CN101040061B - 细长的气体分配系统 - Google Patents

细长的气体分配系统 Download PDF

Info

Publication number
CN101040061B
CN101040061B CN2005800346371A CN200580034637A CN101040061B CN 101040061 B CN101040061 B CN 101040061B CN 2005800346371 A CN2005800346371 A CN 2005800346371A CN 200580034637 A CN200580034637 A CN 200580034637A CN 101040061 B CN101040061 B CN 101040061B
Authority
CN
China
Prior art keywords
lath
gas
gas distribution
distribution system
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005800346371A
Other languages
English (en)
Chinese (zh)
Other versions
CN101040061A (zh
Inventor
A·布隆迪尔
W·德博斯谢尔
P·戈德里斯
I·范德皮特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soleras Advanced Coatings BV
Original Assignee
Bekaert Advanced Coatings NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bekaert Advanced Coatings NV filed Critical Bekaert Advanced Coatings NV
Publication of CN101040061A publication Critical patent/CN101040061A/zh
Application granted granted Critical
Publication of CN101040061B publication Critical patent/CN101040061B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C23C14/0063—Reactive sputtering characterised by means for introducing or removing gases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
CN2005800346371A 2004-10-11 2005-10-04 细长的气体分配系统 Expired - Fee Related CN101040061B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP04104976.8 2004-10-11
EP04104976 2004-10-11
PCT/EP2005/054986 WO2006040275A1 (fr) 2004-10-11 2005-10-04 Systeme de distribution de gaz allonge

Publications (2)

Publication Number Publication Date
CN101040061A CN101040061A (zh) 2007-09-19
CN101040061B true CN101040061B (zh) 2011-07-06

Family

ID=34929690

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800346371A Expired - Fee Related CN101040061B (zh) 2004-10-11 2005-10-04 细长的气体分配系统

Country Status (4)

Country Link
EP (1) EP1807547A1 (fr)
JP (1) JP5046334B2 (fr)
CN (1) CN101040061B (fr)
WO (1) WO2006040275A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101292059A (zh) * 2005-10-17 2008-10-22 Oc欧瑞康巴尔斯公司 用于利用远程等离子体源的大面积等离子体增强化学气相沉积装置的清洗器具
WO2008113571A1 (fr) * 2007-03-20 2008-09-25 Leybold Optics Gmbh Système de répartition de gaz
DE102007026349A1 (de) * 2007-06-06 2008-12-11 Aixtron Ag Aus einer Vielzahl diffusionsverschweißter Scheiben bestehender Gasverteiler
US10138544B2 (en) 2011-06-27 2018-11-27 Soleras, LTd. Sputtering target
CN103205719B (zh) * 2012-01-17 2015-09-09 上海北玻镀膜技术工业有限公司 气体通道模块及应用其的气体分配装置
JP5862529B2 (ja) * 2012-09-25 2016-02-16 東京エレクトロン株式会社 基板処理装置及びガス供給装置
JP6170340B2 (ja) * 2013-05-21 2017-07-26 東京エレクトロン株式会社 ガス供給ヘッド、ガス供給機構及び基板処理装置
DE102014103740B4 (de) * 2014-01-09 2018-11-15 VON ARDENNE Asset GmbH & Co. KG Sputteranordnung und Sputter-Verfahren
JP6373708B2 (ja) * 2014-09-30 2018-08-15 株式会社Ｓｃｒｅｅｎホールディングス プラズマ処理装置およびプラズマ処理方法
CN107904573A (zh) * 2017-12-23 2018-04-13 夏禹纳米科技（深圳）有限公司 一种真空化学气相沉积设备中的新型反应控制喷淋装置
KR102451424B1 (ko) * 2020-07-14 2022-10-05 이창훈 롤투롤 플라즈마 생성 장치를 이용한 기재의 표면 세정 시스템 및 방법
CN113481469A (zh) * 2021-06-04 2021-10-08 广东铭丰包装材料有限公司 一种匀气机构及镀铝机

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4590042A (en) * 1984-12-24 1986-05-20 Tegal Corporation Plasma reactor having slotted manifold
US6444042B1 (en) * 1999-02-25 2002-09-03 Hyundai Electronics Industries Co., Ltd. Gas injection system for chemical vapor deposition device
CN1375575A (zh) * 2001-03-19 2002-10-23 株式会社Apex 化学气相沉积设备
US20020173078A1 (en) * 1999-07-26 2002-11-21 Yumiko Kawano Method and apparatus for manufacturing semiconductor device
EP1475824A1 (fr) * 2002-10-07 2004-11-10 Sekisui Chemical Co., Ltd. Systeme de formation de film par plasma

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5934231B2 (ja) * 1980-12-19 1984-08-21 旭硝子株式会社 Ｃｖｄ装置の吐出装置
JP2679073B2 (ja) * 1987-01-27 1997-11-19 旭硝子株式会社 常圧ｃｖｄ用ガス導入ノズル
JPS63190171A (ja) * 1987-02-03 1988-08-05 Asahi Glass Co Ltd 改良されたｃｖｄ用ガス導入ノズル
JPH0643631B2 (ja) * 1987-02-10 1994-06-08 旭硝子株式会社 常圧ｃｖｄ用ガス導入ノズル
CH687258A5 (de) * 1993-04-22 1996-10-31 Balzers Hochvakuum Gaseinlassanordnung.
US5906683A (en) * 1996-04-16 1999-05-25 Applied Materials, Inc. Lid assembly for semiconductor processing chamber
JP3871438B2 (ja) * 1997-06-06 2007-01-24 シーケーディ株式会社 プロセスガス供給ユニット
JP4570748B2 (ja) * 1999-08-24 2010-10-27 東京エレクトロン株式会社 ガス処理装置およびそれに用いられる集合バルブ
JP2002038274A (ja) * 2000-07-26 2002-02-06 Toppan Printing Co Ltd プラズマ処理装置
DE10211442A1 (de) * 2002-03-15 2003-09-25 Aixtron Ag Vorrichtung zum Abscheiden von dünnen Schichten auf einem Substrat

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4590042A (en) * 1984-12-24 1986-05-20 Tegal Corporation Plasma reactor having slotted manifold
US6444042B1 (en) * 1999-02-25 2002-09-03 Hyundai Electronics Industries Co., Ltd. Gas injection system for chemical vapor deposition device
US20020173078A1 (en) * 1999-07-26 2002-11-21 Yumiko Kawano Method and apparatus for manufacturing semiconductor device
CN1375575A (zh) * 2001-03-19 2002-10-23 株式会社Apex 化学气相沉积设备
EP1475824A1 (fr) * 2002-10-07 2004-11-10 Sekisui Chemical Co., Ltd. Systeme de formation de film par plasma

Also Published As

Publication number Publication date
EP1807547A1 (fr) 2007-07-18
JP5046334B2 (ja) 2012-10-10
WO2006040275A1 (fr) 2006-04-20
JP2008516084A (ja) 2008-05-15
CN101040061A (zh) 2007-09-19

Similar Documents

Publication Publication Date Title
CN101040061B (zh) 细长的气体分配系统
CN100334765C (zh) 流场板几何结构
EP1932937B1 (fr) Appareil de fabrication de pellicule, système de fabrication de pellicule, procédé de fabrication de pellicule, et procédé de fabrication d'un dispositif électronique ou d'un élément électroluminescent organique
EP1595974A3 (fr) Contrôle de l'uniformité de plasma par conception des orifices d'un diffuseur de gaz
EP1628324A3 (fr) Dispositif de pulvérisation magnétron
JP2010541241A5 (fr)
CN110629168B (zh) 一种真空镀膜机的蒸发装置
WO2005069922A2 (fr) Systeme de pile a combustible
US20160111257A1 (en) Substrate for mounting gas supply components and methods thereof
JPH05186873A (ja) キャップ形の素材をコーティングする装置およびユニット
CN203333750U (zh) 布气装置及其真空磁控溅射镀膜设备
KR20120104410A (ko) 인라인 코팅 장치
EP2220265A1 (fr) Appareil de revêtement sous vide par dpv
TW201720948A (zh) 基板處理設備
CN101781754A (zh) 一种模块化太阳能选择性涂层连续镀膜设备
CN104775102A (zh) 卷对卷磁控溅射阴极与柱状多弧源相结合的真空镀膜系统
KR101715192B1 (ko) 기판처리장치
CN100398691C (zh) 一种用于工模具表面强化的纳米多层镀膜装置
CN106893988A (zh) 一种真空镀膜用布气系统
CN2443972Y (zh) 中频反应溅射镀膜设备中反应气体的供气装置
CN101538701A (zh) 一种中频直流复合磁控溅射装置
CN204644456U (zh) 卷对卷磁控溅射阴极与柱状多弧源相结合的真空镀膜设备
CN210945766U (zh) 一种燃料电池双极板碳涂层的多腔体沉积系统
CN200996041Y (zh) 多段式反应溅射气体进气装置
CN217110362U (zh) 一种表面金属处理后节能型干燥装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: SOLERAS ADVANCED COATINGS NV

Free format text: FORMER NAME: BEKAERT ADVANCED COATINGS

CP01 Change in the name or title of a patent holder

Address after: Belgium Denzel

Patentee after: Bekaert Advanced Coatings

Address before: Belgium Denzel

Patentee before: Bekaert Advanced Coatings

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110706

Termination date: 20161004