CN101044209B - 聚硅氧烷组合物和固化的有机硅树脂 - Google Patents

聚硅氧烷组合物和固化的有机硅树脂 Download PDF

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Publication number
CN101044209B
CN101044209B CN2005800362069A CN200580036206A CN101044209B CN 101044209 B CN101044209 B CN 101044209B CN 2005800362069 A CN2005800362069 A CN 2005800362069A CN 200580036206 A CN200580036206 A CN 200580036206A CN 101044209 B CN101044209 B CN 101044209B
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China
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sio
viscosity
component
carbon
silicon
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Expired - Fee Related
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CN2005800362069A
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English (en)
Chinese (zh)
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CN101044209A (zh
Inventor
M·A·施密斯
B·祝
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Dow Silicones Corp
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Dow Corning Corp
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Publication of CN101044209A publication Critical patent/CN101044209A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
CN2005800362069A 2004-11-19 2005-11-01 聚硅氧烷组合物和固化的有机硅树脂 Expired - Fee Related CN101044209B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US62962004P 2004-11-19 2004-11-19
US60/629,620 2004-11-19
US65244205P 2005-02-11 2005-02-11
US60/652,442 2005-02-11
PCT/US2005/039376 WO2006055231A1 (en) 2004-11-19 2005-11-01 Silicone composition and cured silicone resin

Publications (2)

Publication Number Publication Date
CN101044209A CN101044209A (zh) 2007-09-26
CN101044209B true CN101044209B (zh) 2011-01-19

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CN2005800362069A Expired - Fee Related CN101044209B (zh) 2004-11-19 2005-11-01 聚硅氧烷组合物和固化的有机硅树脂

Country Status (8)

Country Link
US (1) US7687587B2 (enExample)
EP (1) EP1814952B1 (enExample)
JP (1) JP4870681B2 (enExample)
KR (1) KR101214825B1 (enExample)
CN (1) CN101044209B (enExample)
AT (1) ATE442417T1 (enExample)
DE (1) DE602005016594D1 (enExample)
WO (1) WO2006055231A1 (enExample)

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US20100273011A1 (en) * 1996-12-20 2010-10-28 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
WO2008079179A1 (en) 2006-12-20 2008-07-03 Dow Corning Corporation Glass substrates coated or laminated with cured silicone resin compositions
JP5091249B2 (ja) * 2006-12-20 2012-12-05 ダウ・コーニング・コーポレイション 多層の硬化シリコーン樹脂組成物で被覆またはラミネートされたガラス基板
JP2011518893A (ja) * 2008-03-04 2011-06-30 ダウ・コーニング・コーポレイション ボロシロキサン組成物、ボロシロキサン接着剤、塗装基板及び積層基板
JP2011516626A (ja) * 2008-03-04 2011-05-26 ダウ・コーニング・コーポレイション シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板
CN101531868B (zh) * 2008-03-14 2013-06-26 陶氏康宁公司 用于高固含量溶剂涂布方法的有机硅防粘涂料混合物
US20110045277A1 (en) * 2008-05-27 2011-02-24 Nathan Greer Adhesive Tape and Laminated Glass
TW201004795A (en) * 2008-07-31 2010-02-01 Dow Corning Laminated glass
JP5793824B2 (ja) * 2009-06-02 2015-10-14 Jnc株式会社 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
EP2573129B1 (en) * 2010-05-18 2016-08-17 JNC Corporation Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound
JP2014500897A (ja) 2010-11-09 2014-01-16 ダウ コーニング コーポレーション 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂
TWI435914B (zh) * 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
EP2706095B1 (en) 2011-05-04 2021-03-03 LG Chem, Ltd. Curable composition
JP5618903B2 (ja) * 2011-05-23 2014-11-05 信越化学工業株式会社 シルフェニレン構造及びシロキサン構造を有する重合体およびその製造方法
JP5673496B2 (ja) * 2011-11-07 2015-02-18 信越化学工業株式会社 樹脂組成物、樹脂フィルム及び半導体装置とその製造方法
WO2014019195A1 (en) * 2012-08-02 2014-02-06 Henkel (China) Company Limited Curable compositions for LED encapsulants comprising a polycarbosilane and a hydrosilicone
EP2880082A4 (en) * 2012-08-02 2016-03-02 Henkel China Co Ltd POLYCARBOSILAN AND HARDENABLE COMPOSITIONS FOR LED PACKAGING THEREOF
CN104151835B (zh) * 2014-07-04 2017-01-04 江苏矽时代材料科技有限公司 一种主链含苯撑结构的有机硅组合物及其制备方法
KR102273099B1 (ko) * 2014-12-17 2021-07-06 주식회사 케이씨씨실리콘 실리콘 엘라스토머 조성물, 이를 이용하여 제조되는 실리콘 엘라스토머 및 실리콘 페이스트
CN106467668B (zh) * 2015-08-19 2021-07-30 广东生益科技股份有限公司 一种有机硅树脂铝基覆铜板及其制备方法
JP7388865B2 (ja) * 2019-10-08 2023-11-29 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び半導体装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1165533A (zh) * 1994-11-18 1997-11-19 罗纳布朗克化学公司 官能化聚硅氧烷及其制备方法
CN1180718A (zh) * 1996-10-24 1998-05-06 通用电气公司 制备自固化链烯基氢化硅氧烷共聚物和涂料组合物的方法
CN1247554A (zh) * 1996-12-20 2000-03-15 株式会社三键 有机聚硅氧烷组合物
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product

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NL131800C (enExample) * 1965-05-17
US4087585A (en) * 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPH0214244A (ja) * 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JP3029680B2 (ja) * 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
JP2001089662A (ja) * 1999-09-22 2001-04-03 Kanegafuchi Chem Ind Co Ltd 硬化性組成物及びそれを用いた成形体の作製方法
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
US7019100B2 (en) * 2003-04-23 2006-03-28 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition
DE60331893D1 (de) * 2003-05-09 2010-05-12 3M Espe Ag Aushärtbare Silikon-Abformmassen mit hoher Reissfestigkeit und geringer Konsistenz
JP2005089671A (ja) * 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1165533A (zh) * 1994-11-18 1997-11-19 罗纳布朗克化学公司 官能化聚硅氧烷及其制备方法
CN1180718A (zh) * 1996-10-24 1998-05-06 通用电气公司 制备自固化链烯基氢化硅氧烷共聚物和涂料组合物的方法
CN1247554A (zh) * 1996-12-20 2000-03-15 株式会社三键 有机聚硅氧烷组合物
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product

Also Published As

Publication number Publication date
JP4870681B2 (ja) 2012-02-08
CN101044209A (zh) 2007-09-26
US7687587B2 (en) 2010-03-30
KR101214825B1 (ko) 2012-12-24
EP1814952A1 (en) 2007-08-08
KR20070085392A (ko) 2007-08-27
DE602005016594D1 (enExample) 2009-10-22
US20070260082A1 (en) 2007-11-08
WO2006055231A1 (en) 2006-05-26
ATE442417T1 (de) 2009-09-15
JP2008520802A (ja) 2008-06-19
EP1814952B1 (en) 2009-09-09

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