1274357 (1) 九、發明說明 【發明所屬之技術領域】 本發明爲有關具有樹脂封裝的電子零件之製造方法。 特別是，本發明爲有關切斷由樹脂封裝突出之導線端子的 方法。在此所謂的電子零件，爲例如電容器或半導體積體 電路等。 【先前技術】 下述的專利文獻1，爲公開封裝型電子零件之一例的 固體電解電容器。該固體電解電容器，係具備熱硬化性合 成樹脂的封裝；及由該封裝突出的陽極導線端子及陰極導 線端子。於封裝之中，設置電容器元件。該電容器元件， 具備具有由閥作用之金屬材料（以下，只稱爲「閥作用金 屬」）而成的晶片；及由晶片的一端面突出的陽極棒；及 於晶片的外周面形成的陰極膜。陽極棒與陰極膜，是分別 連接陽極導線端子及陰極導線端子。 上述習知的固體電解電容器如以下所製造。首先，準 備具有特定圖案的導線架。該導線架，係具備相互平行延 伸的2個支撐軌道；及設置於此等支撐軌道之間的複數對 的導線端子（陽極導線端子及陰極導線端子）。於各對中 ’陽極導線端子及陰極導線端子，爲相互以對向的方式來 設置。針對此等陽極導線端子及陰極導線端子，爲藉由施 行電鍍處理，來形成金屬電鍍層（例如，鍍錫層）。 其次，各陽極導線端子與對應其之陰極導線端子之間 -5 - (2) (2)1274357 配置電容器元件。於此時，上述陽極棒在陽極導線端子， 上述陰極膜在陰極導線端子，分別以電性導通的方式來黏 著。其次，以樹脂封裝來密封電容器元件全體。 最後，切斷各導線端子之中由封裝突出的地方。切斷 ，係運用昇降動可能之切斷用沖壓機來進行。如此一來， 可以得到由支持軌道分離的固體電解電容器。 在上述固體電解電容器安裝於印刷電路基板等之際， 由封裝突出的兩導線端子焊接於印刷電路基板。 根據上述習知技術，以切斷用沖壓機來切斷鍍錫層已 事先形成的導線端子。因此，各導線端子的先端面亦即以 沖壓機切斷的面，無法以鍍錫層覆蓋。其結果，焊劑很難 附著於各導線端子的先端面，於固體電解電容器安裝於印 刷電路基板之際，有得不到充分的安裝強度的問題。 [專利文獻1]日本特開第2004- 1 72527號公報 【發明內容】 本發明，欲解決上述問題，而提供封裝型電子零件之 導線端子的切斷方法爲課題。 根據本發明，係提供具有樹脂製的封裝，及覆蓋於該 封裝的元件，及包含伴隨導通該元件由前述封裝至外部突 出之突出部的導線端子之於封裝型電子零件中之導線端子 的切斷方法。該方法，係具備藉由除去前述突出部的一部 分於前述導線端子形成狹橋部的工程；及於前述突出部施 行金屬電鏟處理的工程；及在前述狹橋部的位置切斷前述 -6 - (3) (3)1274357 導線端子的工程。 前述狹橋部，係於前述導線端子的前述突出部形成缺 口或貫穿孔等而設置。 根據上述方法，藉由除去由導線端子之突出部的一部 分於前述導線端子形成狹橋部之後，針對前述突出部施行 金屬電鍍處理。其後，在前述狹橋部的位置切斷前述導線 端子。其結果，於切斷後的導線端子中，不只是上面、下 面及2邊的側面，連先端面的一部分也可以殘存著金屬電 鍍層。 根據上述構成，在封裝型電容器安裝於印刷電路基板 等之際，提昇前述導線端子的先端面之焊錫浸濕性（ solder wettability)。因此，得到針對提昇該當電容器的 印刷電路基板的安裝強度之效果。 此外，於切斷前述導線端子的工程之後，由於沒有必 要於前述導線端子的先端面另外設置形成金屬電鍍層的工 程，因此得到抑制製造費用的效果。 理想的是，前述導線端子的切斷，係運用切斷用沖壓 機及搖台來進行。該切斷用沖壓機，係具備抵接前述導線 端子的切斷機能部；及不抵接前述導線端子的非切斷機能 部。前述切斷機能部，也可以作爲前述非切斷機能部的基 準朝向前述封裝而突出的型態。此種構成，係於前述切斷 用沖壓機的切斷面側形成凹部才可能實現。運用此種切斷 用沖壓機，最終於所取得之封裝型電子零件之導線端子的 先端，留下金屬電鍍層的形成區域。 ⑧ (4) 1274357 根據本發明，例如，前述狹橋部之中切斷離封裝最近 的部分。如此般做的話，切斷後的前述導線端子的先端面 ’切斷面（導線端子的一部分直接露出的面）與以金屬電 鍍層覆蓋的被覆面成爲整面的平坦面。亦即，前述導線端 子的先端面不存在段差或突起物。其結果，覆蓋前述導線 端子之先端側的前述金屬電鍍層及塗敷於印刷電路基板等 的焊膏（soldering paste)較容易融合。 【實施方式】 首先，一邊參照第1圖〜第4圖B，一邊說明有關基 於本發明之第1實施型態的方法。此等圖之中，第1圖及 第2圖，爲槪略的表示利用該當方法來得到封裝型電子零 件的構成。被圖示的電子零件爲固體電解電容器，但這不 過是舉例說明，本發明的適用對象不是只限於固體電解電 容器。 9 如第1圖所示，固體電解電容器1，係具備電容器元 件2 ;及一對的導線端子3 (陽極導線端子3a及陰極導線 -端子3 b );及由熱硬化性合成樹脂而成的封裝5。各導線 端子，係由金屬板而成。封裝5係密封電容器元件2全體 。各導線端子3，一部分被封裝5所覆蓋，但另一部分露 出於封裝5的外部（也參照第2圖）。此外，各導線端子 3，於水平方向中，由封裝5突出。 電容器兀件2’係具備晶片6;及由該當晶片的一端 面（在第1圖右端面）突出的陽極棒7。晶片6，爲燒結 -8- (5) 1274357 1 * 鉬等的閥作用金屬的粉末所做成的多孔質體。同樣地，陽 極棒7也由閥作用金屬而成。雖然圖中沒有表示，但於晶 片6上，形成電氣絕緣性爲高的介電質膜。此外，於晶片 6上（正確爲上述介電質膜上），除了上述右端面的部分 以外，形成固體電解質層。再者，於該固體電解質層上， 形成陰極膜8。 如第1圖所示，於陽極導線端子3 a中，熔接直立設 • 置狀的連接片9。此種直立設置部，也可以藉由彎曲部分 的陽極導線端子3 a來形成。連接片9，爲針對電容器元件 2的陽極棒7，藉由導電性塗料或焊糊，以電性導通的方 式來黏著。另一方面，陰極導線端子3的上面部，係針對 陰極膜8，藉由導電性塗料、焊糊或熔接，以電性導通的 方式來黏著。 其次，一邊參照第3圖、第4圖A及第4圖B，一邊 說明有關上述固體電解電容器1的製造方法之一例。 ® 首先，藉由沖壓加工1枚的金屬薄板，如第3圖所示 ，來準備導線架1 1。導線架1 1，係具備相互平行延伸的 •一對支撐軌道1 2 ;及複數對的導線端子（陽極導線端子及 、陰極導線端子）3 (在第3圖只有表示一對導線端子3 )。 導線端子3的複數對，爲配置於支撐軌道〗2的縱長方向 中隔著特定距離的間隔。各導線端子3，藉由由一方的支 撐軌道朝向其他的支撐軌道以直角來延伸，與對應其他的 導線端子3爲對向來構成。此外，於各導線端子3中，形 成由上下方向貫穿該當5而子的貫穿孔13。如第3圖所示， -9- (6) (6)1274357 各貫穿孔1 3，係位於之後形成的封裝5的外側。各貫穿孔 1 3，藉由一對的狹橋部2 3由兩側被夾住。 其次，如第3圖所示，於陽極導線端子3的自由端部 ，熔接向上的連接片9。此種向上的連接部，也可以彎曲 陽極導線端子3的自由端部來形成。其次，針對各導線端 子3，藉由施行金屬電鍍處理，形成作爲基底層的鍍鎳層 (無圖示），及對焊錫浸濕性優越的金屬電鍍層1 5 (參照 第1圖）。金屬電鍍層1 5，係例如由錫或焊錫而成。此種 金屬電鍍處理，針對各導線端子3的全體來進行也可以， 只針對其一部分來進行也可以。但是，於後者的情況下， 導線端子3之中，至少於由封裝5朝外側突出的地方進行 該當電鍍處理是必要的。藉由此金屬電鍍處理，各貫穿孔 13的內壁面也被金屬電鍍層15覆蓋。 其次，如第3圖所示，於一對的導線端子3之間配置 電容器元件2，並使陽極棒7與連接片9接觸。接著，陽 極棒7於連接片9、陰極膜8於陰極導線端子3，用導電 性塗料或焊糊以電性導通的方式來分別黏著。 其次，形成覆蓋電容器元件2全體的封裝5。封裝5 可以用下列的手法來形成。首先，於導線架1 1的上面， 載置具有特定大小之空洞的模板（無圖示）。此時，電容 器元件2，是收容於上述模板的空洞內。其次，至電容器 兀件2完全地浸漬後，於上述空洞內流入液狀的熱硬化性 合成樹脂。最後，藉由使供給該當樹脂硬化，來形成封裝 5 °尙’針對導線端子3上述的金屬電鍍處理，於該當封 -10- (S) (7) (7)1274357 裝形成工程之後進行也可以。於該情況下，上述基底層及 金屬電鍍層1 5，係形成於導線端子3的露出部分（沒有覆 蓋於封裝5的部分）。 封裝5形成之後，如第4圖a所示，封裝5藉由搖台 16由下方來支撐。接著，運用昇降動可能之切斷用沖壓機 1 7，來切斷各狹橋部2 3 (切斷工程）。如此一來，固體電 解電容器1的完成品（參照第1圖及第2圖），由一對的 支撐軌道1 2切離。 如第4圖B所示，於各切斷沖壓機1 7的切斷作用面 1 8，形成垂直方向長狀延伸的凹部1 9。或是以別的見解來 看的話’各切斷沖壓機1 7，具有藉由凹部1 9分隔成2個 的切斷作用面1 8，各切斷作用面18，係針對非切斷作用 面（凹部1 9的底面）要突出於前方（朝封裝5的方向） 。根據此種構成，於各導線端子3的切斷面中，可以留下 金屬電鍍層15(及其基底層）所形成的區域S(參照第2 圖）。該區域S，如由第3圖及第4圖B所理解的，貫穿 孔1 3的4個內壁面之中，對應位於封裝5側的一面。如 第2圖所不，區域S，係構成導線端子3的先端面的一部 分，並位於露出面C之間（沒有形成金屬電鍍層1 5的部 分）。 切斷沖壓機1 7的切斷作用面1 8，係切斷導線端子3 。此時，切斷作用面1 8只有切斷狹橋部23，以不接觸區 域S來構成。爲了實現此，凹部1 9的寬度（於第4圖B 中測量上下方向的尺寸），係與貫穿孔1 3的寬度一樣或 -11 - (8) (8)1274357 是設定成實質上一樣。 由支撐軌道1 2切離的各導線端子3的先端面，係如 第2圖所示，爲由2個露出面C，及以金屬電鍍層覆蓋的 區域S而成的平坦面。也就是說，露出面C及區域S爲相 互的整面。 將固體電解電容器1安裝於印刷電路基板之際，由封 裝5相互反方向突出的兩導線端子3焊接於印刷電路基板 〇 藉由上述方法，在由支撐軌道1 2切離之後，各導線 端子3不只是上面、下面及2邊的側面，連先端面的一部 分（區域S )也藉由金屬電鍍層1 5成爲被覆蓋的狀態。 根據此構成，藉由區域S的存在：，.來提昇先端面的焊 錫浸濕性。因此，將固體電解電容器1安裝於印刷電路基 板之際，導線端子3的上面、下面及加上2邊的側面，該 當先端面也透過焊錫來針對印刷電路基板適切地固定。因 此，提昇固體電解電容器1的印刷電路基板的安裝強度。 此外，藉由上述方法，於切斷工程之後，沒有必要於 各導線端子3的先端面另外設置形成金屬電鍍層1 5的工 程。因此，可以企劃抑制製造費用。 如第4圖B所示，於切斷用沖壓機1 7形成的凹部1 9 ，係位置上對應於貫穿孔1 3的內壁面之中，在導線端子3 的切斷面（於第2圖中的露出面C )之間的區域S。因此 ，藉由切斷用沖壓機1 7切斷作業時，切斷用沖壓機1 7的 切斷作用面1 8，接觸區域S不會有摩擦。藉此，可以確 -12- (9) 1274357 實地防止於區域S中金屬電鍍層1 5藉由切斷用沖壓機1 7 切削。其結果，可以提昇固體電解電容器1的生產績效。 再者，運用切斷用沖壓機17及搖台16，藉由切斷各 狹橋部23，各導線端子3的先端面如第2圖所示做成平坦 面是可能的。在此構成中，於該當平坦面中金屬電鍍層1 5 的附近突起等是不存在。因此，各導線端子3的先端面的 金屬電鍍層及塗敷於印刷電路基板的焊膏較容易融合，針 對印刷電路基板提昇固體電解電容器1的安裝強度。 再者，於各導線端子3的貫穿孔13的兩側，存在狹 橋部23。因此，藉由此等兩狹橋部23，可以阻止封裝5 的成型時（封裝工程時）溶解的合成樹脂侵入貫穿孔13 內。因此，於封裝5成型後，針對各·導線端子.3的先端部 樹脂毛邊的除去作業是不必要的。 再者，貫穿孔1 3於封裝5成型前，形成各導線端子3 。因此，於封裝5成型後切斷各導線端子3之際，可以將 切斷斷面積變小。因此，切斷時的衝擊變小，可以減低針 對封裝5給各導線端子3的密接性帶來的不良影響。 第5圖爲說明基於本發明之第2實施型態的導線端子 之切斷方法的圖。於本實施型態，在導線架中各導線端子 的狹橋部爲1條（參照同圖的元件23 ’）。此種狹橋部， 係於各導線端子3的兩縱長側緣部，可以藉由各自穿設連 通上下的缺口 1 3 ’來形成。如第5圖所理解的，於各導線 端子3形成的一對缺口 1 3 ’，設置於封裝5外側的地方。 尙，於本發明中，此種缺口於各導線端子3設置1個也可 -13- (8) (10) (10)1274357 以。 與第1實施型態的情況同樣地，針對第2實施型態的 各導線端子3也施行金屬電鍍處理。此電鍍處理，係於封 裝工程之前及之後的其中之一來進行也可以。針對各導線 端子3金屬電鍍處理之後，伴隨封裝5藉由搖台1 6由下 方來支撐，運用昇降動可能的切斷用沖壓機1 7，來切斷各 狹橋部23’。此切斷，爲狹橋部23,之中離封裝5爲近的部 分來進行。如此一來，由導線架n的支撐軌道丨2切離固 體電解電容器1的完成品。 在第2實施型態中，於各切斷用沖壓機17’形成複數 的（在圖示例爲2個）凹部1 9’。藉此，切斷用沖壓機1 7, ’係具有2個非切斷機能面；及被此等非切斷機能面夾住 的切斷機能面1 8,。切斷機能面1 8’，比非切斷機能面的前 方還要突出。切斷各導線端子3之際，切斷用沖壓機17, 的切斷機能面18,於兩切口 13,中以不接觸前方內壁面（封 裝5側的內壁面）的方式來構成。爲了此實現，該切斷機 能面18’的寬度（於第5圖中測量上下方向的尺寸），與 Μ橋部23’的寬度相同或是設定成實質上相同。 於第2實施型態中，也與第1實施型態同樣地，可以 於各導線端子3的先端面留下金屬電鍍層，並可以企劃朝 印刷電路基板等的安裝強度的提昇。尙，於第2實施型態 中’導線端子3的先端面，係成爲留下相互間隔的2個金 屬電鍍層。 第6圖爲說明本發明之第3實施型態的圖。於導線端 -14- (11) (11)1274357 子3中，與第1實施型態同樣地，設置貫穿孔1 3。另一方 面，與第1實施型態不同，第3實施型態的切斷用沖壓機 1 7 ”，係具有全體平坦的切斷機能面1 8 ”，沒有設置凹部。 於此種構成中，切斷機能面1 8 "切斷狹橋部2 3之同時，於 貫穿孔1 3中以不接觸封裝5側的內壁面（金屬電鍍層形 成區域S )的方式來設定切斷位置是可能的。具體來說， 如第6圖所不，切斷機能面1 8 ’’由貫穿孔1 3的上述內壁面 的後方（遠離封裝5的方向）適宜間隔的方式來設定即可 〇 於第3實施型態中，導線端子3的切斷面與金屬電鍍 層形成區域S實質上做成整面是可能的。此外，於第3實 施型態中，沒有必要準備持有複雜形狀的切斷用沖壓機的 點是有利的。 適用本發明的電子零件，不限於上述的固體電解電容 器，也可以如電晶體等具備3個以上的導線端子。此外， 半導體晶片與各導線端子，沒有必要直接的導通，也可以 例如藉由細的金屬線以線焊接來連接。 其他’各部的構成不限於參照圖來說明的實施型態， 在不脫離本發明之要旨的範圔各種變更是可能的。 【圖式簡單說明】 第1圖爲表示利用基於本發明之第1實施型態的方法 來製造固體電解電容器的剖面圖。 第2圖爲表示第1圖的固體電解電容器之底面側的立 -15- (12) 1274357 體圖。 第3圖爲表示運用第1圖的固體電解電容器之製造的 導線架的立體圖。 第4圖A爲說明基於本發明之第1實施型態的方法的 部分剖面圖，第4圖B爲於第4圖A中沿著IVb — IVb線 的剖面圖。 第5圖爲說明基於本發明之第2實施型態的方法的圖 φ ，相當於第4圖B的剖面圖。 第6圖爲說明基於本發明之第3實施型態的方法的圖 ，相當於第4圖B的剖面圖。 【主要元件符號說明】. 1 :固體電解電容器 2 :電容器元件 3 :導線端子 • 3 a :陽極導線端子 3 b :陰極導線端子 - 5 :封裝 6 : 晶片 7 :陽極棒 8 :陰極膜 9 :連接片 1 1 :導線架 1 2 :支撐軌道 -16- (13)1274357 1 3 :貫穿孔 1 3，：缺口 1 5 :金屬電鍍層 16 :搖台 1 7、1 7 ’、1 7 ” ：切斷用沖壓機 1 8 :切斷作用面 1 8 ’、1 8 ” ：切斷機能面 1 9、1 9 ’ ：凹部 2 3、2 3 ’ ：狹橋部 C :露出面 S :區域1274357 (1) Description of the Invention [Technical Field of the Invention] The present invention relates to a method of manufacturing an electronic component having a resin package. In particular, the present invention relates to a method of cutting a lead terminal protruding from a resin package. The electronic component referred to herein is, for example, a capacitor or a semiconductor integrated circuit. [Prior Art] The following Patent Document 1 discloses a solid electrolytic capacitor which is an example of a package type electronic component. The solid electrolytic capacitor is a package including a thermosetting synthetic resin; and an anode lead terminal and a cathode lead terminal protruding from the package. In the package, a capacitor element is provided. The capacitor element includes a wafer having a metal material (hereinafter referred to simply as "valve action metal"), an anode rod protruding from one end surface of the wafer, and a cathode film formed on the outer peripheral surface of the wafer. . The anode rod and the cathode film are respectively connected to the anode lead terminal and the cathode lead terminal. The above conventional solid electrolytic capacitor is manufactured as follows. First, a lead frame with a specific pattern is prepared. The lead frame is provided with two support rails extending in parallel with each other; and a plurality of pairs of lead terminals (anode lead terminals and cathode lead terminals) disposed between the support rails. In each pair, the anode lead terminal and the cathode lead terminal are disposed to face each other. For these anode lead terminals and cathode lead terminals, a metal plating layer (for example, a tin plating layer) is formed by performing a plating treatment. Next, a capacitor element is disposed between -5 - (2) (2) 1274357 between each anode lead terminal and its corresponding cathode lead terminal. At this time, the anode rod is at the anode lead terminal, and the cathode film is electrically connected to each other at the cathode lead terminal. Next, the entire capacitor element is sealed with a resin package. Finally, the portion of each of the wire terminals that protrudes from the package is cut. The cutting is performed by a press machine that can be cut by lifting. In this way, a solid electrolytic capacitor separated by the support rail can be obtained. When the solid electrolytic capacitor is mounted on a printed circuit board or the like, the two lead terminals protruding from the package are soldered to the printed circuit board. According to the above conventional technique, the lead terminal which has been previously formed by the tin plating layer is cut by a cutting press. Therefore, the leading end faces of the respective lead terminals, that is, the faces cut by the press, cannot be covered with the tin plating layer. As a result, it is difficult for the flux to adhere to the leading end faces of the respective lead terminals, and when the solid electrolytic capacitor is mounted on the printed circuit board, there is a problem that sufficient mounting strength cannot be obtained. SUMMARY OF THE INVENTION The present invention has been made in an effort to solve the above problems, and to provide a method for cutting a lead terminal of a package type electronic component. According to the present invention, there is provided a package having a resin, and an element covering the package, and a wire terminal including a wire terminal of the protrusion protruding from the package to the outside by the package to the lead terminal of the package type electronic component. Break method. The method includes a step of forming a bridge portion at the lead terminal by removing a part of the protruding portion, a process of performing a metal shovel treatment on the protruding portion, and cutting the -6 at a position of the narrow bridge portion - (3) (3) 1274357 Wire terminal construction. The bridge portion is provided by forming a notch, a through hole, or the like in the protruding portion of the lead terminal. According to the above method, after the narrow bridge portion is formed by removing a portion of the protruding portion of the lead terminal from the lead terminal, a metal plating process is performed on the protruding portion. Thereafter, the lead terminal is cut at the position of the bridge portion. As a result, in the lead terminals after the cutting, not only the upper surface, the lower surface, and the side surfaces of the two sides, but also a part of the first end surface may have a metal plating layer remaining thereon. According to the above configuration, when the package type capacitor is mounted on the printed circuit board or the like, the solder wettability of the front end surface of the lead terminal is improved. Therefore, an effect of improving the mounting strength of the printed circuit board of the capacitor is obtained. Further, after the work of cutting the above-mentioned wire terminal, since it is not necessary to additionally provide a process of forming a metal plating layer on the front end surface of the above-mentioned wire terminal, the effect of suppressing the manufacturing cost is obtained. Preferably, the cutting of the lead terminal is performed by using a cutting press and a cradle. The cutting press machine includes a cutting function portion that abuts against the lead terminal, and a non-cutting function portion that does not abut the lead terminal. The cutting function portion may be formed to protrude toward the package as a reference for the non-cutting function portion. Such a configuration is possible by forming a concave portion on the cut surface side of the cutting press. By using such a cutting press, the formation end of the metal plating layer is left at the leading end of the lead terminal of the obtained packaged electronic component. 8 (4) 1274357 According to the present invention, for example, the portion closest to the package is cut out among the aforementioned bridge portions. In this manner, the cut end surface of the lead terminal after cutting (the surface on which a part of the lead terminal is directly exposed) and the coated surface covered with the metal plating layer are flat surfaces on the entire surface. That is, there is no step or protrusion in the leading end face of the aforementioned wire terminal. As a result, the metal plating layer covering the tip end side of the lead terminal and the soldering paste applied to the printed circuit board or the like are easily fused. [Embodiment] First, a method according to a first embodiment of the present invention will be described with reference to Figs. 1 to 4B. Among the above figures, Fig. 1 and Fig. 2 are schematic diagrams showing a configuration in which a package type electronic component is obtained by the above method. The illustrated electronic component is a solid electrolytic capacitor, but this is by way of example, and the object of application of the present invention is not limited to a solid electrolytic capacitor. 9 as shown in Fig. 1, the solid electrolytic capacitor 1 includes a capacitor element 2, and a pair of lead terminals 3 (anode lead terminal 3a and cathode lead-terminal 3b); and a thermosetting synthetic resin. Package 5. Each wire terminal is made of a metal plate. The package 5 is a sealed capacitor element 2 as a whole. Each of the lead terminals 3 is partially covered by the package 5, but the other portion is exposed outside the package 5 (see also Fig. 2). Further, each of the lead terminals 3 is protruded from the package 5 in the horizontal direction. The capacitor element 2' is provided with a wafer 6; and an anode rod 7 projecting from one end surface (the right end surface of Fig. 1) of the wafer. The wafer 6 is a porous body made of a powder of a valve action metal such as -8-(5) 1274357 1 * molybdenum. Similarly, the anode rod 7 is also made of a valve metal. Although not shown in the drawing, a dielectric film having high electrical insulating properties is formed on the wafer 6. Further, on the wafer 6 (correctly on the dielectric film), a solid electrolyte layer is formed in addition to the portion of the right end surface. Further, on the solid electrolyte layer, a cathode film 8 is formed. As shown in Fig. 1, in the anode lead terminal 3a, a connecting piece 9 which is erected in an upright manner is welded. Such an upright setting portion can also be formed by the bent portion of the anode lead terminal 3a. The connecting piece 9 is an anode rod 7 for the capacitor element 2, and is electrically connected by a conductive paint or a solder paste. On the other hand, the upper surface portion of the cathode lead terminal 3 is electrically connected to the cathode film 8 by means of a conductive paint, solder paste or welding. Next, an example of a method of manufacturing the solid electrolytic capacitor 1 described above will be described with reference to Figs. 3, 4A and 4B. ® First, the lead frame 11 is prepared by stamping one sheet of metal as shown in Fig. 3. The lead frame 1 1 is provided with a pair of support rails 1 2 extending in parallel with each other; and a plurality of pairs of lead terminals (anode lead terminals and cathode lead terminals) 3 (only a pair of lead terminals 3 are shown in Fig. 3). The complex pair of the lead terminals 3 is an interval spaced apart by a specific distance in the longitudinal direction of the support rail. Each of the lead terminals 3 is formed to extend at right angles to the other support rails by one of the support rails, and is configured to oppose the other lead terminals 3. Further, in each of the lead terminals 3, a through hole 13 penetrating the fifth direction is formed in the vertical direction. As shown in Fig. 3, each of the through holes 13 of -9-(6) (6) 1274357 is located outside the package 5 formed later. Each of the through holes 1 3 is sandwiched by both sides by a pair of bridge portions 2 3 . Next, as shown in Fig. 3, the upper connecting piece 9 is welded to the free end portion of the anode lead terminal 3. Such an upward connection portion may be formed by bending the free end portion of the anode lead terminal 3. Next, a nickel plating layer (not shown) as a base layer and a metal plating layer 15 excellent in solder wettability are formed by metal plating treatment for each wire terminal 3 (see Fig. 1). The metal plating layer 15 is made of, for example, tin or solder. Such a metal plating treatment may be performed for all of the lead terminals 3, and may be performed only for a part thereof. However, in the latter case, it is necessary to perform the plating treatment at least in the portion of the lead terminal 3 where the package 5 protrudes outward. By this metal plating treatment, the inner wall surface of each of the through holes 13 is also covered by the metal plating layer 15. Next, as shown in Fig. 3, the capacitor element 2 is placed between the pair of lead terminals 3, and the anode rod 7 is brought into contact with the connecting piece 9. Next, the anode rod 7 is adhered to the connecting lead piece 9 and the cathode film 8 at the cathode lead terminal 3 by electrically conductive paint or solder paste. Next, a package 5 covering the entire capacitor element 2 is formed. The package 5 can be formed by the following methods. First, a template (not shown) having a cavity of a specific size is placed on the upper surface of the lead frame 11. At this time, the capacitor element 2 is housed in the cavity of the template. Next, after the capacitor element 2 is completely immersed, a liquid thermosetting synthetic resin is introduced into the cavity. Finally, the metal plating treatment for the lead terminal 3 is formed by hardening the supply resin, and the metal plating treatment for the lead terminal 3 is performed after the sealing of the 10-(S) (7) (7) 1274357 package. . In this case, the underlying layer and the metal plating layer 15 are formed on the exposed portion of the lead terminal 3 (the portion not covering the package 5). After the package 5 is formed, as shown in Fig. 4a, the package 5 is supported by the lower side by the cradle 16. Next, each of the narrow bridge portions 2 3 (cutting work) is cut by a press machine 17 for cutting the lift. As a result, the finished product of the solid electrolytic capacitor 1 (see Figs. 1 and 2) is separated by a pair of support rails 1 2 . As shown in Fig. 4B, the cutting action surface 18 of each of the cutting presses 17 is formed with a concave portion 19 extending in the vertical direction. Or, in the case of other insights, each of the cutting presses 17 has two cutting action surfaces 18 separated by a recess 19, and each cutting action surface 18 is for a non-cutting action surface. (The bottom surface of the recess 19) is to protrude in front (toward the package 5). According to this configuration, the region S formed by the metal plating layer 15 (and its underlying layer) can be left on the cut surface of each of the lead terminals 3 (see Fig. 2). This region S, as understood from Fig. 3 and Fig. 4B, corresponds to the side on the side of the package 5 among the four inner wall surfaces of the through hole 13. As shown in Fig. 2, the region S constitutes a portion of the leading end face of the lead terminal 3 and is located between the exposed faces C (the portion where the metal plating layer 15 is not formed). The cutting action surface 18 of the press machine 17 is cut to cut the wire terminal 3. At this time, the cutting action surface 18 is formed only by cutting the narrow bridge portion 23 without contacting the region S. In order to achieve this, the width of the concave portion 19 (the size measured in the vertical direction in Fig. 4B) is the same as the width of the through hole 13 or -11 - (8) (8) 1274357 is set substantially the same. The front end faces of the respective lead terminals 3 cut away from the support rails 12 are a flat surface formed by two exposed faces C and a region S covered with a metal plating layer as shown in Fig. 2 . That is, the exposed surface C and the region S are the entire surfaces of each other. When the solid electrolytic capacitor 1 is mounted on the printed circuit board, the two lead terminals 3 protruding from the package 5 in opposite directions are soldered to the printed circuit board, and after being cut away from the support rail 12 by the above method, the lead terminals 3 are cut. Not only the upper, lower, and side faces of the two sides, but also a part of the first end face (region S) is also covered by the metal plating layer 15. According to this configuration, the solder wettability of the front end face is improved by the presence of the region S:. Therefore, when the solid electrolytic capacitor 1 is mounted on the printed circuit board, the upper surface and the lower surface of the lead terminal 3 and the side surfaces on both sides are added, and the leading end surface is also appropriately fixed to the printed circuit board by solder. Therefore, the mounting strength of the printed circuit board of the solid electrolytic capacitor 1 is improved. Further, by the above method, after the cutting process, it is not necessary to additionally provide a process of forming the metal plating layer 15 on the leading end faces of the respective lead terminals 3. Therefore, it is possible to plan to suppress manufacturing costs. As shown in Fig. 4B, the recessed portion 19 formed in the cutting press machine 17 is positioned at the cut surface of the lead terminal 3 corresponding to the inner wall surface of the through hole 13 (Fig. 2) The area S between the exposed faces C). Therefore, when the cutting operation is performed by the cutting press 17, the cutting action surface 18 of the cutting press 1 7 is not rubbed in the contact region S. Thereby, it can be confirmed that -12-(9) 1274357 is prevented from being cut in the region S by the metal plating layer 15 in the region S by the cutting press 1 7 . As a result, the production performance of the solid electrolytic capacitor 1 can be improved. Further, by cutting the punching machine 17 and the cradle 16, by cutting each of the bridge portions 23, it is possible to form a flat end surface of each of the lead terminals 3 as shown in Fig. 2 as a flat surface. In this configuration, the protrusion or the like in the vicinity of the metal plating layer 15 in the flat surface does not exist. Therefore, the metal plating layer on the front end surface of each of the lead terminals 3 and the solder paste applied to the printed circuit board are easily fused, and the mounting strength of the solid electrolytic capacitor 1 is improved for the printed circuit board. Further, on both sides of the through hole 13 of each of the lead terminals 3, a narrow bridge portion 23 is present. Therefore, by the two narrow bridge portions 23, it is possible to prevent the synthetic resin dissolved during the molding of the package 5 (during the packaging process) from entering the through hole 13. Therefore, after the package 5 is molded, the removal of the resin burrs at the tip end portions of the respective lead terminals .3 is unnecessary. Further, the through holes 13 are formed before the packages 5 are formed, and the respective lead terminals 3 are formed. Therefore, when the lead wires 3 are cut after the package 5 is molded, the cut-off area can be made small. Therefore, the impact at the time of cutting becomes small, and the adverse effect on the adhesion of the package 5 to the respective lead terminals 3 can be reduced. Fig. 5 is a view for explaining a method of cutting a lead terminal according to a second embodiment of the present invention. In the present embodiment, the number of the bridge portions of the lead terminals in the lead frame is one (refer to the element 23' of the same figure). Such a bridge portion is formed on both longitudinal side edges of the lead terminals 3, and can be formed by respectively penetrating the upper and lower notches 1 3 '. As understood from Fig. 5, a pair of notches 1 3 ' formed in the respective lead terminals 3 are provided outside the package 5. In the present invention, such a notch may be provided in each of the lead terminals 3 by -13-(8) (10) (10) 1274357. Similarly to the case of the first embodiment, the respective lead terminals 3 of the second embodiment are also subjected to metal plating treatment. This plating treatment may be carried out one of before and after the sealing work. After the metal plating process of each of the lead terminals 3 is carried out, the package 5 is supported by the lower side of the cradle 16 and the respective narrow bridge portions 23' are cut by the press machine 17 for cutting the lift. This cutting is performed in a portion in which the bridge portion 23 is close to the package 5. As a result, the finished product of the solid electrolytic capacitor 1 is cut by the support rail 丨 2 of the lead frame n. In the second embodiment, a plurality of (two in the illustrated example) recesses 1 9' are formed in each of the cutting presses 17'. Thereby, the cutting press 1 7 ' has two non-cutting functional surfaces; and the cutting function surface 18 which is sandwiched by the non-cutting functional surfaces. Cut off the functional surface 1 8', which is more prominent than the front side of the non-cutting function surface. When the respective lead terminals 3 are cut, the cutting function surface 18 of the cutting press machine 17 is configured so as not to contact the front inner wall surface (the inner wall surface on the side of the package 5) in the two slits 13. To achieve this, the width of the cutting machine surface 18' (the size measured in the vertical direction in Fig. 5) is the same as the width of the bridge portion 23' or is set to be substantially the same. Also in the second embodiment, as in the first embodiment, the metal plating layer can be left on the front end faces of the respective lead terminals 3, and the mounting strength to the printed circuit board or the like can be improved. That is, in the second embodiment, the leading end faces of the lead terminals 3 are two metal plating layers which are spaced apart from each other. Fig. 6 is a view for explaining a third embodiment of the present invention. In the wire end -14-(11) (11) 1274357 sub 3, the through hole 13 is provided in the same manner as in the first embodiment. On the other hand, unlike the first embodiment, the cutting press 1 7 ′′ of the third embodiment has a flat cutting function surface 1 8 ′′, and no recess is provided. In such a configuration, the cutting surface 11 "cuts the narrow bridge portion 23, and the inner wall surface (metal plating layer forming region S) on the side of the package 5 is not in contact with the through hole 13; It is possible to set the cut position. Specifically, as shown in Fig. 6, the cutting function surface 18'' is set so as to be appropriately spaced from the rear of the inner wall surface of the through hole 13 (in a direction away from the package 5). In the form, it is possible that the cut surface of the wire terminal 3 and the metal plating layer forming region S are substantially formed as a whole surface. Further, in the third embodiment, it is not necessary to prepare a point for holding a punching machine having a complicated shape. The electronic component to which the present invention is applied is not limited to the above-described solid electrolytic capacitor, and may have three or more lead terminals such as a transistor. Further, the semiconductor wafer and each of the lead terminals are not necessarily directly turned on, and may be connected by wire bonding, for example, by a thin metal wire. The configuration of the other parts is not limited to the embodiment described with reference to the drawings, and various modifications are possible without departing from the gist of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing the manufacture of a solid electrolytic capacitor by the method according to the first embodiment of the present invention. Fig. 2 is a perspective view showing the vertical -15-(12) 1274357 of the bottom surface side of the solid electrolytic capacitor of Fig. 1. Fig. 3 is a perspective view showing a lead frame using the manufacture of the solid electrolytic capacitor of Fig. 1. Fig. 4A is a partial cross-sectional view showing a method according to a first embodiment of the present invention, and Fig. 4B is a cross-sectional view taken along line IVb - IVb in Fig. 4A. Fig. 5 is a cross-sectional view corresponding to Fig. 4B, illustrating a diagram φ according to a method of the second embodiment of the present invention. Fig. 6 is a view for explaining a method according to a third embodiment of the present invention, and corresponds to a cross-sectional view of Fig. 4B. [Description of main component symbols]. 1 : Solid electrolytic capacitor 2 : Capacitor component 3 : Wire terminal • 3 a : Anode wire terminal 3 b : Cathode wire terminal - 5 : Package 6 : Wafer 7 : Anode bar 8 : Cathode film 9 : Connecting piece 1 1 : lead frame 1 2 : support track - 16 - (13) 1274357 1 3 : through hole 1 3, notch 1 5 : metal plating layer 16 : cradle 1 7 , 1 7 ', 1 7 ” : Pressing machine for cutting 1 8 : Cutting action surface 1 8 ', 1 8 ′ : Cutting function surface 1 9 , 1 9 ' : recess 2 3, 2 3 ' : narrow bridge C: exposed surface S : area
-17- (S)-17- (S)