 101107687 A CN101107687 A CN 101107687A CN A2006800028104 A CNA2006800028104 A CN A2006800028104A CN 200680002810 A CN200680002810 A CN 200680002810A CN 101107687 A CN101107687 A CN 101107687A
Authority
CN
China
Prior art keywords
lead terminal
cut
cutting
encapsulation
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006800028104A
Other languages
English (en)
Chinese (zh)
Inventor
野田昌宏
小早川正彦
三轮忠稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN101107687A publication Critical patent/CN101107687A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CNA2006800028104A 2005-01-21 2006-01-18 封装型电子部件的引线端子的切断方法 Pending CN101107687A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP014351/2005 2005-01-21
JP2005014351A JP2008117793A (ja) 2005-01-21 2005-01-21 パッケージ型電子部品におけるリード端子の切断方法

Publications (1)

Publication Number Publication Date
CN101107687A true CN101107687A (zh) 2008-01-16

Family

ID=36692259

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006800028104A Pending CN101107687A (zh) 2005-01-21 2006-01-18 封装型电子部件的引线端子的切断方法

Country Status (5)

Country Link
JP (1) JP2008117793A (ja)
KR (1) KR20070094654A (ja)
CN (1) CN101107687A (ja)
TW (1) TWI274357B (ja)
WO (1) WO2006077870A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107824953A (zh) * 2017-09-06 2018-03-23 木林森股份有限公司 一种采用感应加热焊接技术生产led照明产品的方法
CN108604498A (zh) * 2016-02-19 2018-09-28 松下知识产权经营株式会社 电容器以及电容器的制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7835138B2 (en) * 2007-03-09 2010-11-16 Nec Tokin Corporation Solid electrolytic capacitor and method of manufacturing same
JP5181236B2 (ja) * 2008-03-19 2013-04-10 松尾電機株式会社 チップ形コンデンサ
KR101067210B1 (ko) * 2008-12-08 2011-09-22 삼성전기주식회사 고체 전해 콘덴서

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3666594B2 (ja) * 2002-10-17 2005-06-29 ローム株式会社 パッケージ型電子部品におけるリード端子の切断方法
JP2005000552A (ja) * 2003-06-13 2005-01-06 Olympus Corp カプセル内視鏡

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108604498A (zh) * 2016-02-19 2018-09-28 松下知识产权经营株式会社 电容器以及电容器的制造方法
CN107824953A (zh) * 2017-09-06 2018-03-23 木林森股份有限公司 一种采用感应加热焊接技术生产led照明产品的方法
CN107824953B (zh) * 2017-09-06 2020-06-19 木林森股份有限公司 一种采用感应加热焊接技术生产led照明产品的方法

Also Published As

Publication number Publication date
TWI274357B (en) 2007-02-21
KR20070094654A (ko) 2007-09-20
JP2008117793A (ja) 2008-05-22
TW200629315A (en) 2006-08-16
WO2006077870A1 (ja) 2006-07-27

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20080116