KR101214825B1 - 실리콘 조성물 및 경화된 실리콘 수지 - Google Patents

실리콘 조성물 및 경화된 실리콘 수지 Download PDF

Info

Publication number
KR101214825B1
KR101214825B1 KR1020077011240A KR20077011240A KR101214825B1 KR 101214825 B1 KR101214825 B1 KR 101214825B1 KR 1020077011240 A KR1020077011240 A KR 1020077011240A KR 20077011240 A KR20077011240 A KR 20077011240A KR 101214825 B1 KR101214825 B1 KR 101214825B1
Authority
KR
South Korea
Prior art keywords
component
sio
viscosity
silicon
silicone composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077011240A
Other languages
English (en)
Korean (ko)
Other versions
KR20070085392A (ko
Inventor
마이클 앤드류 스미스
비중 주
Original Assignee
다우 코닝 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 코포레이션 filed Critical 다우 코닝 코포레이션
Publication of KR20070085392A publication Critical patent/KR20070085392A/ko
Application granted granted Critical
Publication of KR101214825B1 publication Critical patent/KR101214825B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
KR1020077011240A 2004-11-19 2005-11-01 실리콘 조성물 및 경화된 실리콘 수지 Expired - Fee Related KR101214825B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US62962004P 2004-11-19 2004-11-19
US60/629,620 2004-11-19
US65244205P 2005-02-11 2005-02-11
US60/652,442 2005-02-11

Publications (2)

Publication Number Publication Date
KR20070085392A KR20070085392A (ko) 2007-08-27
KR101214825B1 true KR101214825B1 (ko) 2012-12-24

Family

ID=36096236

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077011240A Expired - Fee Related KR101214825B1 (ko) 2004-11-19 2005-11-01 실리콘 조성물 및 경화된 실리콘 수지

Country Status (8)

Country Link
US (1) US7687587B2 (enExample)
EP (1) EP1814952B1 (enExample)
JP (1) JP4870681B2 (enExample)
KR (1) KR101214825B1 (enExample)
CN (1) CN101044209B (enExample)
AT (1) ATE442417T1 (enExample)
DE (1) DE602005016594D1 (enExample)
WO (1) WO2006055231A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160073591A (ko) * 2014-12-17 2016-06-27 주식회사 케이씨씨 실리콘 엘라스토머 조성물, 이를 이용하여 제조되는 실리콘 엘라스토머 및 실리콘 페이스트

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100273011A1 (en) * 1996-12-20 2010-10-28 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
WO2008079179A1 (en) 2006-12-20 2008-07-03 Dow Corning Corporation Glass substrates coated or laminated with cured silicone resin compositions
JP5091249B2 (ja) * 2006-12-20 2012-12-05 ダウ・コーニング・コーポレイション 多層の硬化シリコーン樹脂組成物で被覆またはラミネートされたガラス基板
JP2011518893A (ja) * 2008-03-04 2011-06-30 ダウ・コーニング・コーポレイション ボロシロキサン組成物、ボロシロキサン接着剤、塗装基板及び積層基板
JP2011516626A (ja) * 2008-03-04 2011-05-26 ダウ・コーニング・コーポレイション シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板
CN101531868B (zh) * 2008-03-14 2013-06-26 陶氏康宁公司 用于高固含量溶剂涂布方法的有机硅防粘涂料混合物
US20110045277A1 (en) * 2008-05-27 2011-02-24 Nathan Greer Adhesive Tape and Laminated Glass
TW201004795A (en) * 2008-07-31 2010-02-01 Dow Corning Laminated glass
JP5793824B2 (ja) * 2009-06-02 2015-10-14 Jnc株式会社 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
EP2573129B1 (en) * 2010-05-18 2016-08-17 JNC Corporation Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound
JP2014500897A (ja) 2010-11-09 2014-01-16 ダウ コーニング コーポレーション 有機リン酸化合物により可塑化されたヒドロシリル化硬化シリコーン樹脂
TWI435914B (zh) * 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
EP2706095B1 (en) 2011-05-04 2021-03-03 LG Chem, Ltd. Curable composition
JP5618903B2 (ja) * 2011-05-23 2014-11-05 信越化学工業株式会社 シルフェニレン構造及びシロキサン構造を有する重合体およびその製造方法
JP5673496B2 (ja) * 2011-11-07 2015-02-18 信越化学工業株式会社 樹脂組成物、樹脂フィルム及び半導体装置とその製造方法
WO2014019195A1 (en) * 2012-08-02 2014-02-06 Henkel (China) Company Limited Curable compositions for LED encapsulants comprising a polycarbosilane and a hydrosilicone
EP2880082A4 (en) * 2012-08-02 2016-03-02 Henkel China Co Ltd POLYCARBOSILAN AND HARDENABLE COMPOSITIONS FOR LED PACKAGING THEREOF
CN104151835B (zh) * 2014-07-04 2017-01-04 江苏矽时代材料科技有限公司 一种主链含苯撑结构的有机硅组合物及其制备方法
CN106467668B (zh) * 2015-08-19 2021-07-30 广东生益科技股份有限公司 一种有机硅树脂铝基覆铜板及其制备方法
JP7388865B2 (ja) * 2019-10-08 2023-11-29 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030171486A1 (en) 2002-03-05 2003-09-11 Zhongtao Li High fracture toughness hydrosilyation cured silicone resin

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL131800C (enExample) * 1965-05-17
US4087585A (en) * 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPH0214244A (ja) * 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JP3029680B2 (ja) * 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
FR2727119B1 (fr) * 1994-11-18 1997-01-03 Rhone Poulenc Chimie Polyorganosiloxanes fonctionnalises et l'un de leurs procedes de preparation
US5753751A (en) * 1996-10-24 1998-05-19 General Electric Company Process for preparing self-curable alkenyl hydride siloxane copolymers and coating composition
DE69711921T2 (de) * 1996-12-20 2002-11-07 Three Bond Co. Ltd., Hachioji Organopoysiloxanzusammensetzung
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
JP2001089662A (ja) * 1999-09-22 2001-04-03 Kanegafuchi Chem Ind Co Ltd 硬化性組成物及びそれを用いた成形体の作製方法
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
US7019100B2 (en) * 2003-04-23 2006-03-28 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition
DE60331893D1 (de) * 2003-05-09 2010-05-12 3M Espe Ag Aushärtbare Silikon-Abformmassen mit hoher Reissfestigkeit und geringer Konsistenz
JP2005089671A (ja) * 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030171486A1 (en) 2002-03-05 2003-09-11 Zhongtao Li High fracture toughness hydrosilyation cured silicone resin

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160073591A (ko) * 2014-12-17 2016-06-27 주식회사 케이씨씨 실리콘 엘라스토머 조성물, 이를 이용하여 제조되는 실리콘 엘라스토머 및 실리콘 페이스트
KR102273099B1 (ko) * 2014-12-17 2021-07-06 주식회사 케이씨씨실리콘 실리콘 엘라스토머 조성물, 이를 이용하여 제조되는 실리콘 엘라스토머 및 실리콘 페이스트

Also Published As

Publication number Publication date
JP4870681B2 (ja) 2012-02-08
CN101044209B (zh) 2011-01-19
CN101044209A (zh) 2007-09-26
US7687587B2 (en) 2010-03-30
EP1814952A1 (en) 2007-08-08
KR20070085392A (ko) 2007-08-27
DE602005016594D1 (enExample) 2009-10-22
US20070260082A1 (en) 2007-11-08
WO2006055231A1 (en) 2006-05-26
ATE442417T1 (de) 2009-09-15
JP2008520802A (ja) 2008-06-19
EP1814952B1 (en) 2009-09-09

Similar Documents

Publication Publication Date Title
KR101214825B1 (ko) 실리콘 조성물 및 경화된 실리콘 수지
US6509423B1 (en) Silicone composition and cured silicone product
EP0850998B1 (en) Method for making rubber-modified rigid silicone resins and composites produced therefrom
JP5627941B2 (ja) 光により架橋可能なシリコーン混合物からシリコーン被覆及びシリコーン成形品を製造する方法
EP2110401B1 (en) Addition-curable silicone composition and cured product thereof
EP2716717B1 (en) Silicone composition for sealing semiconductor
KR101802736B1 (ko) 가교결합성 실리콘 조성물 및 그의 가교결합 생성물
US20090246499A1 (en) Silicone Resin Film and Method of Preparing Same
KR20110004373A (ko) 경화성 오가노폴리실록산 조성물 및 이의 경화물
US9688819B2 (en) Silicone resin composition for optical semiconductors
US4631321A (en) Alkenyl organopolysiloxane and curable composition therefrom
KR101169264B1 (ko) 실리콘 수지와 에폭시 수지의 결합된 복합물 및 이의제조방법
EP3318593B1 (en) Heat dissipation material
EP0835918A2 (en) Flowable adhesive
EP1819775B1 (en) Organohydrogenpoly siloxane resin and silicon composition
KR20170129248A (ko) 유기폴리실록산, 이의 제조 방법, 및 경화성 실리콘 조성물
JP4553562B2 (ja) 接着性ポリオルガノシロキサン組成物
JP4485710B2 (ja) 分岐状オルガノポリシロキサンの製造方法
US20070142573A1 (en) Epoxy/silicone hybrid resin composition and cured part
JP2004323591A (ja) 熱硬化性シリコーンゴム組成物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20151218

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20151218

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000