CN101103057A - 喷墨用固化性树脂组合物、及其固化物以及使用其的印刷线路板 - Google Patents
喷墨用固化性树脂组合物、及其固化物以及使用其的印刷线路板 Download PDFInfo
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- CN101103057A CN101103057A CNA2006800022502A CN200680002250A CN101103057A CN 101103057 A CN101103057 A CN 101103057A CN A2006800022502 A CNA2006800022502 A CN A2006800022502A CN 200680002250 A CN200680002250 A CN 200680002250A CN 101103057 A CN101103057 A CN 101103057A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a single or double bond to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F236/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F236/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
- C08F236/20—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds unconjugated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
实施例 | 比较例1 | ||||||||||||
成分 | 具体名称 | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | |
A | 双烯丙基纳迪克酰亚胺1*1 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | - | 8 | 10 |
双烯丙基纳迪克酰亚胺2*2 | - | - | - | - | - | - | - | - | 8 | - | - | - | |
双烯丙基纳迪克酰亚胺3*3 | - | - | - | - | - | - | - | - | - | 8 | - | - | |
B | 马来酰亚胺1*4 | 2 | 2 | 2 | 2 | - | - | - | - | 2 | 2 | 2 | - |
马来酰亚胺2*5 | - | - | - | - | 2 | - | - | - | - | - | - | - | |
马来酰亚胺3*6 | - | - | - | - | - | 2 | - | - | - | - | - | - | |
马来酰亚胺4*7 | - | - | - | - | - | - | 2 | - | - | - | - | - | |
马来酰亚胺5*8 | - | - | - | - | - | - | - | 2 | - | - | - | - | |
C | 稀释剂1*9 | 10 | - | - | - | - | - | - | - | - | - | 2 | - |
稀释剂2*10 | - | 10 | - | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 8 | 10 | |
稀释剂3*11 | - | - | 10 | - | - | - | - | - | - | - | - | - | |
其它 | 引发剂1*12 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
添加剂1*13 | - | - | - | 0.01 | - | - | - | - | - | - | - | - | |
合计 | 20.2 | 20.2 | 20.2 | 20.21 | 20.2 | 20.2 | 20.2 | 20.2 | 20.2 | 20.2 | 20.2 | 20.2 | |
备注 | *1:通式(1)的R1为式(5)所示的双烯丙基纳迪克酰亚胺(丸善石油化学公司生产的BANI-X)*2:通式(1)的R1为式(4)所示的双烯丙基纳迪克酰亚胺(丸善石油化学公司生产的BANI-H)*3:通式(1)的R1为式(3)所示的双烯丙基纳迪克酰亚胺(丸善石油化学公司生产的BANI-M)u*4:通式(2)的R2为式(9)所示的双马来酰亚胺(K·I CHEMICAL INDUSTRY CO.,LTD.生产的BMI-80)*5:通式(2)的R2为式(7)所示的双马来酰亚胺(K·I CHEMICAL INDUSTRY CO.,LTD.生产的BMI-70)*6:通式(2)的R2为式(6)所示的双马来酰亚胺(K·I CHEMICAL INDUSTRY CO.,LTD.生产的BMI)*7:通式(2)的R2为式(8)所示的双马来酰亚胺(大和化成工业公司生产的BMI-3000)*8:大日本油墨化学工业公司生产的双马来酰亚胺(MIE-200)*9:丙二醇单甲醚醋酸酯*10:甲基丙烯酸甲氧基二乙二醇酯(新中村化学公司生产的M-20G)*11:丙烯酸4-羟基丁酯*12:2-甲基-1-[4-(甲硫基)苯基]-2-吗啉代丙烷-1-酮*13:酞菁绿 |
实施例 | 比较例1 | |||||||||||
1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | ||
粘度(mPa·s) | 18 | 44 | 110 | 19 | 19 | 19 | 19 | 20 | 19 | 20 | 25 | 64 |
涂膜硬度 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × |
耐溶剂性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × |
耐化学药品性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | △ |
焊料耐热性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × |
耐无电解镀金性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | △ |
固化性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | × |
保存稳定性 | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP004766/2005 | 2005-01-12 | ||
JP2005004766 | 2005-01-12 | ||
PCT/JP2006/300279 WO2006075654A1 (ja) | 2005-01-12 | 2006-01-12 | インクジェット用硬化性樹脂組成物、及びその硬化物並びにそれを用いたプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101103057A true CN101103057A (zh) | 2008-01-09 |
CN101103057B CN101103057B (zh) | 2010-10-13 |
Family
ID=36677679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800022502A Active CN101103057B (zh) | 2005-01-12 | 2006-01-12 | 喷墨用固化性树脂组合物、及其固化物以及使用其的印刷线路板 |
Country Status (9)
Country | Link |
---|---|
US (2) | US20070270568A1 (zh) |
EP (1) | EP1857478B1 (zh) |
JP (1) | JP5222475B2 (zh) |
KR (1) | KR100890086B1 (zh) |
CN (1) | CN101103057B (zh) |
AT (1) | ATE441678T1 (zh) |
DE (1) | DE602006008901D1 (zh) |
TW (1) | TWI391424B (zh) |
WO (1) | WO2006075654A1 (zh) |
Cited By (7)
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CN103192602A (zh) * | 2012-01-06 | 2013-07-10 | 住友重机械工业株式会社 | 薄膜形成装置及薄膜形成方法 |
CN103568612A (zh) * | 2013-11-06 | 2014-02-12 | 复旦大学 | 一种基于压电式家用喷墨打印技术制备印制电子阻焊材料的方法 |
CN105785708A (zh) * | 2015-01-13 | 2016-07-20 | 施乐公司 | 用于气溶胶喷射打印的焊接掩模组合物 |
CN105900535A (zh) * | 2014-01-07 | 2016-08-24 | 三菱瓦斯化学株式会社 | 印刷线路板用绝缘层以及印刷线路板 |
CN106590177A (zh) * | 2016-12-30 | 2017-04-26 | 深圳市明鑫高分子技术有限公司 | 石墨烯导电油墨及其制备方法 |
CN107709456A (zh) * | 2015-07-06 | 2018-02-16 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料、树脂片、覆金属箔层叠板及印刷电路板 |
CN110054731B (zh) * | 2019-05-10 | 2021-01-05 | 济南大学 | 一种可逆酸碱致变色的马来酰亚胺共聚物的制备方法 |
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TW200835754A (en) * | 2006-11-16 | 2008-09-01 | Chisso Corp | Ink-jet ink |
JP2008214607A (ja) * | 2007-02-09 | 2008-09-18 | Chisso Corp | 光硬化性インクジェット用インク |
US20080233307A1 (en) * | 2007-02-09 | 2008-09-25 | Chisso Corporation | Photocurable inkjet ink |
JP5604869B2 (ja) * | 2007-03-29 | 2014-10-15 | Jnc株式会社 | インクジェット用インク |
KR20080092839A (ko) * | 2007-04-12 | 2008-10-16 | 칫소가부시키가이샤 | 잉크젯용 잉크 |
JP5282415B2 (ja) * | 2008-02-29 | 2013-09-04 | Jnc株式会社 | インクジェット用インク |
JP2009227778A (ja) * | 2008-03-21 | 2009-10-08 | Mitsubishi Rayon Co Ltd | 活性エネルギー線硬化性組成物、硬化物の製造方法及び積層体。 |
JP5157831B2 (ja) * | 2008-10-31 | 2013-03-06 | Jnc株式会社 | アルケニル置換ナジイミド、溶媒および硬化剤を含む組成物および該組成部の用途 |
JP4773497B2 (ja) * | 2008-11-07 | 2011-09-14 | 株式会社タムラ製作所 | マスキング材料、マスキング材料を用いたはんだペーストの印刷方法及びはんだバンプ形成方法 |
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JP5114454B2 (ja) * | 2009-06-04 | 2013-01-09 | 株式会社ミマキエンジニアリング | インクおよびインクジェットプリンタ並びにプリント方法 |
WO2011085281A1 (en) * | 2010-01-11 | 2011-07-14 | Isp Investments Inc. | Compositions comprising a reactive monomer and uses thereof |
JP5615600B2 (ja) | 2010-06-09 | 2014-10-29 | 富士フイルム株式会社 | インクジェット記録用インク組成物、インクジェット記録方法及びインクジェット印画物 |
JPWO2011158593A1 (ja) * | 2010-06-16 | 2013-08-19 | コニカミノルタ株式会社 | 光硬化性のインクジェットインク、画像形成方法、マレイミド誘導体、及び光硬化性組成物 |
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JP5735238B2 (ja) * | 2010-09-02 | 2015-06-17 | 積水化学工業株式会社 | インクジェット用硬化性組成物及びプリント配線板の製造方法 |
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-
2006
- 2006-01-11 TW TW95101064A patent/TWI391424B/zh active
- 2006-01-12 DE DE200660008901 patent/DE602006008901D1/de active Active
- 2006-01-12 KR KR20077015840A patent/KR100890086B1/ko active IP Right Grant
- 2006-01-12 AT AT06711602T patent/ATE441678T1/de active
- 2006-01-12 CN CN2006800022502A patent/CN101103057B/zh active Active
- 2006-01-12 WO PCT/JP2006/300279 patent/WO2006075654A1/ja active Application Filing
- 2006-01-12 EP EP20060711602 patent/EP1857478B1/en active Active
- 2006-01-12 JP JP2006552959A patent/JP5222475B2/ja active Active
-
2007
- 2007-07-12 US US11/776,643 patent/US20070270568A1/en not_active Abandoned
-
2011
- 2011-02-02 US US13/019,743 patent/US20110120753A1/en not_active Abandoned
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103192602B (zh) * | 2012-01-06 | 2016-05-04 | 住友重机械工业株式会社 | 薄膜形成装置及薄膜形成方法 |
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KR100890086B1 (ko) | 2009-03-24 |
US20110120753A1 (en) | 2011-05-26 |
DE602006008901D1 (de) | 2009-10-15 |
KR20070089226A (ko) | 2007-08-30 |
EP1857478A1 (en) | 2007-11-21 |
EP1857478A4 (en) | 2008-05-14 |
TW200635983A (en) | 2006-10-16 |
EP1857478B1 (en) | 2009-09-02 |
WO2006075654A1 (ja) | 2006-07-20 |
JP5222475B2 (ja) | 2013-06-26 |
JPWO2006075654A1 (ja) | 2008-06-12 |
CN101103057B (zh) | 2010-10-13 |
TWI391424B (zh) | 2013-04-01 |
ATE441678T1 (de) | 2009-09-15 |
US20070270568A1 (en) | 2007-11-22 |
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