TW200629315A - Method for cutting lead terminal of packaged electronic component - Google Patents

Method for cutting lead terminal of packaged electronic component

Info

Publication number
TW200629315A
TW200629315A TW095102334A TW95102334A TW200629315A TW 200629315 A TW200629315 A TW 200629315A TW 095102334 A TW095102334 A TW 095102334A TW 95102334 A TW95102334 A TW 95102334A TW 200629315 A TW200629315 A TW 200629315A
Authority
TW
Taiwan
Prior art keywords
lead terminal
electronic component
packaged electronic
cutting lead
cutting
Prior art date
Application number
TW095102334A
Other languages
Chinese (zh)
Other versions
TWI274357B (en
Inventor
Masahiro Noda
Masahiko Kobayakawa
Tadatoshi Miwa
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200629315A publication Critical patent/TW200629315A/en
Application granted granted Critical
Publication of TWI274357B publication Critical patent/TWI274357B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Abstract

Disclosed is a method for cutting a lead terminal of a packaged electronic component comprising a resin package (5), a device (2) covered by the package (5) and a lead terminal (3) electrically connected with the device (2) and having a protrusion projecting outside from the package (5). This method comprises a step for providing the lead terminal (3) with a narrow bridge portion (23) by removing a part of the protrusion, a step for metal plating the protrusion of the lead terminal (3), and a step for cutting the lead terminal (3) at the position of the narrow bridge portion (23).
TW095102334A 2005-01-21 2006-01-20 Method for cutting lead terminal of packaged electronic component TWI274357B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005014351A JP2008117793A (en) 2005-01-21 2005-01-21 Method for cutting lead terminal in package type electronic component

Publications (2)

Publication Number Publication Date
TW200629315A true TW200629315A (en) 2006-08-16
TWI274357B TWI274357B (en) 2007-02-21

Family

ID=36692259

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102334A TWI274357B (en) 2005-01-21 2006-01-20 Method for cutting lead terminal of packaged electronic component

Country Status (5)

Country Link
JP (1) JP2008117793A (en)
KR (1) KR20070094654A (en)
CN (1) CN101107687A (en)
TW (1) TWI274357B (en)
WO (1) WO2006077870A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101286417B (en) * 2007-03-09 2011-02-02 Nec东金株式会社 Solid electrolytic capacitor and manufacturing method thereof
JP5181236B2 (en) * 2008-03-19 2013-04-10 松尾電機株式会社 Chip capacitor
KR101067210B1 (en) * 2008-12-08 2011-09-22 삼성전기주식회사 Solid electrolytic capacitor
JPWO2017141844A1 (en) * 2016-02-19 2018-12-06 パナソニックＩｐマネジメント株式会社 Capacitor and capacitor manufacturing method
CN107824953B (en) * 2017-09-06 2020-06-19 木林森股份有限公司 Method for producing LED illuminating product by adopting induction heating welding technology

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3666594B2 (en) * 2002-10-17 2005-06-29 ローム株式会社 Cutting method of lead terminals in package type electronic components
JP2005000552A (en) * 2003-06-13 2005-01-06 Olympus Corp Capsule endoscope

Also Published As

Publication number Publication date
KR20070094654A (en) 2007-09-20
JP2008117793A (en) 2008-05-22
TWI274357B (en) 2007-02-21
CN101107687A (en) 2008-01-16
WO2006077870A1 (en) 2006-07-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees