CN100559239C - 压力接合装置与压力接合方法 - Google Patents
压力接合装置与压力接合方法 Download PDFInfo
- Publication number
- CN100559239C CN100559239C CNB2006101362062A CN200610136206A CN100559239C CN 100559239 C CN100559239 C CN 100559239C CN B2006101362062 A CNB2006101362062 A CN B2006101362062A CN 200610136206 A CN200610136206 A CN 200610136206A CN 100559239 C CN100559239 C CN 100559239C
- Authority
- CN
- China
- Prior art keywords
- thermistor
- joined
- press
- bonding apparatus
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91421—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the joining tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91431—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature the temperature being kept constant over time
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/824—Actuating mechanisms
- B29C66/8242—Pneumatic or hydraulic drives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005297982A JP2007109813A (ja) | 2005-10-12 | 2005-10-12 | 表示装置の製造装置 |
JP2005297982 | 2005-10-12 | ||
JP2005305694 | 2005-10-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1949042A CN1949042A (zh) | 2007-04-18 |
CN100559239C true CN100559239C (zh) | 2009-11-11 |
Family
ID=38018606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101362062A Active CN100559239C (zh) | 2005-10-12 | 2006-10-11 | 压力接合装置与压力接合方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007109813A (zh) |
CN (1) | CN100559239C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103429005A (zh) * | 2012-05-14 | 2013-12-04 | 三星显示有限公司 | 用于显示装置的结合设备和方法 |
CN104246998A (zh) * | 2012-06-06 | 2014-12-24 | 夏普株式会社 | 部件压接装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4958817B2 (ja) * | 2008-03-07 | 2012-06-20 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置 |
GB2525605B (en) * | 2014-04-28 | 2018-10-24 | Flexenable Ltd | Method of bonding flexible printed circuits |
WO2019175934A1 (ja) * | 2018-03-12 | 2019-09-19 | 堺ディスプレイプロダクト株式会社 | 熱圧着装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04348540A (ja) * | 1991-05-27 | 1992-12-03 | Sony Corp | フリップチップボンダー |
JP2000269267A (ja) * | 1999-03-16 | 2000-09-29 | Nec Corp | 電子部品実装方法及び装置 |
JP2001332585A (ja) * | 2000-05-23 | 2001-11-30 | Toray Eng Co Ltd | チップ本圧着方法及びその装置 |
JP2002217231A (ja) * | 2001-01-22 | 2002-08-02 | Matsushita Electric Ind Co Ltd | 接合装置および方法 |
JP2005268400A (ja) * | 2004-03-17 | 2005-09-29 | Matsushita Electric Ind Co Ltd | 半導体装置の接合装置 |
-
2005
- 2005-10-12 JP JP2005297982A patent/JP2007109813A/ja active Pending
-
2006
- 2006-10-11 CN CNB2006101362062A patent/CN100559239C/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103429005A (zh) * | 2012-05-14 | 2013-12-04 | 三星显示有限公司 | 用于显示装置的结合设备和方法 |
CN103429005B (zh) * | 2012-05-14 | 2018-07-13 | 三星显示有限公司 | 用于显示装置的结合设备和方法 |
CN104246998A (zh) * | 2012-06-06 | 2014-12-24 | 夏普株式会社 | 部件压接装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1949042A (zh) | 2007-04-18 |
JP2007109813A (ja) | 2007-04-26 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: TOSHIBA SOLUTIONS CORP |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: TOSHIBA MOBILE DISPLAY CO., LTD. Free format text: FORMER NAME: TOSHIBA MATSUSHITA DISPLAY TECHNOLOGY LTD. |
|
CP03 | Change of name, title or address |
Address after: Saitama Co-patentee after: TOSHIBA SOLUTIONS Corp. Patentee after: Toshiba Mobile Display Co.,Ltd. Address before: Tokyo, Japan Co-patentee before: TOSHIBA SOLUTIONS Corp. Patentee before: TOSHIBA MATSUSHITA DISPLAY TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20101110 Address after: Saitama Patentee after: Toshiba Mobile Display Co.,Ltd. Address before: Saitama Co-patentee before: TOSHIBA SOLUTIONS Corp. Patentee before: Toshiba Mobile Display Co.,Ltd. |
|
C56 | Change in the name or address of the patentee |
Owner name: JAPAN DISPLAY MIDDLE INC. Free format text: FORMER NAME: TOSHIBA MOBILE DISPLAY CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Saitama Prefecture, Japan Patentee after: JAPAN DISPLAY Inc. Address before: Saitama Patentee before: Toshiba Mobile Display Co.,Ltd. |